公开(公告)号：US07833832B2

公开(公告)日：2010-11-16

申请号：US12412906

申请日：2009-03-27

申请人： Alan G. Wood ,  Warren M. Farnworth ,  David R. Hembree

发明人： Alan G. Wood ,  Warren M. Farnworth ,  David R. Hembree

IPC分类号： H01L21/00 ,  H01L29/06 ,  H05K1/03

CPC分类号： H01L23/3114 ,  B33Y70/00 ,  B81B7/0006 ,  H01L21/76898 ,  H01L23/13 ,  H01L23/481 ,  H01L24/48 ,  H01L27/14618 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/45015 ,  H01L2224/45624 ,  H01L2224/45655 ,  H01L2224/45664 ,  H01L2224/4813 ,  H01L2224/48471 ,  H01L2224/85045 ,  H01L2224/85207 ,  H01L2224/85951 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/181 ,  Y10T29/49147 ,  H01L2924/20752 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A method for fabricating a semiconductor component with through interconnects can include the steps of providing a semiconductor substrate with substrate contacts, and forming openings from a backside of the substrate aligned with the substrate contacts. The method can also include the steps of providing an interposer substrate (or alternately a second semiconductor substrate), forming projections on the interposer substrate (or on the second semiconductor substrate), and forming conductive vias in the projections. The method can also include the steps of placing the projections in physical contact with the openings, and placing the conductive vias in electrical contact with the substrate contacts. The method can also include the steps of bonding the conductive vias to the substrate contacts, and forming terminal contacts on the interposer substrate (or alternately on one of the semiconductor substrates) in electrical communication with the conductive vias.

摘要翻译： 用于通过互连制造半导体部件的方法可以包括以下步骤：提供具有衬底触点的半导体衬底，以及从与衬底触点对准的衬底的背面形成开口。 该方法还可以包括提供插入器衬底（或者替代地第二半导体衬底）的步骤，在插入器衬底（或第二半导体衬底上）上形成突起，并在突起中形成导电通孔。 该方法还可以包括以下步骤：将突起放置在与开口物理接触的位置，并且将导电通孔放置在与基板触点电接触的位置。 该方法还可以包括以下步骤：将导电通孔接合到基板触点，以及在内导体基板（或者替代地在其中一个半导体基板上）上形成与导电通孔电连通的端子触点。

公开(公告)号：US07709776B2

公开(公告)日：2010-05-04

申请号：US12390195

申请日：2009-02-20

申请人： Warren M. Farnworth ,  Sidney B. Rigg ,  William Mark Hiatt ,  Alan G. Wood ,  Peter A. Benson ,  James M. Wark ,  David R. Hembree ,  Kyle K. Kirby ,  Charles M. Watkins ,  Salman Akram

发明人： Warren M. Farnworth ,  Sidney B. Rigg ,  William Mark Hiatt ,  Alan G. Wood ,  Peter A. Benson ,  James M. Wark ,  David R. Hembree ,  Kyle K. Kirby ,  Charles M. Watkins ,  Salman Akram

IPC分类号： H01L27/00 ,  H01L31/0232

CPC分类号： H01L27/00 ,  B33Y80/00 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14683 ,  H01L27/14687 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/00014

摘要： Microelectronic imager assemblies comprising a workpiece including a substrate and a plurality of imaging dies on and/or in the substrate. The substrate includes a front side and a back side, and the imaging dies comprise imaging sensors at the front side of the substrate and external contacts operatively coupled to the image sensors. The microelectronic imager assembly further comprises optics supports superimposed relative to the imaging dies. The optics supports can be directly on the substrate or on a cover over the substrate. Individual optics supports can have (a) an opening aligned with one of the image sensors, and (b) a bearing element at a reference distance from the image sensor. The microelectronic imager assembly can further include optical devices mounted or otherwise carried by the optics supports.

摘要翻译： 微电子成像器组件包括包括衬底的工件和在衬底上和/或衬底中的多个成像管芯。 基板包括前侧和后侧，并且成像管芯包括在基板的前侧的成像传感器和可操作地耦合到图像传感器的外部触点。 微电子成像器组件还包括相对于成像管芯叠加的光学支架。 光学支撑件可以直接在基板上或衬底上的盖上。 单个光学支撑件可以具有（a）与图像传感器中的一个对准的开口，以及（b）与图像传感器相距一定距离处的轴承元件。 微电子成像器组件还可以包括由光学器件支撑件安装或以其它方式承载的光学器件。

公开(公告)号：US20090155949A1

公开(公告)日：2009-06-18

申请号：US12390195

申请日：2009-02-20

申请人： Warren M. Farnworth ,  Sidney B. Rigg ,  William Mark Hiatt ,  Alan G. Wood ,  Peter A. Benson ,  James M. Wark ,  David R. Hembree ,  Kyle K. Kirby ,  Charles M. Watkins ,  Salman Akram

发明人： Warren M. Farnworth ,  Sidney B. Rigg ,  William Mark Hiatt ,  Alan G. Wood ,  Peter A. Benson ,  James M. Wark ,  David R. Hembree ,  Kyle K. Kirby ,  Charles M. Watkins ,  Salman Akram

IPC分类号： H01L31/0232

CPC分类号： H01L27/00 ,  B33Y80/00 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14683 ,  H01L27/14687 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/00014

摘要： Microelectronic imager assemblies comprising a workpiece including a substrate and a plurality of imaging dies on and/or in the substrate. The substrate includes a front side and a back side, and the imaging dies comprise imaging sensors at the front side of the substrate and external contacts operatively coupled to the image sensors. The microelectronic imager assembly further comprises optics supports superimposed relative to the imaging dies. The optics supports can be directly on the substrate or on a cover over the substrate. Individual optics supports can have (a) an opening aligned with one of the image sensors, and (b) a bearing element at a reference distance from the image sensor. The microelectronic imager assembly can further include optical devices mounted or otherwise carried by the optics supports.

摘要翻译： 微电子成像器组件包括包括衬底的工件和在衬底上和/或衬底中的多个成像管芯。 基板包括前侧和后侧，并且成像管芯包括在基板的前侧的成像传感器和可操作地耦合到图像传感器的外部触点。 微电子成像器组件还包括相对于成像管芯叠加的光学支架。 光学支撑件可以直接在基板上或衬底上的盖上。 单个光学支撑件可以具有（a）与图像传感器中的一个对准的开口，以及（b）与图像传感器相距一定距离处的轴承元件。 微电子成像器组件还可以包括由光学器件支撑件安装或以其它方式承载的光学器件。

公开(公告)号：US07459393B2

公开(公告)日：2008-12-02

申请号：US11497699

申请日：2006-08-02

申请人： Warren M. Farnworth ,  Alan G. Wood ,  William M. Hiatt ,  James M. Wark ,  David R. Hembree ,  Kyle K. Kirby ,  Pete A. Benson

发明人： Warren M. Farnworth ,  Alan G. Wood ,  William M. Hiatt ,  James M. Wark ,  David R. Hembree ,  Kyle K. Kirby ,  Pete A. Benson

IPC分类号： H01L21/44

CPC分类号： H01L21/561 ,  B33Y70/00 ,  B33Y80/00 ,  H01L21/563 ,  H01L21/76898 ,  H01L23/3114 ,  H01L23/481 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68331 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05111 ,  H01L2224/05118 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05171 ,  H01L2224/05178 ,  H01L2224/0518 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/05559 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/13005 ,  H01L2224/13006 ,  H01L2224/13009 ,  H01L2224/13024 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06582 ,  H01L2225/06596 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/18161 ,  H01L2924/19015 ,  H01L2924/19041 ,  H01L2924/351 ,  H01L2924/207 ,  H01L2224/05552 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/013

摘要： A method for fabricating a semiconductor component includes the steps of providing a substrate having a contact on a circuit side thereof, forming an opening from a backside of the substrate to the contact, forming a conductive via in the opening in electrical contact with a surface of the contact, and forming a second contact on the back side in electrical communication with the conductive via. The method can also include the steps of thinning the substrate from the backside, forming insulating layers on the circuit side and the backside, and forming a conductor and terminal contact on the circuit side in electrical communication with the conductive via. A semiconductor component includes the contact on the circuit side, the conductive via in electrical contact with the contact, and the second contact on the backside in electrical communication with the conductive via. The semiconductor component can also include the insulating layers, the conductor and the terminal contact.

摘要翻译： 一种制造半导体部件的方法包括以下步骤：提供在其电路侧具有接触的基板，从基板的背面形成开口到触点，在开口中形成导电通孔，该导电通孔与 接触，并且在背面形成与导电通孔电连通的第二接触。 该方法还可以包括从背面减薄衬底的步骤，在电路侧和背面形成绝缘层，以及在电路侧形成与导电通孔电连通的导体和端子触点。 半导体部件包括电路侧的触点，与触点电接触的导电通孔以及与导电通路电气连通的背侧的第二触点。 半导体部件还可以包括绝缘层，导体和端子触头。

公开(公告)号：US07358751B2

公开(公告)日：2008-04-15

申请号：US11152513

申请日：2005-06-14

申请人： Kyle K. Kirby ,  Warren M. Farnworth ,  James M. Wark ,  William M. Hiatt ,  David R. Hembree ,  Alan G. Wood

发明人： Kyle K. Kirby ,  Warren M. Farnworth ,  James M. Wark ,  William M. Hiatt ,  David R. Hembree ,  Alan G. Wood

IPC分类号： G01R31/02

CPC分类号： G01R1/0735 ,  G01R1/07314 ,  H01L23/13 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49827 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01R12/714 ,  H01R13/24 ,  H01R2201/20 ,  H05K3/326 ,  H05K7/1069 ,  H05K2201/0314 ,  H05K2201/09036 ,  H05K2201/10378 ,  Y10T29/49165 ,  Y10T29/49174 ,  Y10T29/49204 ,  Y10T29/49222 ,  H01L2224/05599

摘要： A compliant contact pin assembly and a contactor card system are provided. The compliant contact pin assembly includes a contact pin formed from a portion of a substrate with the contact pin compliantly held suspended within the substrate by a compliant coupling structure. The suspension within the substrate results in a compliant deflection orthogonal to the plane of the substrate. The contact pin assembly is formed by generally thinning the substrate around the contact pin location and then specifically thinning the substrate immediately around the contact pin location for forming a void. The contact pin is compliantly coupled, in one embodiment by compliant coupling material, and in another embodiment by compliantly flexible portions of the substrate.

摘要翻译： 提供了柔性接触销组件和接触器卡系统。 柔性接触销组件包括由基板的一部分形成的接触销，其中触头销顺从地保持通过柔性联接结构悬挂在基板内。 衬底内的悬浮液导致与衬底的平面垂直的柔顺偏转。 接触销组件通过使基板围绕接触销位置大体变薄而形成，然后特别地使基板在接触销位置周围特别地变薄以形成空隙。 在一个实施例中，接触销被顺从地联接，在一个实施例中通过柔性耦合材料，并且在另一个实施例中，通过柔性柔性部分的衬底。

公开(公告)号：US07297563B2

公开(公告)日：2007-11-20

申请号：US11152433

申请日：2005-06-14

申请人： Kyle K. Kirby ,  Warren M. Farnworth ,  James M. Wark ,  William M. Hiatt ,  David R. Hembree ,  Alan G. Wood

发明人： Kyle K. Kirby ,  Warren M. Farnworth ,  James M. Wark ,  William M. Hiatt ,  David R. Hembree ,  Alan G. Wood

IPC分类号： H01L21/66 ,  H01L23/48 ,  H01K3/10 ,  H05K1/11

CPC分类号： G01R1/0735 ,  G01R1/07314 ,  H01L23/13 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49827 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01R12/714 ,  H01R13/24 ,  H01R2201/20 ,  H05K3/326 ,  H05K7/1069 ,  H05K2201/0314 ,  H05K2201/09036 ,  H05K2201/10378 ,  Y10T29/49165 ,  Y10T29/49174 ,  Y10T29/49204 ,  Y10T29/49222 ,  H01L2224/05599

摘要： A compliant contact pin contactor card method for making is provided. The compliant contact pin assembly includes a contact pin formed from a portion of a substrate with the contact pin compliantly held suspended within the substrate by a compliant coupling structure. The suspension within the substrate results in a compliant deflection orthogonal to the plane of the substrate. The contact pin assembly is formed by generally thinning the substrate around the contact pin location and then specifically thinning the substrate immediately around the contact pin location for forming a void. The contact pin is compliantly coupled, in one embodiment by compliant coupling material, and in another embodiment by compliantly flexible portions of the substrate.

摘要翻译： 提供一种兼容的接触针接触器卡制造方法。 柔性接触销组件包括由基板的一部分形成的接触销，其中触头销顺从地保持通过柔性联接结构悬挂在基板内。 衬底内的悬浮液导致与衬底的平面垂直的柔顺偏转。 接触销组件通过使基板围绕接触销位置大体变薄而形成，然后特别地使基板在接触销位置周围特别地变薄以形成空隙。 在一个实施例中，接触销被顺从地联接，在一个实施例中通过柔性耦合材料，并且在另一个实施例中，通过柔性柔性部分的衬底。

公开(公告)号：US07250780B2

公开(公告)日：2007-07-31

申请号：US10742729

申请日：2003-12-19

申请人： David R. Hembree ,  Warren M. Farnworth ,  Salman Akram ,  Alan G. Wood ,  C. Patrick Doherty ,  Andrew J. Krivy

发明人： David R. Hembree ,  Warren M. Farnworth ,  Salman Akram ,  Alan G. Wood ,  C. Patrick Doherty ,  Andrew J. Krivy

IPC分类号： G01R1/073 ,  G01R31/28

CPC分类号： G01R31/2886

摘要： A probe card for testing semiconductor wafers, and a method and system for testing wafers using the probe card are provided. The probe card is configured for use with a conventional testing apparatus, such as a wafer probe handler, in electrical communication with test circuitry. The probe card includes an interconnect substrate having contact members for establishing electrical communication with contact locations on the wafer. The probe card also includes a membrane for physically and electrically connecting the interconnect substrate to the testing apparatus, and a compressible member for cushioning the pressure exerted on the interconnect substrate by the testing apparatus. The interconnect substrate can be formed of silicon with raised contact members having penetrating projections. Alternately the contact members can be formed as indentations for testing bumped wafers. The membrane can be similar to multi layered TAB tape including metal foil conductors attached to a flexible, electrically-insulating, elastomeric tape. The probe card can be configured to contact all of the dice on the wafer at the same time, so that test signals can be electronically applied to selected dice as required.

摘要翻译： 提供了用于测试半导体晶片的探针卡，以及使用探针卡测试晶片的方法和系统。 探针卡被配置用于与测试电路电气通信的常规测试装置，例如晶片探测器处理器。 探针卡包括具有用于与晶片上的接触位置建立电连通的接触构件的互连基板。 探针卡还包括用于将互连基板物理和电连接到测试装置的膜，以及用于缓冲由测试装置施加在互连基板上的压力的可压缩构件。 互连衬底可以由具有穿透突起的凸起接触构件的硅形成。 或者，接触构件可以形成为用于测试凸起的晶片的凹陷。 膜可以类似于多层TAB带，其包括附接到柔性，电绝缘的弹性体带的金属箔导体。 探针卡可以配置为同时接触晶片上的所有骰子，以便测试信号可以根据需要以电子方式应用于选定的骰子。

公开(公告)号：US06619532B2

公开(公告)日：2003-09-16

申请号：US10196666

申请日：2002-07-15

申请人： David R. Hembree ,  Michael E. Hess ,  John O. Jacobson ,  Warren M. Farnworth ,  Alan G. Wood

发明人： David R. Hembree ,  Michael E. Hess ,  John O. Jacobson ,  Warren M. Farnworth ,  Alan G. Wood

IPC分类号： B23K2010

CPC分类号： B23K20/10 ,  B23K2101/38

摘要： A machine and method for bonding puncture-type conductive contact members of an interconnect to the bond pads of a bare semiconductor die includes the use of one or two ultrasonic vibrators mounted to vibrate one or both of the die and interconnect. A short axial linear burst of ultrasonic energy enables the contact members to pierce hard oxide layers on the surfaces of the bond pads at a much lower compressive force and rapidly achieve full penetration depth.

摘要翻译： 用于将互连的穿刺型导电接触构件接合到裸半导体管芯的接合焊盘的机器和方法包括使用安装成振动模具和互连中的一个或两者的一个或两个超声波振动器。 超声能量的短轴向线性爆发使得接触构件能够以低得多的压缩力在接合焊盘的表面上刺穿硬氧化物层并且迅速地实现完全的穿透深度。

公开(公告)号：US06392429B1

公开(公告)日：2002-05-21

申请号：US09594748

申请日：2000-06-14

申请人： David R. Hembree ,  Warren M. Farnworth ,  Alan G. Wood ,  Salman Akram

发明人： David R. Hembree ,  Warren M. Farnworth ,  Alan G. Wood ,  Salman Akram

IPC分类号： G01R3102

CPC分类号： H01L23/49838 ,  G01R1/0433 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/0735 ,  G01R3/00 ,  G01R31/2863 ,  H01L21/6835 ,  H01L22/20 ,  H01L23/13 ,  H01L23/49816 ,  H01L24/80 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15174 ,  H05K3/0058 ,  H05K3/0067 ,  H05K3/4007 ,  H05K3/423 ,  H05K2201/0133 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/0307 ,  H05K2203/0723 ,  H01L2224/05599

摘要： A temporary package for a semiconductor die is provided. The temporary package has an outline and external contact configuration that are the same as a conventional plastic or ceramic semiconductor package. The temporary package can be used for burn-in testing of the die using standard equipment. The die can then be removed from the package and certified as a known good die. The package includes a base, an interconnect and a force applying mechanism. The package base includes external contacts formed in a dense array, such as a land grid array (LGA), a pin grid array (PGA), a bumped grid array (BGA) or a perimeter array. The package base can be formed of ceramic or plastic with internal conductive lines using a ceramic lamination process, a 3-D molding process or a Cerdip formation process.

摘要翻译： 提供了一种用于半导体管芯的临时封装。 临时包装具有与常规塑料或陶瓷半导体封装相同的轮廓和外部接触构造。 临时包装可用于使用标准设备对模具进行老化测试。 然后可以将模具从包装中取出并被认证为已知的好的模具。 该包装包括底座，互连和力施加机构。 封装基座包括形成在密集阵列中的外部触头，例如焊盘格栅阵列（LGA），引脚格栅阵列（PGA），凸起栅格阵列（BGA）或周边阵列。 封装基底可以由具有内部导电线的陶瓷或塑料形成，使用陶瓷层压工艺，3-D成型工艺或Cerdip形成工艺。

公开(公告)号：US06320397B1

公开(公告)日：2001-11-20

申请号：US08614735

申请日：1996-03-13

申请人： Alan G. Wood ,  Warren M. Farnworth ,  David R. Hembree

发明人： Alan G. Wood ,  Warren M. Farnworth ,  David R. Hembree

IPC分类号： G01R1073

CPC分类号： G01R1/0466 ,  G01R1/0483 ,  G01R3/00 ,  G01R31/2863 ,  G01R31/2893 ,  H01L21/6835 ,  H01L22/20 ,  H01L23/13 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/75 ,  H01L24/80 ,  H01L24/85 ,  H01L2224/05553 ,  H01L2224/16145 ,  H01L2224/48 ,  H01L2224/75 ,  H01L2224/85001 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15174 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/3025 ,  H05K3/0058 ,  H05K3/0067 ,  H05K3/4007 ,  H05K3/423 ,  H05K2201/0133 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/0307 ,  H05K2203/0723 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49172 ,  H01L2224/78 ,  H01L2224/45099 ,  H01L2924/00

摘要： A carrier for testing an unpackaged semiconductor die is provided. The carrier includes a carrier base for supporting the die; an interconnect for establishing a temporary electrical connection with the die; and a force distribution mechanism for biasing the die and interconnect together. In an illustrative embodiment the carrier is formed with a laminated ceramic base. The ceramic base includes internal conductive lines that are wire bonded to the interconnect and metal plated external contacts that are connected to external test circuitry. In an alternate embodiment the carrier is formed with an injection molded plastic base and includes 3-D circuitry formed by a metallization and photolithographic process. In either case, the carrier is adapted for testing different die configurations by interchanging different interconnects.

摘要翻译： 提供了用于测试未封装的半导体管芯的载体。 载体包括用于支撑模具的载体基体; 用于建立与所述管芯的临时电连接的互连; 以及用于偏压模具并互连在一起的力分配机构。 在说明性实施例中，载体形成有层压陶瓷基底。 陶瓷基座包括内部导电线，引线连接到互连线和金属电镀外部触点，连接到外部测试电路。 在替代实施例中，载体由注射成型的塑料基底形成，并且包括通过金属化和光刻工艺形成的3-D电路。 在任一情况下，载体适于通过互换不同的互连来测试不同的管芯配置。