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公开(公告)号:US11837637B2
公开(公告)日:2023-12-05
申请号:US17399318
申请日:2021-08-11
发明人: Hiro Gangi , Tomoaki Inokuchi , Yusuke Kobayashi , Hiroki Nemoto
CPC分类号: H01L29/404 , H01L29/407 , H01L29/7813
摘要: According to one embodiment, a semiconductor device includes first to third electrodes, first and second conductive members, a semiconductor member, and a first insulating member. The first conductive member is electrically connected with the second electrode or is electrically connectable with the second electrode. The semiconductor member includes first to third semiconductor regions. The first semiconductor region includes first to fourth partial regions. The third partial region is between the first and second partial regions. The second semiconductor region is between the third partial region and the third semiconductor region. The fourth partial region is between the third partial region and the second semiconductor region. At least a portion of the second semiconductor region is between the second conductive member and the third electrode. The second conductive member is electrically insulated from the second and third electrodes. The first insulating member includes first to third insulating regions.
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公开(公告)号:US20220231135A1
公开(公告)日:2022-07-21
申请号:US17399318
申请日:2021-08-11
发明人: Hiro Gangi , Tomoaki Inokuchi , Yusuke Kobayashi , Hiroki Nemoto
摘要: According to one embodiment, a semiconductor device includes first to third electrodes, first and second conductive members, a semiconductor member, and a first insulating member. The first conductive member is electrically connected with the second electrode or is electrically connectable with the second electrode. The semiconductor member includes first to third semiconductor regions. The first semiconductor region includes first to fourth partial regions. The third partial region is between the first and second partial regions. The second semiconductor region is between the third partial region and the third semiconductor region. The fourth partial region is between the third partial region and the second semiconductor region. At least a portion of the second semiconductor region is between the second conductive member and the third electrode. The second conductive member is electrically insulated from the second and third electrodes. The first insulating member includes first to third insulating regions.
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公开(公告)号:US11017827B2
公开(公告)日:2021-05-25
申请号:US16132991
申请日:2018-09-17
发明人: Tomoaki Inokuchi , Naoharu Shimomura , Katsuhiko Koui , Yuuzo Kamiguchi , Kazutaka Ikegami , Shinobu Fujita , Hiroaki Yoda
摘要: A magnetic device includes: a first conductive layer; a first magnetoresistive effect element disposed on the first conductive layer and including a first control terminal; and a first circuit configured to supply a first current in a first direction into the first conductive layer and apply a first control voltage to the first control terminal of the first magnetoresistive effect element, wherein in a case in which the first current is supplied to the first conductive layer, the first magnetoresistive effect element holds a value corresponding to a logical disjunction between a first value of first data in the first magnetoresistive effect element and a second value of the first control voltage corresponding to second data.
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公开(公告)号:US10347313B2
公开(公告)日:2019-07-09
申请号:US15915654
申请日:2018-03-08
发明人: Naoharu Shimomura , Tomoaki Inokuchi , Katsuhiko Koui , Yuzo Kamiguchi , Hiroaki Yoda , Hideyuki Sugiyama
摘要: According to one embodiment, a magnetic memory includes: magnetoresistive effect elements arranged on an conductive layer; and a first circuit which passes a write current through the conductive layer and applies a control voltage to the magnetoresistive effect elements, to write data including a first value and a second value into the magnetoresistive effect elements. The first circuit adjusts at least one of a write sequence of the first value and the second value, a current value of the write current, and a pulse width of the write current, on the basis of an arrangement of the first value and the second value in the data.
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公开(公告)号:US10170694B1
公开(公告)日:2019-01-01
申请号:US15911341
申请日:2018-03-05
发明人: Satoshi Shirotori , Yuichi Ohsawa , Hideyuki Sugiyama , Mariko Shimizu , Altansargai Buyandalai , Naoharu Shimomura , Katsuhiko Koui , Tomoaki Inokuchi , Hiroaki Yoda
摘要: A magnetic memory of an embodiment includes: a first conductive layer, which is nonmagnetic and includes at least a first element, the first conductive layer including a first to fifth regions; a first magnetoresistive element disposed corresponding to the third region and including a first magnetic layer, a second magnetic layer including at least a second element, a first nonmagnetic layer disposed between the first magnetic layer and the second magnetic layer, a second nonmagnetic layer disposed between the second magnetic layer and the first nonmagnetic layer and including at least a third element, and a third magnetic layer disposed between the second nonmagnetic layer and the first nonmagnetic layer; a second conductive layer disposed corresponding to the second region and including at least the first to third elements; and a third conductive layer disposed corresponding to the fourth region, and including at least the first to third elements.
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公开(公告)号:US10102894B2
公开(公告)日:2018-10-16
申请号:US15698242
申请日:2017-09-07
发明人: Naoharu Shimomura , Tomoaki Inokuchi , Hiroki Noguchi , Katsuhiko Koui , Yuuzo Kamiguchi , Kazutaka Ikegami , Hiroaki Yoda
摘要: A magnetic memory includes: a first and second terminals; a conductive layer including first to fourth regions, the first and fourth regions being electrically connected to the first and second terminals respectively; a first magnetoresistive element including: a first and second magnetic layers; a first nonmagnetic layer between the first and second magnetic layers; and a third terminal electrically connected to the first magnetic layer; a second magnetoresistive element including: a third and fourth magnetic layers; a second nonmagnetic layer between the third and fourth magnetic layers; and a fourth terminal electrically connected to the third magnetic layer; and a circuit configured to apply a write current between the first terminal and the second terminal and apply a first and second potentials to the third and fourth terminals respectively to write the first and second magnetoresistive elements, the first and second potentials being different from each other.
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公开(公告)号:US20180114558A1
公开(公告)日:2018-04-26
申请号:US15848022
申请日:2017-12-20
发明人: Hiroaki Yoda , Naoharu Shimomura , Yuichi Ohsawa , Tadaomi Daibou , Tomoaki Inokuchi , Satoshi Shirotori , Altansargai Buyandalai , Yuuzo Kamiguchi
CPC分类号: G11C11/1675 , G11C11/15 , G11C11/16 , G11C11/1659 , G11C11/1673 , H01L27/224 , H01L27/228 , H01L43/02 , H01L43/08
摘要: A magnetic memory according to an embodiment includes: a conductive layer including a first and second terminals; a plurality of magnetoresistive elements separately disposed on the conductive layer between the first and second terminals, each magnetoresistive element including a reference layer, a storage layer between the reference layer and the conductive layer, and a nonmagnetic layer between the storage layer and the reference layer; and a circuit configured to apply a first potential to the reference layers of the magnetoresistive elements and to flow a first write current between the first and second terminals, and configured to apply a second potential to the reference layer or the reference layers of one or more of the magnetoresistive elements to which data is to be written, and to flow a second write current between the first and second terminals in an opposite direction to the first write current.
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公开(公告)号:US09916882B2
公开(公告)日:2018-03-13
申请号:US15262139
申请日:2016-09-12
发明人: Satoshi Shirotori , Hiroaki Yoda , Yuichi Ohsawa , Yuuzo Kamiguchi , Naoharu Shimomura , Tadaomi Daibou , Tomoaki Inokuchi
CPC分类号: H01L43/08 , G11C11/161 , G11C11/1655 , G11C11/1659 , G11C11/1673 , G11C11/1675 , G11C11/18 , H01L23/528 , H01L27/228 , H01L43/02 , H01L43/10
摘要: A magnetic memory of an embodiment includes: a first to third terminals; a magnetoresistive element including a first magnetic layer, a second magnetic layer, and a first nonmagnetic layer; a second nonmagnetic layer including a first to third portions, the first portion being located between the second and the third portions, the second and third portions being electrically connected to the second and third terminals respectively, the first magnetic layer being disposed between the first portion and the first nonmagnetic layer; and a third nonmagnetic layer including a fourth to sixth portions, the fourth portion being located between the first portion and the first magnetic layer, the fifth portion including a first region extending from the magnetoresistive element to the second terminal, the sixth portion including a second region extending from the magnetoresistive element to the third terminal.
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公开(公告)号:US09842635B2
公开(公告)日:2017-12-12
申请号:US15063808
申请日:2016-03-08
CPC分类号: G11C11/161 , G11C11/15 , G11C11/165 , H01L29/66984 , H03K19/18
摘要: A spin transistor memory according to an embodiment includes: a first semiconductor region, a second semiconductor region, and a third semiconductor region, each being of a first conductivity type and disposed in a semiconductor layer; a first gate disposed above the semiconductor layer between the first semiconductor region and the second semiconductor region; a second gate disposed above the semiconductor layer between the second semiconductor region and the third semiconductor region; and a first ferromagnetic layer, a second ferromagnetic layer, and a third ferromagnetic layer disposed on the first semiconductor region, the second semiconductor region, and the third semiconductor region respectively.
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10.
公开(公告)号:US08981436B2
公开(公告)日:2015-03-17
申请号:US14041055
申请日:2013-09-30
IPC分类号: H01L21/02 , H01L27/108 , H01L29/94 , H01L29/82 , H01L21/00 , H01L43/10 , H01L29/66 , H03K19/173 , H03K19/18 , H03K19/177
CPC分类号: H01L43/10 , H01L29/66984 , H03K19/1733 , H03K19/17728 , H03K19/18
摘要: A stacked structure according to an embodiment includes: a semiconductor layer; a first layer formed on the semiconductor layer, the first layer containing at least one element selected from Zr, Ti, and Hf, the first layer being not thinner than a monoatomic layer and not thicker than a pentatomic layer; a tunnel barrier layer formed on the first layer; and a magnetic layer formed on the tunnel barrier layer.
摘要翻译: 根据实施例的堆叠结构包括:半导体层; 形成在所述半导体层上的第一层,所述第一层含有选自Zr,Ti和Hf中的至少一种元素,所述第一层不比单原子层薄,并且不比五原子层厚; 形成在所述第一层上的隧道势垒层; 以及形成在隧道势垒层上的磁性层。
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