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    Heat sink thermal press for phase change heat sink material
    1.
    发明授权
    Heat sink thermal press for phase change heat sink material 有权
    散热用热压机用于相变散热材料

    公开(公告)号：US09036354B2

    公开(公告)日：2015-05-19

    申请号：US13742208

    申请日：2013-01-15

    Applicant: Flextronics AP, LLC

    Inventor： Dason Cheung ,  Murad Kurwa ,  Richard Loi

    IPC: H05K3/00 ,  B23P15/26 ,  F28F7/00 ,  G05B19/02 ,  H01L21/48 ,  H05K13/00 ,  H05K13/04 ,  H05K1/02

    CPC classification number: F28F7/00 ,  G05B19/02 ,  G05B19/056 ,  H01L21/4882 ,  H05K1/0209 ,  H05K13/00 ,  H05K2201/066 ,  H05K2201/09781 ,  Y10T29/4935 ,  Y10T29/49385 ,  Y10T29/49995 ,  Y10T29/53113 ,  Y10T29/53174

    Abstract: Methods of and apparatuses for electronic board assembly are provided. The apparatus can comprises one or more thermal heads controlled by a programmable logic controller. A user is able to enter the controlling parameters into the programmable logic controller through an human operator interface. The thermal heads are able to be connected with one or more pneumatic solenoid to make the thermal heads moving vertically until the thermal head in contact with the heat sink. The thermal head is able to provide a temperature, at or above the operating temperature of the thermal pad, capable of making the phase change thermal interface material to bond the heat sink and the electronic boards.

    Abstract translation: 提供了电子板组装的方法和设备。 该装置可以包括由可编程逻辑控制器控制的一个或多个热敏头。 用户能够通过人机界面将控制参数输入到可编程逻辑控制器中。 热敏头能够与一个或多个气动螺线管连接，使热敏头垂直移动，直到热敏头与散热片接触。 热敏头能够提供等于或高于热垫的操作温度的温度，其能够使相变热界面材料结合散热器和电子板。

    Hot bar soldering
    3.
    发明授权
    Hot bar soldering 有权
    热棒焊接

    公开(公告)号：US09180540B1

    公开(公告)日：2015-11-10

    申请号：US13946722

    申请日：2013-07-19

    Applicant: Flextronics AP, LLC

    Inventor： Dason Cheung ,  Mario Lopez Ruiz ,  Richard Loi ,  Murad Kurwa

    IPC: B23K31/02 ,  B23K3/047 ,  B23K3/08 ,  B23K3/04 ,  B23K1/008 ,  B23K1/018 ,  B23K1/00 ,  B23K1/08 ,  B23K1/002 ,  B23K1/005 ,  B23K1/012

    CPC classification number: H01L31/048 ,  B23K1/0016 ,  B23K1/002 ,  B23K1/0053 ,  B23K1/008 ,  B23K1/012 ,  B23K1/018 ,  B23K1/08 ,  B23K1/20 ,  B23K3/04 ,  B23K3/047 ,  B23K3/0471 ,  B23K3/08 ,  B23K2101/38 ,  H01L31/0547 ,  H01L2924/0002 ,  Y02E10/52 ,  H01L2924/0001

    Abstract: A solar cell module comprises a solar cell die that is soldered to a substrate. The substrate comprises one or more power contacts. A power conductor is soldered to a power contact, thereby electrically coupling the power conductor to the solar cell die. A pre-heat module heats a first side of the substrate at a first area to a first temperature for a first duration. Then, a solder heat source solders a power conductor to a power contact at a second area of the substrate at a second temperature for a second duration. The resulting solder connection at the power conductor is less prone to cold-solder defects. The temperature of the pre-heat module is controlled to promote curing of an RTV sealant used in the manufacture of the solar cell module. The temperature of the solder heat source is controlled to avoid burning and degrading of the RTV sealant.

    Abstract translation: 太阳能电池模块包括焊接到基板的太阳能电池模具。 衬底包括一个或多个电源触点。 电力导体焊接到电源触点，从而将电力导体电耦合到太阳能电池模具。 预热模块将第一区域的衬底的第一侧加热至第一温度持续第一时间。 然后，焊接热源在第二温度下将功率导体焊接到衬底的第二区域处的功率接触持续第二持续时间。 在电源导体处产生的焊接连接不太容易发生冷焊缺陷。 控制预热模块的温度以促进用于制造太阳能电池模块的RTV密封剂的固化。 控制焊料热源的温度以避免RTV密封胶的燃烧和降解。

    SOLAR CELL PAD DRESSING
    4.
    发明申请
    SOLAR CELL PAD DRESSING 有权
    太阳能电池板接头

    公开(公告)号：US20140034708A1

    公开(公告)日：2014-02-06

    申请号：US13953538

    申请日：2013-07-29

    Applicant: Flextronics AP, LLC

    Inventor： Dason Cheung ,  Murad Kurwa ,  Richard Loi ,  Tor Krog

    IPC: H01L31/18

    CPC classification number: H01L31/186 ,  B23K1/0016 ,  B23K1/0056 ,  B23K1/018 ,  B23K1/203 ,  B23K3/00 ,  B23K3/029 ,  B23K3/08 ,  B23K37/00 ,  H01L2924/0002 ,  H05K3/225 ,  H05K3/3494 ,  H05K13/0465 ,  H05K13/0486 ,  Y02E10/50 ,  Y02P70/521 ,  H01L2924/0001

    Abstract: A process for dressing a solder pad removes excess solder from locations that should be free of solder, such as circuit traces, other solder pads, and components near the solder pad being dressed. A first area of a substrate comprises solder to be removed and is heated to a first temperature. A second area of the substrate is heated to a second temperature. A vacuum nozzle is heated to a third temperature sufficient to melt the solder and is scanned across the area to be dressed, melting and vacuuming away the excess solder. The scanning process is controlled using a computer numerical controlled (CNC) machine.

    Abstract translation: 用于修整焊料焊盘的工艺从应该没有焊料的位置去除多余的焊料，例如电路迹线，其它焊盘和焊接垫附近的部件被修整。 衬底的第一区域包括待除去的焊料并被加热到第一温度。 衬底的第二区域被加热到第二温度。 将真空喷嘴加热到足以熔化焊料的第三温度，并扫过整个区域以进行修整，熔化和抽真空以除去多余的焊料。 扫描过程使用计算机数控（CNC）机器进行控制。

    HEAT SINK THERMAL PRESS FOR PHASE CHANGE HEAT SINK MATERIAL
    6.
    发明申请
    HEAT SINK THERMAL PRESS FOR PHASE CHANGE HEAT SINK MATERIAL 有权
    用于相变热消耗材料的热沉热压机

    公开(公告)号：US20140196879A1

    公开(公告)日：2014-07-17

    申请号：US13742208

    申请日：2013-01-15

    Applicant: Flextronics AP, LLC

    Inventor： Dason Cheung ,  Murad Kurwa ,  Richard Loi

    IPC: F28F7/00 ,  B23P15/26 ,  G05B19/02

    CPC classification number: F28F7/00 ,  G05B19/02 ,  G05B19/056 ,  H01L21/4882 ,  H05K1/0209 ,  H05K13/00 ,  H05K2201/066 ,  H05K2201/09781 ,  Y10T29/4935 ,  Y10T29/49385 ,  Y10T29/49995 ,  Y10T29/53113 ,  Y10T29/53174

    Abstract: Methods of and apparatuses for electronic board assembly are provided. The apparatus can comprises one or more thermal heads controlled by a programmable logic controller. A user is able to enter the controlling parameters into the programmable logic controller through an human operator interface. The thermal heads are able to be connected with one or more pneumatic solenoid to make the thermal heads moving vertically until the thermal head in contact with the heat sink. The thermal head is able to provide a temperature, at or above the operating temperature of the thermal pad, capable of making the phase change thermal interface material to bond the heat sink and the electronic boards.

    Abstract translation: 提供了电子板组装的方法和设备。 该装置可以包括由可编程逻辑控制器控制的一个或多个热敏头。 用户能够通过人机界面将控制参数输入到可编程逻辑控制器中。 热敏头能够与一个或多个气动螺线管连接，使热敏头垂直移动，直到热敏头与散热片接触。 热敏头能够提供等于或高于热垫的操作温度的温度，其能够使相变热界面材料结合散热器和电子板。

    ENERGY SAVING-EXHAUST CONTROL AND AUTO SHUT OFF SYSTEM
    7.
    发明申请
    ENERGY SAVING-EXHAUST CONTROL AND AUTO SHUT OFF SYSTEM 有权
    能量节省 - 排气控制和自动关闭系统

    公开(公告)号：US20140127987A1

    公开(公告)日：2014-05-08

    申请号：US14067665

    申请日：2013-10-30

    Applicant: Flextronics AP, LLC

    Inventor： Dason Cheung ,  Murad Kurwa ,  Richard Loi

    IPC: F24F11/00

    CPC classification number: F24F11/0079 ,  F24F11/0001 ,  F24F11/77 ,  F24F2007/001 ,  F24F2011/0024 ,  F24F2011/0042 ,  F24F2110/40 ,  F24F2110/62 ,  Y02B30/746 ,  Y02B30/78

    Abstract: An energy-efficient ventilation system comprises a ventilation fan, ductwork, system controller, and a plurality of ventilation points, each comprising a damper, a differential pressure sensor, a ventilation point controller, and a fume detector. When a ventilation point does not require ventilation, a signal is sent to the system controller to reduce the ventilation fan speed thereby using only as much energy as is needed to provide service to the ventilation points that need ventilation. The fume detector, damper, and differential pressure sensor for each ventilation point are used to determine whether ventilation is needed at a ventilation point and to control the ventilation point accordingly.

    Abstract translation: 节能通风系统包括通风扇，管道系统，系统控制器和多个通风点，每个通风点包括阻尼器，差压传感器，通气点控制器和烟雾检测器。 当通风点不需要通风时，信号将发送到系统控制器，以减少通风扇速度，从而只需要为需要通风的通风口提供服务所需的能量。 用于每个通气点的​​烟气探测器，阻尼器和差压传感器用于确定通风点是否需要通风并相应地控制通风点。

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