Abstract:
The invention is intended for rendering a CMOS camera compact and less costly. A semiconductor device constituting a CMOS camera system includes a lens unit which includes a wiring board having an image pick-up opening formed therein and a lens, and the lens is provided on one side of the wiring board and positioned opposite the image pick-up opening. An image pick-up semiconductor is provided on the other side of the wiring board, and is positioned opposite the image pick-up opening, and is connected to a connection section of the wiring board by means of flip-chip bonding. An image processing semiconductor is connected by means of flip-chip bonding to another connection section provided on the other side of the wiring board, and processes an image signal output from the image pick-up semiconductor.
Abstract:
A plurality of semiconductor chips are mounted on an insulating substrate with bumps and through use of dielectric resin for mounting purposes. The semiconductor chips are sealed with transfer mold resin through a single operation while remaining on the insulating substrate. Then, the plurality of semiconductor chips are separated together with the insulating substrate and the mounting resin into individual semiconductor devices. The productivity and reliability of packaged semiconductor devices is improved.
Abstract:
An insulating resin sheet made from a thermosetting resin is provided on an insulating substrate in such a manner as to cover bonding pads provided on the insulating substrate. A lower chip is set on the insulating substrate in such a manner that bonding bumps connected to inner connection terminals of the lower chip break the insulating resin sheet 24 to be in contact with the bonding pads. The insulating resin sheet is thermally cured and subsequently the bonding bumps are melted.
Abstract:
A semiconductor device allowing a mounting of a semiconductor substrate with narrow electrode pad interval on an insulated circuit board while securing a favorable insulation characteristic and a manufacturing method thereof are obtained. The semiconductor device includes an electrode pad formed on a semiconductor substrate; a connecting underlying metal film connected to the electrode pad; a connecting conductor establishing electrical conduction between the connecting underlying metal film and a terminal electrode on an insulated circuit board; and non-conductive resin surrounding the connecting conductor and filling a gap between the substrate and the insulated circuit board. Here, the connecting underlying metal film is not covered by the connecting conductor at least in a peripheral region including an outer peripheral portion thereof
Abstract:
Reliability of a semiconductor device is improved. In a flatness inspection of BGA (semiconductor device), there is formed a flatness standard where a permissible range in the direction of (+) of flatness at normal temperature is smaller than a permissible range in the direction of (−). With use of the above flatness standard, a flatness inspection of the semiconductor device at normal temperature is performed to determine whether the mounted item is non-defective or defective. With the above process, defective mounting caused by a package warp when heated during reflow soldering etc. is reduced and reliability of BGA is improved. At the same time, flatness management of a substrate-type semiconductor device with better consideration of a mounting state can be performed.
Abstract:
An exhaust gas treatment device for preventing a large quantity of unburned HC components from being released to the outside until a diesel oxidation catalyst reaches an activation temperature after early post-injection. By reducing a throttle opening of a variable throttle mechanism (77) provided in an oil passage (72), or increasing a set value of an oil pressure level detected in an oil pressure sensor (78) provided on the downstream side of the variable throttle mechanism, power of an oil circulation pump (74) is increased before a start point t1 of the early post-injection. With this arrangement, by increasing a load of a diesel engine to increase a temperature rise gradient of exhaust gas at the stage of increasing the temperature of the diesel oxidation catalyst, the unburned HC component released until the diesel oxidation catalyst reaches the activation temperature is reduced.
Abstract:
An image processing apparatus capable of improving the usability in search by, for a person presumed to be difficult to be misidentified, improving the frequency of identifying the person. When calculated degree of similarity is equal to or greater than a threshold, it is identified that a face of the person corresponds to a face of any one of registered persons. The threshold is set to a second value greater than a first value, for the face of one of the registered persons who has not been identified when starting recording of the image, and the threshold is set to a third value between the first value and the second value, for the face of one of the registered persons who is already identified when starting the recording of the image, after the recording of the shot image to the nonvolatile recording medium is started.
Abstract:
An object is to prevent a large quantity of unburned HC components from being released to the outside until a diesel oxidation catalyst reaches an activation temperature after early post-injection. In the present invention, by reducing a throttle opening of a variable throttle mechanism 77 provided in an oil passage 72, or increasing a set value of an oil pressure level detected in an oil pressure sensor 78 provided on the downstream side of the variable throttle mechanism 77, power of an oil circulation pump 74 is increased before a start point t1 of the early post-injection. With this arrangement, by increasing a load of a diesel engine 10 to increase a temperature rise gradient of exhaust gas at the stage of increasing the temperature of the diesel oxidation catalyst, the unburned HC component released until the diesel oxidation catalyst 50 reaches the activation temperature is reduced.
Abstract:
An apparatus for rotating a substrate having a center hole, comprises a pickup member configured to hold the substrate by holding an edge of the center hole, and a driving unit configured to drive the pickup member, wherein the driving unit is configured to insert the pickup member into the center hole so as not to bring the pickup member into contact with the substrate, to drive the pickup member upward so that the pickup member holds the edge of the center hole from below, and thereupon to rotate the pickup member so as to rotate the substrate, and in rotating the substrate, the driving unit rotates the pickup member about a rotation axis which is perpendicular to a principal surface of the substrate and passes through the center of the substrate.
Abstract:
A thermal paper sheet having heat-sensitive layers on a first surface and a second surface having a front-and-rear relationship is prepared. A first thermal head which comes into contact with a front surface of this thermal paper sheet and a second thermal head which comes into contact with a rear surface 1b of the same are provided. Further, printing data input from the outside is divided into first printing data and second printing data. The thermal heads are driven in accordance with the printing data.