摘要:
The process of the present invention for producing dihydroxynaphthalenes comprises hydrolyzing a diacyloxynaphthalene in a water-containing solvent in the presence of an acid catalyst. The use of an acid as a hydrolyzing catalyst enables dihydroxynaphthalenes to be obtained with high purity and in high yield.
摘要:
Disclosed in accordance with the present invention are processes for the preparation of hydroperoxides and/or carbinols by liquid phase oxidation of secondary alkyl-substituted naphthalenes with molecular oxygen, wherein the oxidation reaction is carried out by dissolving in the reaction mixture containing the secondary alkyl-substituted naphthalenes at least 0.5 ppm in terms of metal, based on the starting secondary alkyl-substituted naphthalenes, of at least one compound of metal selected from the group consisting of palladium and gold, said metal compound being soluble in the reaction mixture of the secondary alkyl-substituted naphthalenes. When compared with the prior art processes using catalysts of non-homogeneous system, therefore, not only the amount of catalyst used can be minimized but also the rate of oxidation can be enhanced, and hence there can be obtained in a short period of time hydroperoxides and/or carbinols in high yields which are the oxidation products in accordance with the present invention.According to the present invention, the desired hydroperoxide can be obtained in high yields as well as in high purity from the hydroperoxides and/or carbinols obtained in the manner as mentioned above.
摘要:
A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.
摘要:
A novel and useful linear triene compound represented by the following formula (1) is co-polymerized with an &agr;-olefin to obtain an ethylenically unsaturated copolymer which is superior in weather-ability, heat resitance and fastness to ozone, together with superior scorch stability and vulcanizability at high velocity in which R1, R2, R3, R4, R5 and R6 stand each, independently of each other, for hydrogen atom or an alkyl having 1-3 carbon atoms, R7 represents an alkyl having 1-3 carbon atoms and n is an integer of 0-5, with the proviso that each of R4s or of R5s may be identical with or different from each other, respectively, when n is 2 or greater.
摘要:
The present invention relates to a method for preparing 4-hydroxy-1,2,2,6,6-pentamethylpiperidine comprising the following steps:(i) reacting 4-hydroxy-2,2,6,6-tetramethylpiperidine with at least one compound selected from the group consisting of formaldehyde, paraformaldehyde and trioxane, optionally in the presence of formic acid;(ii) neutralizing the reaction product of step (i) by adding a base thereto; and(iii) after the neutralization, separating the crude product from the aqueous layer and crystallizing and filtering the crude product to thereby obtain crystals of 4-hydroxy-1,2,2,6,6-pentamethylpiperidine with a water content of 3% by weight or less. The present invention also relates to a method for preparing 4-hydroxy-1,2,2,6,6-pentamethylpiperidine, comprising reacting 4-hydroxy-2,2,6,6-tetramethylpiperidine with at least one compound selected from the group consisting of formaldehyde, paraformaldehyde and trioxane, optionally in the presence of formic acid added in an amount smaller than that of 4-hydroxy-2,2,6,6-tetramethylpiperidine in terms of mole.
摘要:
A semiconductor device is provided with connection reliability between a bump electrode and a substrate electrode. An elastic modulus of an adhesive material used to electrically connect a metal bump and an interconnect pattern, and sealing the circuit surface of an LSI chip, after thermosetting is Ea; an elastic modulus of an insulating material of a packaging substrate surface layer after thermosetting is Eb; an elastic modulus of a core material, if used, is Ec, and the following rational expression is satisfied at normal temperature or a thermal contact bonding temperature of the adhesive material: at least Ea
摘要:
There are disclosed a resin composition comprising (A) a heat-resistant resin soluble in a solvent at room temperature, (B) a heat-resistant resin which is insoluble in a solvent at room temperature but becomes soluble by heating, and (C) a solvent; a heat-resistant resin paste further containing (D) particles or liquid state material D showing rubber elasticity; and a semiconductor device using the same and a method for producing the same.
摘要:
A paste composition which comprises as essential ingredients (A) a thermoplastic resin, (B) an epoxy resin, (C) a coupling agent, (D) a powdery inorganic filler, (E) a powder having rubber elasticity and (F) an organic solvent and which, when applied and dried, gives a coating film having a void content of 3% by volume or higher and a water vapor permeability as measured at 40° C. and 90 %RH of 500 g/m2·24 h or less; a protective film which is formed by applying the paste composition to a surface of a semiconductor part and drying it and has a void content of 3% by volume or higher and a water vapor permeability as measured at 40° C. and 90%RH of 500 g/m2·24 h or less; and a semiconductor device having the protective film.
摘要翻译:作为必要成分(A)热塑性树脂,(B)环氧树脂,(C)偶联剂,(D)粉末状无机填料,(E)具有橡胶弹性的粉末和(F) 有机溶剂,当涂布并干燥时,得到空隙率为3体积%以上的涂膜,在40℃,90%RH下测定的水蒸气透过率为500g / m 2·24h, 减; 通过将糊剂组合物涂布在半导体部件的表面并干燥而形成的保护膜,其空隙率为3体积%以上,水分透过率为40℃,90%RH 500 g / m2.24 h以下; 以及具有保护膜的半导体器件。
摘要:
An unsaturated polyester resin composition capable of affording a molded product having a small cured volume shrinkage, a superior dimensional stability, a surface quality and a high hardness, a sheet-form molding material using the composition and a process for producing a fiber-reinforced plastic molded product are provided, which composition comprises a saturated polyester obtained by reacting a saturated dibasic acid component containing 20% by mol or more of adipic acid with a saturated glycol component and having a number average molecular weight of 4,000 or higher and an acid value of 2 to 8 KOH mg/g, an unsaturated polyester and an ethylenic unsaturated monomer; which sheet-form molding material has the unsaturated resin composition together with a fiber reinforcing material placed between two films.