公开(公告)号：US20120273974A1

公开(公告)日：2012-11-01

申请号：US13494474

申请日：2012-06-12

Applicant: Shigeki Katogi ,  Hiroyuki Izawa ,  Houko Sutou ,  Masami Yusa ,  Tohru Fujinawa

Inventor： Shigeki Katogi ,  Hiroyuki Izawa ,  Houko Sutou ,  Masami Yusa ,  Tohru Fujinawa

IPC: C09J175/14 ,  H05K1/11 ,  H01L23/535 ,  H01B1/12

CPC classification number: C08G18/672 ,  C08G18/3212 ,  C08G18/44 ,  C08G18/73 ,  C08L75/16 ,  C08L2666/20 ,  C09J133/066 ,  C09J133/14 ,  C09J175/16 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/293 ,  H01L2224/29386 ,  H01L2224/294 ,  H01L2224/32225 ,  H01L2224/83101 ,  H01L2224/83851 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01067 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/10336 ,  H01L2924/10349 ,  H01L2924/15788 ,  H01L2924/19042 ,  H05K3/323 ,  H05K2201/0129 ,  C08G18/664 ,  C08G18/6674 ,  C08G18/6607 ,  C08G18/48 ,  H01L2924/00

Abstract: The adhesive composition of the invention comprises a radical generator, a thermoplastic resin and a urethane (meth)acrylate having two or more radical-polymerizing groups in the molecule and a weight-average molecular weight of 3000-30,000.

Abstract translation: 本发明的粘合剂组合物包括自由基发生剂，热塑性树脂和分子中具有两个或更多个自由基聚合基团的聚氨酯（甲基）丙烯酸酯，重均分子量为3000-3000。

公开(公告)号：US08293847B2

公开(公告)日：2012-10-23

申请号：US12376347

申请日：2006-08-04

Applicant: Takashi Masuko ,  Minoru Sugiura ,  Shigeki Katogi ,  Masami Yusa

Inventor： Takashi Masuko ,  Minoru Sugiura ,  Shigeki Katogi ,  Masami Yusa

IPC: C08L75/04

CPC classification number: H01L21/6836 ,  C08G18/10 ,  C08G18/4854 ,  C08G59/08 ,  C08G59/621 ,  C08G73/1035 ,  C08G73/1046 ,  C08G73/14 ,  C08L63/04 ,  C08L75/04 ,  C08L2666/22 ,  C09J7/10 ,  C09J175/04 ,  C09J179/08 ,  C09J2203/326 ,  C09J2205/114 ,  C09J2453/00 ,  C09J2475/00 ,  C09J2479/08 ,  H01L21/6835 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/274 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2225/0651 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01067 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/351 ,  Y10T428/2848 ,  C08G18/346 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/069 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An object of the present invention is to provide a film-like adhesive capable of achieving a superior combination of processability and reflow resistance. A film-like adhesive of the present invention is used for bonding a semiconductor element to an adherend, and includes an adhesive layer comprising at least one resin selected from the group consisting of polyurethaneimide resins, polyurethaneamideimide resins and polyurethaneimide-polyurethaneamideimide resins.

Abstract translation: 本发明的目的是提供能够实现加工性和耐回流性优异组合的膜状粘合剂。 本发明的膜状粘合剂用于将半导体元件粘合到被粘物上，并且包括含有选自聚氨酯酰亚胺树脂，聚氨酯酰胺酰亚胺树脂和聚氨酯酰亚胺 - 聚氨酯酰胺酰亚胺树脂中的至少一种树脂的粘合剂层。

公开(公告)号：US20100265685A1

公开(公告)日：2010-10-21

申请号：US12824709

申请日：2010-06-28

Applicant: Tohru Fujinawa ,  Masami Yusa ,  Satoyuki Nomura ,  Hiroshi Ono ,  Itsuo Watanabe ,  Motohiro Arifuku ,  Hoko Kanazawa

Inventor： Tohru Fujinawa ,  Masami Yusa ,  Satoyuki Nomura ,  Hiroshi Ono ,  Itsuo Watanabe ,  Motohiro Arifuku ,  Hoko Kanazawa

IPC: H05K1/14 ,  H05K3/00

CPC classification number: H05K3/323 ,  C08F283/006 ,  C08F290/067 ,  C08G18/4018 ,  C08G18/4238 ,  C08G18/4277 ,  C08G18/4854 ,  C08G18/6607 ,  C08G18/672 ,  C08G18/8175 ,  C08L51/08 ,  C08L75/04 ,  C09J4/06 ,  H01L24/29 ,  H01L2924/14 ,  H01L2924/15788 ,  H05K2201/0154 ,  C08G18/42 ,  C08L2666/02 ,  H01L2924/00

Abstract: The present invention provides a wiring-connecting material comprising from 2 to 75 parts by weight of a polyurethane resin, from 30 to 60 parts by weight of a radical-polymerizable substance and from 0.1 to 30 parts by weight of a curing agent capable of generating a free radical upon heating, and a process for producing a wiring-connected board by using the wiring-connecting material. The wiring-connecting material of the present invention may preferably further contain a film-forming material and/or conductive particles.

Abstract translation: 本发明提供一种配线连接材料，其包含2至75重量份的聚氨酯树脂，30至60重量份的可自由基聚合的物质和0.1至30重量份的能产生 加热时的自由基，以及使用配线连接材料制造配线连接板的工序。 本发明的配线连接材料优选还可以含有成膜材料和/或导电性粒子。

公开(公告)号：US20100239858A1

公开(公告)日：2010-09-23

申请号：US12376347

申请日：2006-08-04

Applicant: Takashi Masuko ,  Minoru Sugiura ,  Shigeki Katogi ,  Masami Yusa

Inventor： Takashi Masuko ,  Minoru Sugiura ,  Shigeki Katogi ,  Masami Yusa

IPC: B32B7/12 ,  C09J7/02 ,  C08G18/00 ,  C08L63/00 ,  C08L75/04

CPC classification number: H01L21/6836 ,  C08G18/10 ,  C08G18/4854 ,  C08G59/08 ,  C08G59/621 ,  C08G73/1035 ,  C08G73/1046 ,  C08G73/14 ,  C08L63/04 ,  C08L75/04 ,  C08L2666/22 ,  C09J7/10 ,  C09J175/04 ,  C09J179/08 ,  C09J2203/326 ,  C09J2205/114 ,  C09J2453/00 ,  C09J2475/00 ,  C09J2479/08 ,  H01L21/6835 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/274 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2225/0651 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01067 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/351 ,  Y10T428/2848 ,  C08G18/346 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/069 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An object of the present invention is to provide a film-like adhesive capable of achieving a superior combination of processability and reflow resistance. A film-like adhesive of the present invention is used for bonding a semiconductor element to an adherend, and includes an adhesive layer comprising at least one resin selected from the group consisting of polyurethaneimide resins, polyurethaneamideimide resins and polyurethaneimide-polyurethaneamideimide resins.

Abstract translation: 本发明的目的是提供能够实现加工性和耐回流性优异组合的膜状粘合剂。 本发明的膜状粘合剂用于将半导体元件粘合到被粘物上，并且包括含有选自聚氨酯酰亚胺树脂，聚氨酯酰胺酰亚胺树脂和聚氨酯酰亚胺 - 聚氨酯酰胺酰亚胺树脂中的至少一种树脂的粘合剂层。

公开(公告)号：US07795325B2

公开(公告)日：2010-09-14

申请号：US12492492

申请日：2009-06-26

Applicant: Shigeki Katogi ,  Hoko Suto ,  Masami Yusa

Inventor： Shigeki Katogi ,  Hoko Suto ,  Masami Yusa

IPC: C08F2/46 ,  C08F2/50 ,  C08J3/28

CPC classification number: C09J4/06 ,  C08F291/00 ,  H01L21/563 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01054 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/14 ,  H01R4/04 ,  H05K3/305 ,  H05K3/323 ,  Y10T428/2857 ,  Y10T428/2878 ,  Y10T428/2883 ,  Y10T428/2887 ,  Y10T428/2891 ,  Y10T428/2896 ,  H01L2924/00 ,  H01L2224/05599

Abstract: An adhesive composition containing: (a) a thermoplastic resin; (b) a radical-polymerizable compound including two or more (meth)acryloyl groups; (c) a curing agent that generates a radical by photoirradiation of 150 to 750 nm and/or heating at 80 to 200° C.; and (d) a liquid rubber having a viscosity of 10 to 1000 Pa·s at 25° C.

Abstract translation: 一种粘合剂组合物，其包含：（a）热塑性树脂; （b）包含两个或多个（甲基）丙烯酰基的可自由基聚合的化合物; （c）通过150〜750nm的光照射和/或在80〜200℃下加热而产生自由基的固化剂。 和（d）在25℃下粘度为10〜1000Pa·s的液体橡胶

公开(公告)号：US20080290529A1

公开(公告)日：2008-11-27

申请号：US12138637

申请日：2008-06-13

Applicant: Shinji TAKEDA ,  Takashi Masuko ,  Masami Yusa ,  Tooru Kikuchi ,  Yasuo Miyadera ,  Iwao Maekawa ,  Mitsuo Yamasaki ,  Akira Kageyama ,  Aizou Kaneda

Inventor： Shinji TAKEDA ,  Takashi Masuko ,  Masami Yusa ,  Tooru Kikuchi ,  Yasuo Miyadera ,  Iwao Maekawa ,  Mitsuo Yamasaki ,  Akira Kageyama ,  Aizou Kaneda

IPC: H01L23/18 ,  H01L21/58

CPC classification number: H01L24/27 ,  H01L23/49513 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/743 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83805 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/181 ,  Y10T428/28 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250 ° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.

Abstract translation: 将半导体芯片与吸水率为1.5体积％以下的薄膜状有机芯片接合材料贴合在引线框架上; 具有1.0体积％以下的饱和吸湿性，在250℃的温度下具有不大于3.0重量％的残留挥发组分，弹性模量为10MPa以下。半导体装置 这样获得的半导体器件的封装的回流焊接期间不会发生回流裂纹。

公开(公告)号：US07141645B2

公开(公告)日：2006-11-28

申请号：US10846507

申请日：2004-05-17

Applicant: Tohru Fujinawa ,  Masami Yusa ,  Satoyuki Nomura ,  Hiroshi Ono ,  Itsuo Watanabe ,  Motohiro Arifuku ,  Hoko Kanazawa

Inventor： Tohru Fujinawa ,  Masami Yusa ,  Satoyuki Nomura ,  Hiroshi Ono ,  Itsuo Watanabe ,  Motohiro Arifuku ,  Hoko Kanazawa

IPC: C08F283/04

CPC classification number: H05K3/323 ,  C08F283/006 ,  C08F290/067 ,  C08G18/4018 ,  C08G18/4238 ,  C08G18/4277 ,  C08G18/4854 ,  C08G18/6607 ,  C08G18/672 ,  C08G18/8175 ,  C08L51/08 ,  C08L75/04 ,  C09J4/06 ,  H01L24/29 ,  H01L2924/14 ,  H01L2924/15788 ,  H05K2201/0154 ,  C08G18/42 ,  C08L2666/02 ,  H01L2924/00

Abstract: The present invention provides a wiring-connecting material comprising from 2 to 75 parts by weight of a polyurethane resin, from 30 to 60 parts by weight of a radical-polymerizable substance and from 0.1 to 30 parts by weight of a curing agent capable of generating a free radical upon heating, and a process for producing a wiring-connected board by using the wiring-connecting material. The wiring-connecting material of the present invention may preferably further contain a film-forming material and/or conductive particles.

Abstract translation: 本发明提供一种配线连接材料，其包含2至75重量份的聚氨酯树脂，30至60重量份的可自由基聚合的物质和0.1至30重量份的能产生 加热时的自由基，以及使用配线连接材料制造配线连接板的工序。 本发明的配线连接材料优选还可以含有成膜材料和/或导电性粒子。

公开(公告)号：US07012320B2

公开(公告)日：2006-03-14

申请号：US09785486

申请日：2001-02-20

Applicant: Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Tooru Kikuchi ,  Yasuo Miyadera ,  Iwao Maekawa ,  Mitsuo Yamasaki ,  Akira Kageyama ,  Aizou Kaneda

Inventor： Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Tooru Kikuchi ,  Yasuo Miyadera ,  Iwao Maekawa ,  Mitsuo Yamasaki ,  Akira Kageyama ,  Aizou Kaneda

IPC: H01L23/495

CPC classification number: H01L24/27 ,  H01L23/49513 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/743 ,  H01L24/83 ,  H01L2224/05599 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83805 ,  H01L2224/8385 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.

公开(公告)号：US06855579B2

公开(公告)日：2005-02-15

申请号：US09785436

申请日：2001-02-20

Applicant: Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Tooru Kikuchi ,  Yasuo Miyadera ,  Iwao Maekawa ,  Mitsuo Yamasaki ,  Akira Kageyama ,  Aizou Kaneda

Inventor： Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Tooru Kikuchi ,  Yasuo Miyadera ,  Iwao Maekawa ,  Mitsuo Yamasaki ,  Akira Kageyama ,  Aizou Kaneda

IPC: H01L21/52 ,  H01L21/58 ,  H01L23/495 ,  H01L21/48

CPC classification number: H01L24/27 ,  H01L23/49513 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/743 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83805 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/181 ,  Y10T428/28 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.

Abstract translation: 将半导体芯片与吸水率为1.5体积％以下的薄膜状有机芯片接合材料贴合在引线框架上; 具有1.0体积％以下的饱和吸湿性，在250℃的温度下具有不大于3.0重量％的残留挥发组分，弹性模量为10MPa以下。半导体装置 这样获得的半导体器件的封装的回流焊接期间不会发生回流裂纹。

公开(公告)号：US06236108B1

公开(公告)日：2001-05-22

申请号：US09541041

申请日：2000-03-31

Applicant: Yoshiki Sota ,  Koji Miyata ,  Toshio Yamazaki ,  Fumio Inoue ,  Hidehiro Nakamura ,  Yoshiaki Tsubomatsu ,  Yasuhiko Awano ,  Shigeki Ichimura ,  Masami Yusa ,  Yorio Iwasaki

Inventor： Yoshiki Sota ,  Koji Miyata ,  Toshio Yamazaki ,  Fumio Inoue ,  Hidehiro Nakamura ,  Yoshiaki Tsubomatsu ,  Yasuhiko Awano ,  Shigeki Ichimura ,  Masami Yusa ,  Yorio Iwasaki

IPC: H01L23495

CPC classification number: H01L23/4985 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2224/05599

Abstract: A semiconductor packaging chip-supporting substrate of the present invention comprises an insulating supporting substrate, wiring provided on the substrate, and an insulating film provided on the wiring. The wiring each have i) an inner connection that connects to a semiconductor chip electrode and ii) a semiconductor chip-mounting region. An opening is also provided in the insulating supporting substrate at its part where each of the wiring is formed on the insulating supporting substrate, which is the part where an outer connection conducting to the inner connection is provided. The insulating film is formed at the part on which the semiconductor chip is mounted, covering the semiconductor chip-mounting region of the wiring.

Abstract translation: 本发明的半导体封装芯片支撑基板包括绝缘支撑基板，设置在基板上的布线和设置在布线上的绝缘膜。 布线各自具有i）连接到半导体芯片电极的内部连接，以及ii）半导体芯片安装区域。 在绝缘支撑基板的一部分上还设置有开口，其中每个布线形成在绝缘支撑基板上，绝缘支撑基板是设置有内部连接的外部连接的部分。 绝缘膜形成在安装有半导体芯片的部分，覆盖布线的半导体芯片安装区域。