公开(公告)号：US09293636B2

公开(公告)日：2016-03-22

申请号：US13953538

申请日：2013-07-29

Applicant: Flextronics AP, LLC

Inventor： Dason Cheung ,  Murad Kurwa ,  Richard Loi ,  Tor Krog

IPC: B23K1/00 ,  B23K1/018 ,  H01L31/18 ,  B23K3/02 ,  B23K37/00 ,  B23K1/005 ,  B23K3/08 ,  B23K1/20 ,  B23K3/00 ,  H05K13/04 ,  H05K3/22 ,  H05K3/34

CPC classification number: H01L31/186 ,  B23K1/0016 ,  B23K1/0056 ,  B23K1/018 ,  B23K1/203 ,  B23K3/00 ,  B23K3/029 ,  B23K3/08 ,  B23K37/00 ,  H01L2924/0002 ,  H05K3/225 ,  H05K3/3494 ,  H05K13/0465 ,  H05K13/0486 ,  Y02E10/50 ,  Y02P70/521 ,  H01L2924/0001

Abstract: A process for dressing a solder pad removes excess solder from locations that should be free of solder, such as circuit traces, other solder pads, and components near the solder pad being dressed. A first area of a substrate comprises solder to be removed and is heated to a first temperature. A second area of the substrate is heated to a second temperature. A vacuum nozzle is heated to a third temperature sufficient to melt the solder and is scanned across the area to be dressed, melting and vacuuming away the excess solder. The scanning process is controlled using a computer numerical controlled (CNC) machine.

Abstract translation: 用于修整焊料焊盘的工艺从应该没有焊料的位置去除多余的焊料，例如电路迹线，其它焊盘和焊接垫附近的部件被修整。 衬底的第一区域包括待除去的焊料并被加热到第一温度。 衬底的第二区域被加热到第二温度。 将真空喷嘴加热到足以熔化焊料的第三温度，并扫过整个区域以进行修整，熔化和抽真空以除去多余的焊料。 扫描过程使用计算机数控（CNC）机器进行控制。

公开(公告)号：US20140034708A1

公开(公告)日：2014-02-06

申请号：US13953538

申请日：2013-07-29

Applicant: Flextronics AP, LLC

Inventor： Dason Cheung ,  Murad Kurwa ,  Richard Loi ,  Tor Krog

IPC: H01L31/18

CPC classification number: H01L31/186 ,  B23K1/0016 ,  B23K1/0056 ,  B23K1/018 ,  B23K1/203 ,  B23K3/00 ,  B23K3/029 ,  B23K3/08 ,  B23K37/00 ,  H01L2924/0002 ,  H05K3/225 ,  H05K3/3494 ,  H05K13/0465 ,  H05K13/0486 ,  Y02E10/50 ,  Y02P70/521 ,  H01L2924/0001

Abstract: A process for dressing a solder pad removes excess solder from locations that should be free of solder, such as circuit traces, other solder pads, and components near the solder pad being dressed. A first area of a substrate comprises solder to be removed and is heated to a first temperature. A second area of the substrate is heated to a second temperature. A vacuum nozzle is heated to a third temperature sufficient to melt the solder and is scanned across the area to be dressed, melting and vacuuming away the excess solder. The scanning process is controlled using a computer numerical controlled (CNC) machine.

Abstract translation: 用于修整焊料焊盘的工艺从应该没有焊料的位置去除多余的焊料，例如电路迹线，其它焊盘和焊接垫附近的部件被修整。 衬底的第一区域包括待除去的焊料并被加热到第一温度。 衬底的第二区域被加热到第二温度。 将真空喷嘴加热到足以熔化焊料的第三温度，并扫过整个区域以进行修整，熔化和抽真空以除去多余的焊料。 扫描过程使用计算机数控（CNC）机器进行控制。

公开(公告)号：US09789572B1

公开(公告)日：2017-10-17

申请号：US14531769

申请日：2014-11-03

Applicant: Flextronics AP, LLC

Inventor： Dason Cheung ,  Murad Kurwa ,  Tor Krog ,  Xiuchuan Wang ,  Hao Tan

IPC: B23P21/00

CPC classification number: B23P21/004

Abstract: A universal automation line is configured for the assembly of electronics and mechanical devices. The universal automation line includes universal cells or stations that can be programmed to perform a variety of automated assembly tasks such as glue dispensing, screw driving, pick and place, etc. The stations are interchangeable by different module design such as selective soldering, heat stacking, bottom lead trimming, bottom screwing and ultrasonic welding. Each station can also include an automated robot, which is also interchangeable, to perform different tasks and complete fully automated assemblies. The stations can be sequenced inline for a fully automated line or combined with some manual operation. The stations can communicate by standardized interfaces and local networks, and can be expanded to an intranet or the internet for remote control.