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39 条记录 (耗时 0.019 秒)

    SEMICONDUCTOR PACKAGE WITH REDUCED NOISE
    7.
    发明申请
    SEMICONDUCTOR PACKAGE WITH REDUCED NOISE 审中-公开

    公开(公告)号：US20200058633A1

    公开(公告)日：2020-02-20

    申请号：US16535019

    申请日：2019-08-07

    申请人： MEDIATEK INC.

    发明人： Sheng-Mou Lin ,  Wen-Chou Wu ,  Hsing-Chih Liu

    IPC分类号： H01L25/18 ,  H01L23/31 ,  H01L23/00 ,  H01L23/552

    摘要： The present disclosure provides a semiconductor package including a bottom package having a substrate, a radio-frequency (RF) die and a system-on-a-chip (SoC) die arranged on the substrate in a side-by-side manner, a molding compound covering the RF die and the SoC die, and an interposer over the molding compound. Connection elements and a column of signal interference shielding elements are disposed on the substrate. The connection elements surround the SoC die. The column of signal interference shielding elements is interposed between the RF die and the SoC die. A top package is mounted on the interposer.

    SEMICONDUCTOR DEVICE WITH AN EM-INTEGRATED DAMPER
    8.
    发明申请
    SEMICONDUCTOR DEVICE WITH AN EM-INTEGRATED DAMPER 审中-公开

    公开(公告)号：US20200051927A1

    公开(公告)日：2020-02-13

    申请号：US16539808

    申请日：2019-08-13

    申请人： MediaTek Inc.

    发明人： Yi-Chieh Lin ,  Sheng-Mou Lin ,  Wen-Chou Wu

    IPC分类号： H01L23/552 ,  H05K1/02 ,  H01L23/00 ,  H01L23/498

    摘要： A semiconductor device includes a first layer structure, a first layer structure, a second layer structure and a passive electronic component. The second layer structure is disposed below the first layer structure and coupled to a ground. The conductive structure is coupled to the first layer structure. The conductive structure is installed vertically between the first layer structure and the second layer structure, and is coupled to a first pad of the second layer structure. The passive electronic component comprises a first terminal coupled to the first pad of the second layer structure and a second terminal coupled to a second pad of the second layer structure. The conductive structure and the passive electronic component are connected in series between the first layer structure and the ground to form a conductive path for conducting at least one electromagnetic interference signal to the ground.

    RADAR MODULE INCORPORATED WITH A PATTERN-SHAPING DEVICE
    9.
    发明申请
    RADAR MODULE INCORPORATED WITH A PATTERN-SHAPING DEVICE 审中-公开

    公开(公告)号：US20190129023A1

    公开(公告)日：2019-05-02

    申请号：US16143470

    申请日：2018-09-27

    申请人： MEDIATEK INC.

    发明人： Yen-Ju Lu ,  Chih-Ming Hung ,  Wen-Chou Wu

    IPC分类号： G01S13/02 ,  H01L23/12 ,  H01L23/28 ,  H05K1/02 ,  H01Q1/24

    摘要： A radar module includes a printed circuit board (PCB) and a semiconductor package mounted on the PCB. The semiconductor package comprises an integrated circuit die and a substrate for electrically connecting the integrated circuit die to the PCB. The substrate comprises an antenna layer integrated into the semiconductor package and electrically connected to the integrated circuit die for at least one of transmitting and receiving radar signals. A discrete pattern-shaping device is mounted on the PCB and is configured to shape a radiation pattern of the radar signals.

    Semiconductor package assembly
    10.
    发明授权
    Semiconductor package assembly 有权

    公开(公告)号：US10068857B2

    公开(公告)日：2018-09-04

    申请号：US15794128

    申请日：2017-10-26

    申请人： MEDIATEK INC.

    发明人： Ruey-Bo Sun ,  Sheng-Mou Lin ,  Wen-Chou Wu

    IPC分类号： H01L23/552 ,  H01L23/66 ,  H01L23/495 ,  H01L49/02 ,  H01L23/522

    摘要： The invention provides a semiconductor package assembly. The semiconductor package assembly includes a substrate, a semiconductor die, a base and a first inductor structure. The substrate has a die-attach surface and a solder-ball-attach surface opposite to the die-attach surface. The semiconductor die is mounted on the die-attach surface of the substrate. The semiconductor die includes a radio-frequency (RF) circuit and a first RF die pad electrically connected to the RF circuit. The base is mounted on the solder-ball-attach surface of the substrate. The first inductor structure is positioned on the substrate, the semiconductor die or the base. The first inductor structure includes a first terminal electrically connected to the first die pad and a second terminal electrically connected to a ground terminal.