公开(公告)号：US20110039375A1

公开(公告)日：2011-02-17

申请号：US12853817

申请日：2010-08-10

Applicant: Kazuyuki Nakagawa ,  Shinji Baba ,  Satoshi Yamada ,  Takashi Karashima

Inventor： Kazuyuki Nakagawa ,  Shinji Baba ,  Satoshi Yamada ,  Takashi Karashima

IPC: H01L21/60

CPC classification number: H05K3/3484 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75743 ,  H01L2224/81009 ,  H01L2224/81011 ,  H01L2224/8102 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/8191 ,  H01L2224/83907 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/351 ,  H05K3/4007 ,  H05K2201/10674 ,  H05K2203/0415 ,  H05K2203/043 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012

Abstract: To aim at improvement of reliability of a semiconductor device of flip chip connection type.In assembling a BGA of flip chip connection type, when a semiconductor chip is solder-connected by a flip chip connection, because solder precoat is formed on the surface of a land on the side of an undersurface of a wiring substrate, the connection between the land and a solder ball, which is an external terminal, is solder-connection, and therefore, it is possible to increase impact resistance of a connection part between the land and the solder ball and to aim at improvement of reliability of the BGA.

Abstract translation: 旨在提高倒装芯片连接类型的半导体器件的可靠性。 在组装倒装芯片连接型的BGA时，当通过倒装芯片连接来焊接半导体芯片时，由于在布线基板的下表面侧的焊盘表面上形成焊料预涂层，所以在 作为外部端子的焊盘和焊球是焊接连接的，因此可以提高焊盘和焊球之间的连接部件的耐冲击性，并且旨在提高BGA的可靠性。

公开(公告)号：USD590185S1

公开(公告)日：2009-04-14

申请号：US29306806

申请日：2008-04-16

Applicant: Takashi Karashima

Designer： Takashi Karashima

公开(公告)号：USD584545S1

公开(公告)日：2009-01-13

申请号：US29306808

申请日：2008-04-16

Applicant: Takashi Karashima ,  Hidetaka Sekikawa

Designer： Takashi Karashima ,  Hidetaka Sekikawa

公开(公告)号：US08605277B2

公开(公告)日：2013-12-10

申请号：US13244434

申请日：2011-09-24

Applicant: Satoshi Yamada ,  Takashi Karashima ,  Kenya Hironaga ,  Masatoshi Yasunaga ,  Yuji Fujimoto

Inventor： Satoshi Yamada ,  Takashi Karashima ,  Kenya Hironaga ,  Masatoshi Yasunaga ,  Yuji Fujimoto

IPC: G01N21/00

CPC classification number: G01N21/95684 ,  G01B11/306 ,  G01N21/93 ,  H01L23/3128 ,  H01L2224/48227 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01L2924/00

Abstract: Reliability of a semiconductor device is improved. In a flatness inspection of BGA (semiconductor device), there is formed a flatness standard where a permissible range in the direction of (+) of flatness at normal temperature is smaller than a permissible range in the direction of (−). With use of the above flatness standard, a flatness inspection of the semiconductor device at normal temperature is performed to determine whether the mounted item is non-defective or defective. With the above process, defective mounting caused by a package warp when heated during reflow soldering etc. is reduced and reliability of BGA is improved. At the same time, flatness management of a substrate-type semiconductor device with better consideration of a mounting state can be performed.

Abstract translation: 提高了半导体器件的可靠性。 在BGA（半导体器件）的平坦度检查中，形成了平坦度标准，其中常温平面度（+）方向上的允许范围小于（ - ）方向的允许范围。 使用上述平面度标准，进行半导体器件在常温下的平坦度检查，以确定安装的物品是否是有缺陷的或有缺陷的。 通过上述处理，在回流焊接等期间加热时由包装翘曲引起的安装不良导致BGA的可靠性提高。 同时，可以进行更好地考虑安装状态的基板型半导体器件的平坦度管理。

公开(公告)号：US20120081702A1

公开(公告)日：2012-04-05

申请号：US13244434

申请日：2011-09-24

Applicant: Satoshi YAMADA ,  Takashi KARASHIMA ,  Kenya HIRONAGA ,  Masatoshi YASUNAGA ,  Yuji FUJIMOTO

Inventor： Satoshi YAMADA ,  Takashi KARASHIMA ,  Kenya HIRONAGA ,  Masatoshi YASUNAGA ,  Yuji FUJIMOTO

IPC: G01N21/00

CPC classification number: G01N21/95684 ,  G01B11/306 ,  G01N21/93 ,  H01L23/3128 ,  H01L2224/48227 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01L2924/00

Abstract: Reliability of a semiconductor device is improved. In a flatness inspection of BGA (semiconductor device), there is formed a flatness standard where a permissible range in the direction of (+) of flatness at normal temperature is smaller than a permissible range in the direction of (−). With use of the above flatness standard, a flatness inspection of the semiconductor device at normal temperature is performed to determine whether the mounted item is non-defective or defective. With the above process, defective mounting caused by a package warp when heated during reflow soldering etc. is reduced and reliability of BGA is improved. At the same time, flatness management of a substrate-type semiconductor device with better consideration of a mounting state can be performed.

Abstract translation: 提高了半导体器件的可靠性。 在BGA（半导体器件）的平坦度检查中，形成了平坦度标准，其中常温平面度（+）方向上的允许范围小于（ - ）方向的允许范围。 使用上述平面度标准，进行半导体器件在常温下的平坦度检查，以确定安装的物品是否是有缺陷的或有缺陷的。 通过上述处理，在回流焊接等期间加热时由包装翘曲引起的安装不良导致BGA的可靠性提高。 同时，可以进行更好地考虑安装状态的基板型半导体器件的平坦度管理。

公开(公告)号：US08580620B2

公开(公告)日：2013-11-12

申请号：US12853817

申请日：2010-08-10

Applicant: Kazuyuki Nakagawa ,  Shinji Baba ,  Satoshi Yamada ,  Takashi Karashima

Inventor： Kazuyuki Nakagawa ,  Shinji Baba ,  Satoshi Yamada ,  Takashi Karashima

IPC: H01L21/00

CPC classification number: H05K3/3484 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75743 ,  H01L2224/81009 ,  H01L2224/81011 ,  H01L2224/8102 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/8191 ,  H01L2224/83907 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/351 ,  H05K3/4007 ,  H05K2201/10674 ,  H05K2203/0415 ,  H05K2203/043 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012

Abstract: To aim at improvement of reliability of a semiconductor device of flip chip connection type. In assembling a BGA of flip chip connection type, when a semiconductor chip is solder-connected by a flip chip connection, because solder precoat is formed on the surface of a land on the side of an undersurface of a wiring substrate, the connection between the land and a solder ball, which is an external terminal, is solder-connection, and therefore, it is possible to increase impact resistance of a connection part between the land and the solder ball and to aim at improvement of reliability of the BGA.

Abstract translation: 旨在提高倒装芯片连接型半导体器件的可靠性。 在组装倒装芯片连接型的BGA时，当通过倒装芯片连接来焊接半导体芯片时，由于在布线基板的下表面侧的焊盘表面上形成焊料预涂层，所以在 作为外部端子的焊盘和焊球是焊接连接的，因此可以提高焊盘和焊球之间的连接部件的耐冲击性，并且旨在提高BGA的可靠性。