专利检索 ap:"Shigeki Katogi" 第 1 页

1.

发明授权
Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device 有权
标题翻译：粘合剂组合物，电路连接材料，电路构件的连接结构和半导体器件

公开(公告)号：US08518303B2

公开(公告)日：2013-08-27

申请号：US11908897

申请日：2006-03-15

申请人： Shigeki Katogi , Hiroyuki Izawa , Houko Sutou , Masami Yusa , Tohru Fujinawa

发明人： Shigeki Katogi , Hiroyuki Izawa , Houko Sutou , Masami Yusa , Tohru Fujinawa

IPC分类号： H01B1/00 , H01L23/48 , H05K1/11 , C08F8/00

CPC分类号： C08G18/672 , C08G18/3212 , C08G18/44 , C08G18/73 , C08L75/16 , C08L2666/20 , C09J133/066 , C09J133/14 , C09J175/16 , H01L24/29 , H01L24/83 , H01L2224/29101 , H01L2224/2919 , H01L2224/293 , H01L2224/29386 , H01L2224/294 , H01L2224/32225 , H01L2224/83101 , H01L2224/83851 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01067 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/10329 , H01L2924/10336 , H01L2924/10349 , H01L2924/15788 , H01L2924/19042 , H05K3/323 , H05K2201/0129 , C08G18/664 , C08G18/6674 , C08G18/6607 , C08G18/48 , H01L2924/00

摘要： The adhesive composition of the invention comprises a radical generator, a thermoplastic resin and a urethane(meth)acrylate having two or more radical-polymerizing groups in the molecule and a weight-average molecular weight of 3000-30,000.

摘要翻译： 本发明的粘合剂组合物包括自由基发生剂，热塑性树脂和在分子中具有两个或更多个自由基聚合基团的聚氨酯（甲基）丙烯酸酯，重均分子量为3000-3000。

2.

发明申请
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR WAFER PROVIDED WITH ADHESIVE LAYER 审中-公开
标题翻译：半导体器件，制造半导体器件的方法和具有粘合层的半导体器件

公开(公告)号：US20120263946A1

公开(公告)日：2012-10-18

申请号：US13509362

申请日：2010-11-10

申请人： Kazuyuki Mitsukura , Takashi Kawamori , Takashi Masuko , Shigeki Katogi , Shinjiro Fujii

发明人： Kazuyuki Mitsukura , Takashi Kawamori , Takashi Masuko , Shigeki Katogi , Shinjiro Fujii

IPC分类号： B32B7/12 , C09J7/02 , H01L21/50

CPC分类号： H01L24/27 , C08F220/30 , H01L21/565 , H01L21/67132 , H01L21/6836 , H01L23/3128 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/92 , H01L25/0657 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , H01L2224/27002 , H01L2224/274 , H01L2224/27416 , H01L2224/27418 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/83201 , H01L2224/83855 , H01L2224/83856 , H01L2224/92247 , H01L2224/93 , H01L2225/0651 , H01L2225/06568 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01075 , H01L2924/01079 , H01L2924/01084 , H01L2924/014 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/15311 , H01L2924/181 , H01L2924/351 , Y10T428/2809 , Y10T428/31935 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/27 , H01L2224/45099 , H01L2224/45015 , H01L2924/207

摘要： Disclosed is a method for manufacturing a semiconductor device which includes the steps of: forming an adhesive layer by forming an adhesive composition into a film on a surface opposite to the circuit surface of a semiconductor wafer; bringing the adhesive layer to a B-stage by irradiation with light; cutting the semiconductor wafer together with the adhesive layer brought to the B-stage into a plurality of semiconductor chips; and making the semiconductor chip to adhere to a supporting member or another semiconductor chip by performing compression bonding, with the adhesive layer sandwiched therebetween.

摘要翻译： 本发明公开了一种半导体器件的制造方法，包括以下步骤：通过在与半导体晶片的电路表面相对的表面上形成粘合剂组合物形成粘合剂层; 通过光照射使粘合剂层进入B阶段; 将半导体晶片与带到B级的粘合剂层一起切割成多个半导体芯片; 并且通过进行压接而使半导体芯片粘附到支撑构件或另一半导体芯片上，其中夹着粘合剂层。

3.

发明授权
Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device 有权

公开(公告)号：US08138268B2

公开(公告)日：2012-03-20

申请号：US11629068

申请日：2005-06-08

申请人： Shigeki Katogi , Houko Sutou , Hiroyuki Izawa , Toshiaki Shirasaka , Masami Yusa , Takanobu Kobayashi

发明人： Shigeki Katogi , Houko Sutou , Hiroyuki Izawa , Toshiaki Shirasaka , Masami Yusa , Takanobu Kobayashi

IPC分类号： C08F8/00

CPC分类号： H05K3/323 , C09J4/06 , H01B1/22 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/293 , H01L2224/32225 , H01L2224/838 , H01L2224/83851 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/10336 , H01L2924/10349 , H05K2201/0129 , H01L2924/00 , H01L2224/29099 , H01L2224/29199 , H01L2224/05599

摘要： The adhesive composition of the invention comprises a thermoplastic resin, a radical polymerizing compound, a radical polymerization initiator and a radical polymerization regulator. According to the present invention it is possible to provide an adhesive composition, a circuit connecting material, a connection structure for a circuit member and a semiconductor device whereby curing treatment can be carried out with sufficient speed at low temperature, curing treatment can be carried out with a wide process margin, and adequately stable adhesive strength can be obtained.

4.

发明申请
PHOTOSENSITIVE ADHESIVE COMPOSITION, FILMY ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE, AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE 审中-公开
标题翻译：光敏性粘合剂组合物，胶粘剂，粘合片，粘合剂图案，具有粘合层的半导体滤波器，半导体器件以及用于制造半导体器件的方法

公开(公告)号：US20110121435A1

公开(公告)日：2011-05-26

申请号：US12863068

申请日：2009-01-09

申请人： Kazuyuki Mitsukura , Takashi Kawamori , Takashi Masuko , Shigeki Katogi

发明人： Kazuyuki Mitsukura , Takashi Kawamori , Takashi Masuko , Shigeki Katogi

IPC分类号： H01L25/00 , C08J3/28 , B32B3/30 , H01L21/50

CPC分类号： C09J179/08 , C08G73/1042 , C08G73/1046 , C08G73/106 , C08K5/0025 , C08K5/3417 , C08L79/08 , C08L2312/06 , C09J7/20 , C09J163/00 , C09J2203/326 , C09J2205/102 , C09J2463/00 , C09J2479/08 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/8385 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/15311 , H01L2924/15788 , H01L2924/181 , H01L2924/351 , Y10T428/24612 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/45099 , H01L2224/45015 , H01L2924/207

摘要： A photosensitive adhesive composition that comprises (A) a resin with a carboxyl and/or hydroxyl group, (B) a thermosetting resin, (C) a radiation-polymerizable compound and (D) a photoinitiator, wherein the 3% weight reduction temperature of the entire photoinitiator mixture in the composition is 200° C. or greater.

摘要翻译： 一种感光性粘合剂组合物，其包含（A）具有羧基和/或羟基的树脂，（B）热固性树脂，（C）辐射聚合性化合物和（D）光引发剂，其中，3％组合物中的整个光引发剂混合物为200℃或更高。

5.

发明申请
ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE OF CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE 有权
标题翻译：胶粘组合物，电路连接材料，电路构件的连接结构和半导体器件

公开(公告)号：US20090309220A1

公开(公告)日：2009-12-17

申请号：US11908897

申请日：2006-03-15

申请人： Shigeki Katogi , Hiroyuki Izawa , Houko Sutou , Masami Yusa , Tohru Fujinawa

发明人： Shigeki Katogi , Hiroyuki Izawa , Houko Sutou , Masami Yusa , Tohru Fujinawa

IPC分类号： H01L23/52 , C08L75/04 , H01B1/12 , H05K1/11

CPC分类号： C08G18/672 , C08G18/3212 , C08G18/44 , C08G18/73 , C08L75/16 , C08L2666/20 , C09J133/066 , C09J133/14 , C09J175/16 , H01L24/29 , H01L24/83 , H01L2224/29101 , H01L2224/2919 , H01L2224/293 , H01L2224/29386 , H01L2224/294 , H01L2224/32225 , H01L2224/83101 , H01L2224/83851 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01067 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/10329 , H01L2924/10336 , H01L2924/10349 , H01L2924/15788 , H01L2924/19042 , H05K3/323 , H05K2201/0129 , C08G18/664 , C08G18/6674 , C08G18/6607 , C08G18/48 , H01L2924/00

摘要： The adhesive composition of the invention comprises a radical generator, a thermoplastic resin and a urethane (meth)acrylate having two or more radical-polymerizing groups in the molecule and a weight-average molecular weight of 3000-30,000.

摘要翻译： 本发明的粘合剂组合物包括自由基发生剂，热塑性树脂和在分子中具有两个或更多个自由基聚合基团的聚氨酯（甲基）丙烯酸酯，重均分子量为3000-3000。

6.

发明申请
PHOTOSENSITIVE ADHESIVE COMPOSITION, AND OBTAINED USING THE SAME, ADHESIVE FILM, ADHESIVE SHEET, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND ELECTRONIC PART 有权
标题翻译：感光性粘合剂组合物，使用它们，粘合膜，粘合片，具有粘合层的半导体膜，半导体器件和电子部件

公开(公告)号：US20080176167A1

公开(公告)日：2008-07-24

申请号：US11969358

申请日：2008-01-04

申请人： Takashi Kawamori , Takashi Masuko , Shigeki Katogi , Masaaki Yasuda

发明人： Takashi Kawamori , Takashi Masuko , Shigeki Katogi , Masaaki Yasuda

IPC分类号： G03F7/004 , G03F7/26

CPC分类号： H01L23/488 , C09J179/08 , G03F7/037 , H01L21/2007 , H01L21/76251 , H01L21/78 , H01L27/14618 , H01L27/14683 , H01L2224/48091 , Y10T156/1002 , Y10T428/24479 , Y10T428/24802 , H01L2924/00014

摘要： A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.

摘要翻译： 一种感光性粘合剂组合物，其包含：（A）具有羧基作为侧链的聚酰亚胺，其酸值为80〜180mg / KOH; （B）光聚合性化合物; 和（C）光聚合引发剂。

7.

发明授权
Photosensitive adhesive composition, film-like adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device 有权
标题翻译：光敏粘合剂组合物，薄膜状粘合剂，粘合片，粘合剂图案，具有粘合剂层的半导体晶片，半导体器件

公开(公告)号：US09309446B2

公开(公告)日：2016-04-12

申请号：US13410702

申请日：2012-03-02

申请人： Kazuyuki Mitsukura , Takashi Kawamori , Takashi Masuko , Shigeki Katogi

发明人： Kazuyuki Mitsukura , Takashi Kawamori , Takashi Masuko , Shigeki Katogi

IPC分类号： G03F7/00 , G03F7/004 , C09J7/02 , H01L23/00 , G03F7/027 , G03F7/037 , G03F7/038 , C08G73/10 , C09J179/08 , H01L21/683 , H01L25/065 , H01L23/29 , H01L23/31

CPC分类号： C09J7/0203 , C08G73/105 , C08L63/00 , C09J7/35 , C09J179/08 , C09J2203/326 , C09J2205/31 , C09J2433/00 , C09J2463/00 , C09J2479/08 , G03F7/027 , G03F7/037 , G03F7/038 , H01L21/6836 , H01L23/293 , H01L23/3128 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/92 , H01L25/0657 , H01L2221/68327 , H01L2221/68377 , H01L2224/05554 , H01L2224/27002 , H01L2224/27416 , H01L2224/27436 , H01L2224/27622 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2224/92247 , H01L2225/0651 , H01L2225/06568 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01044 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01073 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/12042 , H01L2924/1461 , H01L2924/15788 , H01L2924/181 , Y10T428/24802 , Y10T428/2817 , H01L2924/00012 , H01L2924/00 , H01L2924/3512 , H01L2224/45099 , H01L2224/45015 , H01L2924/207

摘要： The present invention relates to a photosensitive adhesive composition that has thermal press bondability to an adherent after being patterned by exposure and development and enables alkali development, wherein a storage elastic modulus at 110° C. after exposure and further heat curing is not less than 10 MPa.

摘要翻译： 本发明涉及一种感光性粘合剂组合物，其通过曝光和显影进行图案化后具有对粘合剂的热压粘合性，并且能够进行碱显影，其中在曝光和进一步热固化后110℃下的储能弹性模量不小于10 MPa。

8.

发明授权
Method of producing semiconductor device with patterned photosensitive adhesive 有权
标题翻译：用图案化感光胶制造半导体器件的方法

公开(公告)号：US08507323B2

公开(公告)日：2013-08-13

申请号：US13551816

申请日：2012-07-18

申请人： Takashi Masuko , Takashi Kawamori , Kazuyuki Mitsukura , Shigeki Katogi

发明人： Takashi Masuko , Takashi Kawamori , Kazuyuki Mitsukura , Shigeki Katogi

IPC分类号： H01L21/44 , H01L21/48 , H01L21/50

CPC分类号： C09J4/00 , C08G65/3322 , C08G65/33306 , C08G2650/50 , C08L71/02 , C08L79/08 , C08L2666/20 , C08L2666/22 , C09J171/02 , C09J179/08 , H01L21/6836 , H01L23/3121 , H01L24/27 , H01L24/29 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L2221/68327 , H01L2224/05554 , H01L2224/274 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/83855 , H01L2224/85 , H01L2224/92247 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/181 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099

摘要： A photosensitive adhesive capable of alkali development, the photosensitive adhesive exhibiting adhesion property for an adherend after it has been patterned by light exposure and development, the photosensitive adhesive being used in a method for producing a semiconductor device 100 comprising a step of patterning the photosensitive adhesive 1 provided on a circuit surface of a semiconductor chip 20 by light exposure and development; and a step of directly bonding another semiconductor chip 21 to the patterned photosensitive adhesive 1.

摘要翻译： 一种能够进行碱显影的感光性粘合剂，该感光性粘合剂在通过曝光和显影进行图案化后，对被粘物具有粘合性，该感光性粘接剂用于半导体装置100的制造方法中，其特征在于， 1，通过曝光和显影设置在半导体芯片20的电路表面上; 以及将另一半导体芯片21直接结合到图案化感光性粘接剂1的工序。