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公开(公告)号：US20180047452A1
公开(公告)日：2018-02-15
申请号：US15796193
申请日：2017-10-27
Applicant: Renesas Electronics Corporation
Inventor： Toshihiro TANAKA , Yukiko UMEMOTO , Mitsuru HIRAKI , Yutaka SHINAGAWA , Masamichi FUJITO , Kazufumi SUZUKAWA , Hiroyuki TANIKAWA , Takashi YAMAKI , Yoshiaki KAMIGAKI , Shinichi MINAMI , Kozo KATAYAMA , Nozomu MATSUZAKI
IPC: G11C16/26 , G11C5/02 , H01L29/792
CPC classification number: G11C16/26 , G11C5/025 , G11C8/08 , G11C16/04 , G11C16/0425 , G11C16/0433 , G11C16/08 , G11C16/24 , G11C16/30 , H01L21/28 , H01L21/28273 , H01L27/105 , H01L27/115 , H01L27/11521 , H01L27/11526 , H01L27/11546 , H01L29/42328 , H01L29/42332 , H01L29/4234 , H01L29/66825 , H01L29/7885 , H01L29/792
Abstract: A semiconductor device includes a plurality of nonvolatile memory cells (1). Each of the nonvolatile memory cells comprises a MOS type first transistor section (3) used for information storage, and a MOS type second transistor section (4) which selects the first transistor section. The second transistor section has a bit line electrode (16) connected to a bit line, and a control gate electrode (18) connected to a control gate control line. The first transistor section has a source line electrode (10) connected to a source line, a memory gate electrode (14) connected to a memory gate control line, and a charge storage region (11) disposed directly below the memory gate electrode. A gate withstand voltage of the second transistor section is lower than that of the first transistor section. Assuming that the thickness of a gate insulating film of the second transistor section is defined as tc and the thickness of a gate insulating film of the first transistor section is defined as tm, they have a relationship of tc
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2.发明申请公开(公告)号：US20150221664A1
公开(公告)日：2015-08-06
申请号：US14685093
申请日：2015-04-13
Applicant: Renesas Electronics Corporation
Inventor： Digh HISAMOTO , Shinichiro KIMURA , Kan YASUI , Nozomu MATSUZAKI
IPC: H01L27/115
CPC classification number: H01L27/11531 , H01L21/28282 , H01L27/115 , H01L27/11526 , H01L27/11546 , H01L27/11568 , H01L29/42344 , H01L29/792
Abstract: A non-volatile semiconductor memory device with good write/erase characteristics is provided. A selection gate is formed on a p-type well of a semiconductor substrate via a gate insulator, and a memory gate is formed on the p-type well via a laminated film composed of a silicon oxide film, a silicon nitride film, and a silicon oxide film. The memory gate is adjacent to the selection gate via the laminated film. In the regions on both sides of the selection gate and the memory gate in the p-type well, n-type impurity diffusion layers serving as the source and drain are formed. The region controlled by the selection gate and the region controlled by the memory gate located in the channel region between said impurity diffusion layers have the different charge densities of the impurity from each other.
Abstract translation: 提供具有良好写入/擦除特性的非易失性半导体存储器件。 通过栅极绝缘体在半导体衬底的p型阱上形成选择栅极，并且通过由氧化硅膜，氮化硅膜和氮化硅膜构成的层叠膜在p型阱上形成存储栅极 氧化硅膜。 存储器栅极通过层叠膜与选择栅极相邻。 在p型阱中的选择栅极和存储栅极的两侧的区域中，形成用作源极和漏极的n型杂质扩散层。 由选择栅极控制的区域和由位于所述杂质扩散层之间的沟道区域中的存储栅极控制的区域具有彼此不同的杂质的电荷密度。
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公开(公告)号：US20140241051A1
公开(公告)日：2014-08-28
申请号：US14269173
申请日：2014-05-04
Applicant: RENESAS ELECTRONICS CORPORATION
Inventor： Satoru HANZAWA , Fumihiko NITTA , Nozomu MATSUZAKI , Toshihiro TANAKA
CPC classification number: G11C5/06 , G11C13/0004 , G11C13/003 , G11C13/0069 , G11C2213/74 , G11C2213/79 , H01L27/2436 , H01L27/2463 , H01L45/06 , H01L45/1233 , H01L45/141 , H01L45/144
Abstract: In a semiconductor device including a memory cell array formed of memory cells using a storage element by a variable resistor and a select transistor, a buffer cell is arranged between a sense amplifier and the memory cell array and between a word driver and the memory cell array. The resistive storage element in the memory cell is connected to a bit-line via a contact formed above the resistive storage element. Meanwhile, in the buffer cell, the contact is not formed above the resistive storage element, and a state of being covered with an insulator is kept upon processing the contact in the memory cell. By such a processing method, exposure and sublimation of a chalcogenide film used in the resistive storage element can be avoided.
Abstract translation: 在包括由可变电阻器使用存储元件的存储器单元和选择晶体管形成的存储单元阵列的半导体器件中，缓冲单元布置在读出放大器和存储单元阵列之间以及字驱动器和存储单元阵列之间 。 存储单元中的电阻存储元件通过形成在电阻存储元件上方的触点连接到位线。 同时，在缓冲单元中，电阻性存储元件之上不形成接触，并且在处理存储单元中的接触时保持被绝缘体覆盖的状态。 通过这种处理方法，可以避免在电阻存储元件中使用的硫族化物膜的曝光和升华。
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公开(公告)号：US20180374542A1
公开(公告)日：2018-12-27
申请号：US16116893
申请日：2018-08-29
Applicant: Renesas Electronics Corporation
Inventor： Toshihiro TANAKA , Yukiko UMEMOTO , Mitsuru HIRAKI , Yutaka SHINAGAWA , Masamichi FUJITO , Kazufumi SUZUKAWA , Hiroyuki TANIKAWA , Takashi YAMAKI , Yoshiaki KAMIGAKI , Shinichi MINAMI , Kozo KATAYAMA , Nozomu MATSUZAKI
IPC: G11C16/26 , G11C16/30 , G11C16/04 , G11C8/08 , G11C5/02 , H01L21/28 , G11C16/24 , H01L29/792 , H01L29/788 , H01L29/66 , H01L29/423 , H01L27/11546 , H01L27/11526 , H01L27/11521 , H01L27/115 , H01L27/105 , G11C16/08
CPC classification number: G11C16/26 , G11C5/025 , G11C8/08 , G11C16/04 , G11C16/0425 , G11C16/0433 , G11C16/08 , G11C16/24 , G11C16/30 , H01L21/28 , H01L21/28273 , H01L27/105 , H01L27/115 , H01L27/11521 , H01L27/11526 , H01L27/11546 , H01L29/42328 , H01L29/42332 , H01L29/4234 , H01L29/66825 , H01L29/7885 , H01L29/792
Abstract: A semiconductor device includes a plurality of nonvolatile memory cells (1). Each of the nonvolatile memory cells comprises a MOS type first transistor section (3) used for information storage, and a MOS type second transistor section (4) which selects the first transistor section. The second transistor section has a bit line electrode (16) connected to a bit line, and a control gate electrode (18) connected to a control gate control line. The first transistor section has a source line electrode (10) connected to a source line, a memory gate electrode (14) connected to a memory gate control line, and a charge storage region (11) disposed directly below the memory gate electrode. A gate withstand voltage of the second transistor section is lower than that of the first transistor section. Assuming that the thickness of a gate insulating film of the second transistor section is defined as tc and the thickness of a gate insulating film of the first transistor section is defined as tm, they have a relationship of tc
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公开(公告)号：US20160197091A1
公开(公告)日：2016-07-07
申请号：US15067444
申请日：2016-03-11
Applicant: RENESAS ELECTRONICS CORPORATION
Inventor： Digh HISAMOTO , Shinichiro KIMURA , Kan YASUI , Nozomu MATSUZAKI
IPC: H01L27/115
CPC classification number: H01L27/11531 , H01L21/28282 , H01L27/115 , H01L27/11526 , H01L27/11546 , H01L27/11568 , H01L29/42344 , H01L29/792
Abstract: A non-volatile semiconductor memory device with good write/erase characteristics is provided. A selection gate is formed on a p-type well of a semiconductor substrate via a gate insulator, and a memory gate is formed on the p-type well via a laminated film composed of a silicon oxide film, a silicon nitride film, and a silicon oxide film. The memory gate is adjacent to the selection gate via the laminated film. In the regions on both sides of the selection gate and the memory gate in the p-type well, n-type impurity diffusion layers serving as the source and drain are formed. The region controlled by the selection gate and the region controlled by the memory gate located in the channel region between said impurity diffusion layers have the different charge densities of the impurity from each other.
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Patent Agency Ranking
6.发明申请METHOD OF FORMING A CMOS STRUCTURE HAVING GATE INSULATION FILMS OF DIFFERENT THICKNESSES 有权形成具有不同厚度的门绝缘膜的CMOS结构的方法公开(公告)号：US20140252495A1
公开(公告)日：2014-09-11
申请号：US14176328
申请日：2014-02-10
Applicant: RENESAS ELECTRONICS CORPORATION
Inventor： Nozomu MATSUZAKI , Hiroyuki MIZUNO , Masashi HORIGUCHI
IPC: H01L27/088 , H01L29/423
CPC classification number: H01L21/823857 , B82Y99/00 , H01L21/82345 , H01L21/823462 , H01L21/823468 , H01L21/82385 , H01L27/088 , H01L27/0883 , H01L29/42364 , Y10S438/981 , Y10S977/936
Abstract: The semiconductor integrated circuit device employs on the same silicon substrate a plurality of kinds of MOS transistors with different magnitudes of tunnel current flowing either between the source and gate or between the drain and gate thereof. These MOS transistors include tunnel-current increased MOS transistors at least one of which is for use in constituting a main circuit of the device. The plurality of kinds of MOS transistors also include tunnel-current reduced or depleted MOS transistors at least one of which is for use with a control circuit. This control circuit is inserted between the main circuit and at least one of the two power supply units.
Abstract translation: 半导体集成电路器件在相同的硅衬底上采用具有在源极和栅极之间或其漏极和栅极之间流动的不同大小的隧道电流的多种MOS晶体管。 这些MOS晶体管包括隧道电流增加的MOS晶体管，其中至少一个用于构成器件的主电路。 多种MOS晶体管还包括隧道电流减少或耗尽的MOS晶体管，其中至少一个用于控制电路。 该控制电路插入在主电路和两个电源单元中的至少一个之间。
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公开(公告)号：US20130235668A1
公开(公告)日：2013-09-12
申请号：US13867055
申请日：2013-04-20
Inventor： Toshihiro TANAKA , Yukiko UMEMOTO , Mitsuru HIRAKI , Yutaka SHINAGAWA , Masamichi FUJITO , Kazufumi SUZUKAWA , Hiroyuki TANIKAWA , Takashi YAMAKI , Yoshiaki KAMIGAKI , Shinichi MINAMI , Kozo KATAYAMA , Nozomu MATSUZAKI
CPC classification number: G11C16/26 , G11C5/025 , G11C8/08 , G11C16/04 , G11C16/0425 , G11C16/0433 , G11C16/08 , G11C16/24 , G11C16/30 , H01L21/28 , H01L21/28273 , H01L27/105 , H01L27/115 , H01L27/11521 , H01L27/11526 , H01L27/11546 , H01L29/42328 , H01L29/42332 , H01L29/4234 , H01L29/66825 , H01L29/7885 , H01L29/792
Abstract: A semiconductor device includes a plurality of nonvolatile memory cells (1). Each of the nonvolatile memory cells comprises a MOS type first transistor section (3) used for information storage, and a MOS type second transistor section (4) which selects the first transistor section. The second transistor section has a bit line electrode (16) connected to a bit line, and a control gate electrode (18) connected to a control gate control line. The first transistor section has a source line electrode (10) connected to a source line, a memory gate electrode (14) connected to a memory gate control line, and a charge storage region (11) disposed directly below the memory gate electrode. A gate withstand voltage of the second transistor section is lower than that of the first transistor section. Assuming that the thickness of a gate insulating film of the second transistor section is defined as tc and the thickness of a gate insulating film of the first transistor section is defined as tm, they have a relationship of tc
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公开(公告)号：US20160336074A1
公开(公告)日：2016-11-17
申请号：US15224669
申请日：2016-08-01
Applicant: Renesas Electronics Corporation
Inventor： Toshihiro TANAKA , Yukiko UMEMOTO , Mitsuru HIRAKI , Yutaka SHINAGAWA , Masamichi FUJITO , Kazufumi SUZUKAWA , Hiroyuki TANIKAWA , Takashi YAMAKI , Yoshiaki KAMIGAKI , Shinichi MINAMI , Kozo KATAYAMA , Nozomu MATSUZAKI
IPC: G11C16/26 , H01L27/115 , H01L21/28 , G11C16/04 , G11C16/24
CPC classification number: G11C16/26 , G11C5/025 , G11C8/08 , G11C16/04 , G11C16/0425 , G11C16/0433 , G11C16/08 , G11C16/24 , G11C16/30 , H01L21/28 , H01L21/28273 , H01L27/105 , H01L27/115 , H01L27/11521 , H01L27/11526 , H01L27/11546 , H01L29/42328 , H01L29/42332 , H01L29/4234 , H01L29/66825 , H01L29/7885 , H01L29/792
Abstract: A semiconductor device includes a plurality of nonvolatile memory cells (1). Each of the nonvolatile memory cells comprises a MOS type first transistor section (3) used for information storage, and a MOS type second transistor section (4) which selects the first transistor section. The second transistor section has a bit line electrode (16) connected to a bit line, and a control gate electrode (18) connected to a control gate control line. The first transistor section has a source line electrode (10) connected to a source line, a memory gate electrode (14) connected to a memory gate control line, and a charge storage region (11) disposed directly below the memory gate electrode. A gate withstand voltage of the second transistor section is lower than that of the first transistor section. Assuming that the thickness of a gate insulating film of the second transistor section is defined as tc and the thickness of a gate insulating film of the first transistor section is defined as tm, they have a relationship of tc
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公开(公告)号：US20140198577A1
公开(公告)日：2014-07-17
申请号：US14214969
申请日：2014-03-16
Inventor： Toshihiro TANAKA , Yukiko UMEMOTO , Mitsuru HIRAKI , Yutaka SHINAGAWA , Masamichi FUJITO , Kazufumi SUZUKAWA , Hiroyuki TANIKAWA , Takashi YAMAKI , Yoshiaki KAMIGAKI , Shinichi MINAMI , Kozo KATAYAMA , Nozomu MATSUZAKI
IPC: G11C16/26
CPC classification number: G11C16/26 , G11C5/025 , G11C8/08 , G11C16/04 , G11C16/0425 , G11C16/0433 , G11C16/08 , G11C16/24 , G11C16/30 , H01L21/28 , H01L21/28273 , H01L27/105 , H01L27/115 , H01L27/11521 , H01L27/11526 , H01L27/11546 , H01L29/42328 , H01L29/42332 , H01L29/4234 , H01L29/66825 , H01L29/7885 , H01L29/792
Abstract: A semiconductor device includes a plurality of nonvolatile memory cells (1). Each of the nonvolatile memory cells comprises a MOS type first transistor section (3) used for information storage, and a MOS type second transistor section (4) which selects the first transistor section. The second transistor section has a bit line electrode (16) connected to a bit line, and a control gate electrode (18) connected to a control gate control line. The first transistor section has a source line electrode (10) connected to a source line, a memory gate electrode (14) connected to a memory gate control line, and a charge storage region (11) disposed directly below the memory gate electrode. A gate withstand voltage of the second transistor section is lower than that of the first transistor section. Assuming that the thickness of a gate insulating film of the second transistor section is defined as tc and the thickness of a gate insulating film of the first transistor section is defined as tm, they have a relationship of tc
Abstract translation: 半导体器件包括多个非易失性存储单元（1）。 每个非易失性存储单元包括用于信息存储的MOS型第一晶体管部分（3）和选择第一晶体管部分的MOS型第二晶体管部分（4）。 第二晶体管部分具有连接到位线的位线电极（16）和连接到控制栅极控制线的控制栅电极（18）。 第一晶体管部分具有连接到源极线的源极线电极（10），连接到存储器栅极控制线的存储栅电极（14）和直接位于存储栅电极下方的电荷存储区域（11）。 第二晶体管部分的栅极耐受电压低于第一晶体管部分的栅极耐受电压。 假设第二晶体管部分的栅极绝缘膜的厚度被定义为tc，并且第一晶体管部分的栅极绝缘膜的厚度被定义为tm，它们具有tc
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公开(公告)号：US20130277635A1
公开(公告)日：2013-10-24
申请号：US13927073
申请日：2013-06-25
Applicant: Renesas Electronics Corporation
Inventor： Satoru HANZAWA , Fumihiko NITTA , Nozomu MATSUZAKI , Toshihiro TANAKA
IPC: H01L45/00
CPC classification number: G11C5/06 , G11C13/0004 , G11C13/003 , G11C13/0069 , G11C2213/74 , G11C2213/79 , H01L27/2436 , H01L27/2463 , H01L45/06 , H01L45/1233 , H01L45/141 , H01L45/144
Abstract: In a semiconductor device including a memory cell array formed of memory cells using a storage element by a variable resistor and a select transistor, a buffer cell is arranged between a sense amplifier and the memory cell array and between a word driver and the memory cell array. The resistive storage element in the memory cell is connected to a bit-line via a contact formed above the resistive storage element. Meanwhile, in the buffer cell, the contact is not formed above the resistive storage element, and a state of being covered with an insulator is kept upon processing the contact in the memory cell. By such a processing method, exposure and sublimation of a chalcogenide film used in the resistive storage element can be avoided.
Abstract translation: 在包括由可变电阻器使用存储元件的存储器单元和选择晶体管形成的存储单元阵列的半导体器件中，缓冲单元布置在读出放大器和存储单元阵列之间以及字驱动器和存储单元阵列之间 。 存储单元中的电阻存储元件通过形成在电阻存储元件上方的触点连接到位线。 同时，在缓冲单元中，电阻性存储元件之上不形成接触，并且在处理存储单元中的接触时保持被绝缘体覆盖的状态。 通过这种处理方法，可以避免在电阻存储元件中使用的硫族化物膜的曝光和升华。
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