公开(公告)号：US07387914B2

公开(公告)日：2008-06-17

申请号：US11379921

申请日：2006-04-24

Applicant: Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Tooru Kikuchi ,  Yasuo Miyadera ,  Iwao Maekawa ,  Mitsuo Yamasaki ,  Akira Kageyama ,  Aizou Kaneda

Inventor： Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Tooru Kikuchi ,  Yasuo Miyadera ,  Iwao Maekawa ,  Mitsuo Yamasaki ,  Akira Kageyama ,  Aizou Kaneda

IPC: H01L21/48 ,  H01L21/50

CPC classification number: H01L24/27 ,  H01L23/49513 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/743 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83805 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/181 ,  Y10T428/28 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.

Abstract translation: 将半导体芯片与吸水率为1.5体积％以下的薄膜状有机芯片接合材料贴合在引线框架上; 具有1.0体积％以下的饱和吸湿性，在250℃的温度下具有不大于3.0重量％的残留挥发组分，弹性模量为10MPa以下。半导体装置 这样获得的半导体器件的封装的回流焊接期间不会发生回流裂纹。

公开(公告)号：US07326440B2

公开(公告)日：2008-02-05

申请号：US10606360

申请日：2003-06-26

Applicant: Yukio Tokunaga ,  Iwao Maekawa

Inventor： Yukio Tokunaga ,  Iwao Maekawa

IPC: B05D5/04 ,  B05D3/12

CPC classification number: B41M5/52 ,  B41M5/506 ,  B41M5/508 ,  B41M5/5218 ,  B41M5/5254 ,  Y10T428/24802

Abstract: There is disclosed a sheet-state ink-jet recording material which comprises a water-resistant support and at least one ink-receptive layer provided on the support, wherein at least one of the ink-receptive layers contains inorganic fine particles having an average primary particle size of 30 nm or less and a hydrophilic binder, and a longitudinal direction of the sheet-state ink-jet recording material is cut at a right angle to a flowing direction of the recording material at a time of coating the ink-receptive layer.

Abstract translation: 公开了一种片状喷墨记录材料，其包含防水载体和设置在载体上的至少一个油墨接收层，其中至少一个油墨接受层含有具有平均初级的无机细颗粒 30nm以下的粒径和亲水性粘合剂，并且片状状喷墨记录材料的长度方向在涂布油墨接收层时与记录材料的流动方向成直角地切割 。

公开(公告)号：US4228251A

公开(公告)日：1980-10-14

申请号：US964798

申请日：1978-11-30

Applicant: Iwao Maekawa ,  Isao Uchigasaki ,  Noboru Monma

Inventor： Iwao Maekawa ,  Isao Uchigasaki ,  Noboru Monma

IPC: C08L67/00 ,  C08F299/00 ,  C08F299/04 ,  C08G63/00 ,  C08G63/52 ,  C08G63/553 ,  C08G63/676 ,  C08L67/06 ,  H01B3/42

CPC classification number: H01B3/425 ,  C08G63/553 ,  C08G63/676 ,  C08L67/06

Abstract: A resin composition which comprises (A) 50 to 90 parts by weight of an unsaturated ester oligomer produced by reacting a glycol, hydroxylated dicyclopentadiene, and at least one unsaturated dibasic acid or anhydride thereof until an acid value of less than 40, (B) 50 to 10 parts by weight of one or more polymerizable monomers, and (C) 3 to 15 parts by weight of polystyrene based on 100 parts by weight of the total of the components (A) and (B), can give molded articles having low shrink properties and improved color shading, cracks, etc.

Abstract translation: 一种树脂组合物，其包含（A）50至90重量份的通过使二元醇，羟基化二环戊二烯和至少一种不饱和二元酸或其酸酐反应生成的不饱和酯低聚物，直到酸值小于40，（B） 50重量份至10重量份的一种或多种可聚合单体，和（C）基于100重量份的组分（A）和（B）的总计3至15重量份的聚苯乙烯，可以得到具有 低收缩性能和改善的色泽，裂纹等

公开(公告)号：US20080290529A1

公开(公告)日：2008-11-27

申请号：US12138637

申请日：2008-06-13

Applicant: Shinji TAKEDA ,  Takashi Masuko ,  Masami Yusa ,  Tooru Kikuchi ,  Yasuo Miyadera ,  Iwao Maekawa ,  Mitsuo Yamasaki ,  Akira Kageyama ,  Aizou Kaneda

Inventor： Shinji TAKEDA ,  Takashi Masuko ,  Masami Yusa ,  Tooru Kikuchi ,  Yasuo Miyadera ,  Iwao Maekawa ,  Mitsuo Yamasaki ,  Akira Kageyama ,  Aizou Kaneda

IPC: H01L23/18 ,  H01L21/58

CPC classification number: H01L24/27 ,  H01L23/49513 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/743 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83805 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/181 ,  Y10T428/28 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250 ° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.

Abstract translation: 将半导体芯片与吸水率为1.5体积％以下的薄膜状有机芯片接合材料贴合在引线框架上; 具有1.0体积％以下的饱和吸湿性，在250℃的温度下具有不大于3.0重量％的残留挥发组分，弹性模量为10MPa以下。半导体装置 这样获得的半导体器件的封装的回流焊接期间不会发生回流裂纹。

公开(公告)号：US07012320B2

公开(公告)日：2006-03-14

申请号：US09785486

申请日：2001-02-20

Applicant: Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Tooru Kikuchi ,  Yasuo Miyadera ,  Iwao Maekawa ,  Mitsuo Yamasaki ,  Akira Kageyama ,  Aizou Kaneda

Inventor： Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Tooru Kikuchi ,  Yasuo Miyadera ,  Iwao Maekawa ,  Mitsuo Yamasaki ,  Akira Kageyama ,  Aizou Kaneda

IPC: H01L23/495

CPC classification number: H01L24/27 ,  H01L23/49513 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/743 ,  H01L24/83 ,  H01L2224/05599 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83805 ,  H01L2224/8385 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.

公开(公告)号：US06855579B2

公开(公告)日：2005-02-15

申请号：US09785436

申请日：2001-02-20

Applicant: Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Tooru Kikuchi ,  Yasuo Miyadera ,  Iwao Maekawa ,  Mitsuo Yamasaki ,  Akira Kageyama ,  Aizou Kaneda

Inventor： Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Tooru Kikuchi ,  Yasuo Miyadera ,  Iwao Maekawa ,  Mitsuo Yamasaki ,  Akira Kageyama ,  Aizou Kaneda

IPC: H01L21/52 ,  H01L21/58 ,  H01L23/495 ,  H01L21/48

CPC classification number: H01L24/27 ,  H01L23/49513 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/743 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83805 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/181 ,  Y10T428/28 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.

Abstract translation: 将半导体芯片与吸水率为1.5体积％以下的薄膜状有机芯片接合材料贴合在引线框架上; 具有1.0体积％以下的饱和吸湿性，在250℃的温度下具有不大于3.0重量％的残留挥发组分，弹性模量为10MPa以下。半导体装置 这样获得的半导体器件的封装的回流焊接期间不会发生回流裂纹。

公开(公告)号：US4490496A

公开(公告)日：1984-12-25

申请号：US470564

申请日：1983-02-28

Applicant: Iwao Maekawa ,  Eiji Omori ,  Isao Uchigasaki ,  Hideyuki Tobita ,  Naoki Yokoyama ,  Seikichi Tanno ,  Fumio Nakano ,  Ren Ito

Inventor： Iwao Maekawa ,  Eiji Omori ,  Isao Uchigasaki ,  Hideyuki Tobita ,  Naoki Yokoyama ,  Seikichi Tanno ,  Fumio Nakano ,  Ren Ito

IPC: C09D5/25 ,  C09D7/00 ,  C09D7/12 ,  C09D133/04 ,  C09D133/06 ,  H05K3/28 ,  C08K3/34 ,  C08K3/20 ,  C08K5/10 ,  C08L33/10

CPC classification number: H05K3/285 ,  C09D133/06

Abstract: A coating composition comprising (A) a thermoplastic resin having a glass transition temperature of 0.degree. to 80.degree. C., (B) a compound having 2 or more hydroxyl groups in the molecule, (C) a thixotropic agent and (D) a solvent, and said coating composition having a viscosity of 3 to 50 poises at 25.degree. C. and a thixotropy of 2 or more can give a moistureproof insulating coating film with uniform and large thickness and very few bubbles by one-time treatment over packing circuit boards.

Abstract translation: 一种涂料组合物，其包含（A）玻璃化转变温度为0〜80℃的热塑性树脂，（B）分子中具有2个以上羟基的化合物，（C）触变剂和（D） 溶剂，并且所述涂料组合物在25℃下的粘度为3〜50泊，触变性为2以上，可以通过一次性处理包装电路得到均匀且厚度大的气泡和非常少的气泡的防潮绝缘涂膜 董事会

公开(公告)号：US4338427A

公开(公告)日：1982-07-06

申请号：US138976

申请日：1980-04-10

Applicant: Iwao Maekawa ,  Daisuke Makino

Inventor： Iwao Maekawa ,  Daisuke Makino

IPC: C08G18/00 ,  C08G18/34 ,  C08G18/38 ,  C08G73/00 ,  C08G73/10 ,  C08G73/14 ,  C08G18/32 ,  C08G18/30

CPC classification number: C08G73/1035 ,  C08G18/3821

Abstract: Polyimide-amide-carboxylic acids produced by reacting an aromatic diamine with an aromatic tetracarboxylic acid dianhydride in amounts of 1.5 to 2.0 moles of the latter per mole of the former in the presence of an inert solvent, and reacting the resulting intermediate reaction product with an aromatic diisocyanate in about equivalent amounts at a temperature of 50.degree. to 100.degree. C. while removing generated carbon dioxide from the reaction system are good in heat resistance, wear resistance, chemical resistance, etc.

Abstract translation: 在惰性溶剂存在下，通过使芳族二胺与芳族四羧酸二酐的量为每摩尔前者的1.5-2.0摩尔量而制备的聚酰亚胺 - 酰胺 - 羧酸，并将得到的中间体反应产物与 芳族二异氰酸酯在50〜100℃的温度下等量，同时从反应体系中除去产生的二氧化碳，耐热性，耐磨性，耐化学性等优异。

公开(公告)号：US4245067A

公开(公告)日：1981-01-13

申请号：US96389

申请日：1979-11-21

Applicant: Iwao Maekawa ,  Akira Kageyama ,  Uchigasaki, Isao

Inventor： Iwao Maekawa ,  Akira Kageyama ,  Uchigasaki, Isao

IPC: C08F299/00 ,  C08F290/00 ,  C08G18/00 ,  C08G18/67 ,  C08G18/69 ,  C08G18/62

CPC classification number: C08G18/694 ,  C08G18/67

Abstract: A thermosetting resin composition comprising (I) a polybutadiene derivative obtained by conducting reaction of (A) a compound having active hydrogen obtained by reacting dicyclopentadiene or hydroxylated dicyclopentadiene with maleic anhydride or acid to yield partially esterified dicyclopentadienecarboxylic acid, which is further reacted with monoglycidyl ether or ester, (B) a butadiene homopolymer or copolymer having one or more hydroxyl groups and number average molecular weight of 1000 to 5000, and (C) a diisocyanate in ratios in terms of functional group equivalent ratio of (A)/(B)/(C) being 0.6-1.0/1.0/1.2-2.0, and (II) a polymerizable monomer having at least one polymerizable double bond in the molecule can be handled easily and cured at normal temperatures to give cured articles having good properties without losing excellent properties of polybutadiene as elastomer.

Abstract translation: 一种热固性树脂组合物，其包含（I）通过（A）通过使二环戊二烯或羟基化二环戊二烯与马来酸酐或酸反应获得的具有活性氢的化合物进行反应获得的聚丁二烯衍生物，以产生部分酯化的二环戊二烯羧酸，其进一步与单缩水甘油醚 或酯，（B）具有一个或多个羟基和数均分子量为1000至5000的丁二烯均聚物或共聚物，和（C）以（A）/（B）的官能团当量比表示的比例的二异氰酸酯， /（C）为0.6-1.0 / 1.0 / 1.2-2.0，（II）分子中具有至少一个可聚合双键的可聚合单体可以容易地处理并在常温下固化，得到具有良好性能的固化物而不失去 聚丁二烯作为弹性体的优异性能。

公开(公告)号：US4233413A

公开(公告)日：1980-11-11

申请号：US964169

申请日：1978-11-28

Applicant: Noboru Monma ,  Iwao Maekawa ,  Tutomu Sarudate ,  Hidetaka Sato ,  Isao Uchigasaki

Inventor： Noboru Monma ,  Iwao Maekawa ,  Tutomu Sarudate ,  Hidetaka Sato ,  Isao Uchigasaki

IPC: C08L67/00 ,  C08F299/04 ,  C08G63/00 ,  C08G63/52 ,  C08G63/553 ,  C08G63/676 ,  C08L67/06 ,  H01B3/42

CPC classification number: H01B3/425 ,  C08G63/553 ,  C08G63/676 ,  C08L67/06

Abstract: A resin composition comprising (A) 25 to 45 parts by weight of an unsaturated polyester having special structure, (B) 40 to 60 parts by weight of polymerizable monomer such as styrene, and (C) 4.5 to 15 parts by weight of a polystyrene, has low shrink properties and excellent electrical properties when molded, particularly by casting.

Abstract translation: 一种树脂组合物，其包含（A）25〜45重量份的具有特殊结构的不饱和聚酯，（B）40〜60重量份聚合性单体如苯乙烯，（C）4.5〜15重量份聚苯乙烯 ，特别是通过铸造时，具有低的收缩性能和优异的电性能。