Invention Grant
- Patent Title: Wiring-connecting material and wiring-connected board production process using the same
- Patent Title (中): 接线材料和接线板生产工艺使用相同
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Application No.: US10846507Application Date: 2004-05-17
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Publication No.: US07141645B2Publication Date: 2006-11-28
- Inventor: Tohru Fujinawa , Masami Yusa , Satoyuki Nomura , Hiroshi Ono , Itsuo Watanabe , Motohiro Arifuku , Hoko Kanazawa
- Applicant: Tohru Fujinawa , Masami Yusa , Satoyuki Nomura , Hiroshi Ono , Itsuo Watanabe , Motohiro Arifuku , Hoko Kanazawa
- Applicant Address: JP Tokyo
- Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout and Kraus, LLP.
- Priority: JP11-238409 19990825; JP2000-92978 20000328
- Main IPC: C08F283/04
- IPC: C08F283/04
Abstract:
The present invention provides a wiring-connecting material comprising from 2 to 75 parts by weight of a polyurethane resin, from 30 to 60 parts by weight of a radical-polymerizable substance and from 0.1 to 30 parts by weight of a curing agent capable of generating a free radical upon heating, and a process for producing a wiring-connected board by using the wiring-connecting material. The wiring-connecting material of the present invention may preferably further contain a film-forming material and/or conductive particles.
Public/Granted literature
- US20040214979A1 Wiring-connecting material and wiring-connected board production process using the same Public/Granted day:2004-10-28
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