公开(公告)号：US20240044004A1

公开(公告)日：2024-02-08

申请号：US18381543

申请日：2023-10-18

Applicant: Applied Materials, Inc.

Inventor： Shu-Kwan LAU ,  Koji NAKANISHI ,  Toshiyuki NAKAGAWA ,  Zuoming ZHU ,  Zhiyuan YE ,  Joseph M. RANISH ,  Nyi Oo MYO ,  Errol Antonio C. SANCHEZ ,  Schubert S. CHU

IPC: C23C16/46 ,  H01L21/67 ,  H01L21/687 ,  B23K26/00 ,  B23K26/12 ,  B23K26/06 ,  B23K26/03 ,  B23K26/08 ,  C23C16/52 ,  B23K26/352

CPC classification number: C23C16/46 ,  H01L21/67115 ,  H01L21/67248 ,  H01L21/68764 ,  H01L21/68785 ,  B23K26/0006 ,  B23K26/128 ,  B23K26/0604 ,  B23K26/034 ,  B23K26/08 ,  C23C16/52 ,  H01L21/68742 ,  B23K26/352 ,  H01L21/6719 ,  B23K26/127 ,  B23K26/126 ,  B23K26/032 ,  B23K26/123 ,  H01L21/68757

Abstract: Embodiments of the present disclosure generally relate to apparatus and methods for semiconductor processing, more particularly, to a thermal process chamber. The thermal process chamber includes a substrate support, a first plurality of heating elements disposed over or below the substrate support, and a spot heating module disposed over the substrate support. The spot heating module is utilized to provide local heating of cold regions on a substrate disposed on the substrate support during processing. Localized heating of the substrate improves temperature profile, which in turn improves deposition uniformity.

公开(公告)号：US20220129698A1

公开(公告)日：2022-04-28

申请号：US17081459

申请日：2020-10-27

Applicant: Applied Materials, Inc.

Inventor： Ala MORADIAN ,  Martin A. HILKENE ,  Zuoming ZHU ,  Errol Antonio C. SANCHEZ ,  Bindusagar MARATH SANKARATHODI ,  Patricia M. LIU ,  Surendra Singh SRIVASTAVA

IPC: G06K9/62 ,  G06N20/00 ,  H01L21/02

Abstract: Systems, apparatus, and methods are disclosed for foreline diagnostics and control. A foreline coupled to a chamber exhaust is instrumented with one or more sensors, in some embodiments placed between the chamber exhaust and an abatement system. The one or more sensors are positioned to measure pressure in the foreline as an indicator of conductance. The sensors are coupled to a trained machine learning model configured to provide a signal when the foreline needs a cleaning cycle or when preventive maintenance should be performed. In some embodiments, the trained machine learning predicts when cleaning or preventive maintenance will be needed.

公开(公告)号：US20210285105A1

公开(公告)日：2021-09-16

申请号：US17331401

申请日：2021-05-26

Applicant: Applied Materials, Inc.

Inventor： Shu-Kwan LAU ,  Koji NAKANISHI ,  Toshiyuki NAKAGAWA ,  Zuoming ZHU ,  Zhiyuan YE ,  Joseph M. RANISH ,  Nyi O. MYO ,  Errol Antonio C. SANCHEZ ,  Schubert S. CHU

IPC: C23C16/46 ,  H01L21/67 ,  H01L21/687 ,  B23K26/00 ,  B23K26/12 ,  B23K26/06 ,  B23K26/03 ,  B23K26/08 ,  C23C16/52 ,  B23K26/352

Abstract: Embodiments of the present disclosure generally relate to apparatus and methods for semiconductor processing, more particularly, to a thermal process chamber. The thermal process chamber includes a substrate support, a first plurality of heating elements disposed over or below the substrate support, and a spot heating module disposed over the substrate support. The spot heating module is utilized to provide local heating of cold regions on a substrate disposed on the substrate support during processing. Localized heating of the substrate improves temperature profile, which in turn improves deposition uniformity.

公开(公告)号：US20210028075A1

公开(公告)日：2021-01-28

申请号：US16938510

申请日：2020-07-24

Applicant: Applied Materials, Inc.

Inventor： Zuoming ZHU ,  Shu-Kwan LAU ,  Ala MORADIAN ,  Enle CHOO ,  Flora Fong-Song CHANG ,  Vilen K. NESTOROV ,  Zhiyuan YE ,  Bindusagar MARATH SANKARATHODI ,  Maxim D. SHAPOSHNIKOV ,  Surendra Singh SRIVASTAVA ,  Zhepeng CONG ,  Patricia M. LIU ,  Errol C. SANCHEZ ,  Jenny C. LIN ,  Schubert S. CHU ,  Balakrishnam R. JAMPANA

IPC: H01L21/66 ,  H01L21/67

Abstract: A method for processing a substrate within a processing chamber comprises receiving a first radiation signal corresponding to a film on a target element disposed within the processing chamber, analyzing the first radiation signal, and controlling the processing of the substrate based on the analyzed first radiation signal. The processing chamber includes a substrate support configured to support the substrate within a processing volume and a controller coupled to a first sensing device configured to receive the first radiation signal.

公开(公告)号：US20160336205A1

公开(公告)日：2016-11-17

申请号：US15220974

申请日：2016-07-27

Applicant: Applied Materials, Inc.

Inventor： Paul BRILLHART ,  Joseph M. RANISH ,  Satheesh KUPPURAO ,  Balasubramanian RAMACHANDRAN ,  Zuoming ZHU

IPC: H01L21/67 ,  H05B3/00

CPC classification number: H01L21/67115 ,  C23C16/481 ,  F27B17/0025 ,  F27D5/0037 ,  H05B3/0047

Abstract: The embodiments described herein generally relate to a lamphead assembly with an absorbing upper surface in a thermal processing chamber. In one embodiment, a processing chamber includes an upper structure, a lower structure, a base ring connecting the upper structure to the lower structure, a substrate support disposed between the upper structure and the lower structure, a lower structure disposed below the substrate support, a lamphead positioned proximate to the lower structure with one or more fixed lamphead positions formed therein, the lamphead comprising a first surface proximate the lower structure and a second surface opposite the first surface, wherein the first surface comprises an absorptive coating and one or more lamp assemblies each comprising a radiation generating source and positioned in connection with the one or more fixed lamphead positions.

Abstract translation: 本文描述的实施例通常涉及在热处理室中具有吸收上表面的灯头组件。 在一个实施例中，处理室包括上部结构，下部结构，将上部结构连接到下部结构的基部环，设置在上部结构和下部结构之间的基板支撑，设置在基板支撑下方的下部结构， 灯头，其定位成靠近下部结构，其中形成有一个或多个固定的灯头位置，所述灯头包括靠近所述下部结构的第一表面和与所述第一表面相对的第二表面，其中所述第一表面包括吸收涂层和一个或多个灯 每个组件包括辐射发生源并且与所述一个或多个固定灯头位置相关联地定位。

公开(公告)号：US20250066918A1

公开(公告)日：2025-02-27

申请号：US18943136

申请日：2024-11-11

Applicant: Applied Materials, Inc.

Inventor： Shu-Kwan LAU ,  Koji NAKANISHI ,  Toshiyuki NAKAGAWA ,  Zuoming ZHU ,  Zhiyuan YE ,  Joseph M. RANISH ,  Nyi Oo MYO ,  Errol Antonio C. SANCHEZ ,  Schubert S. CHU

IPC: C23C16/46 ,  B23K26/00 ,  B23K26/03 ,  B23K26/06 ,  B23K26/08 ,  B23K26/12 ,  B23K26/352 ,  C23C16/52 ,  H01L21/67 ,  H01L21/687

Abstract: Embodiments of the present disclosure generally relate to apparatus and methods for semiconductor processing, more particularly, to a thermal process chamber. The thermal process chamber includes a substrate support, a first plurality of heating elements disposed over or below the substrate support, and a spot heating module disposed over the substrate support. The spot heating module is utilized to provide local heating of cold regions on a substrate disposed on the substrate support during processing. Localized heating of the substrate improves temperature profile, which in turn improves deposition uniformity.

公开(公告)号：US20240112945A1

公开(公告)日：2024-04-04

申请号：US18539507

申请日：2023-12-14

Applicant: Applied Materials, Inc.

Inventor： Anhthu NGO ,  Zuoming ZHU ,  Balasubramanian RAMACHANDRAN ,  Paul BRILLHART ,  Edric TONG ,  Anzhong CHANG ,  Kin Pong LO ,  Kartik SHAH ,  Schubert S. CHU ,  Zhepeng CONG ,  James Francis MACK ,  Nyi O. MYO ,  Kevin Joseph BAUTISTA ,  Xuebin LI ,  Yi-Chiau HUANG ,  Zhiyuan YE

IPC: H01L21/687 ,  B05C13/00 ,  B05C13/02 ,  C30B25/12 ,  H01L21/673

CPC classification number: H01L21/68735 ,  B05C13/00 ,  B05C13/02 ,  C30B25/12 ,  H01L21/67326 ,  H01L21/6875 ,  H01L21/68785 ,  C23C16/4585

Abstract: In one embodiment, a susceptor for thermal processing is provided. The susceptor includes an outer rim surrounding and coupled to an inner dish, the outer rim having an inner edge and an outer edge. The susceptor further includes one or more structures for reducing a contacting surface area between a substrate and the susceptor when the substrate is supported by the susceptor. At least one of the one or more structures is coupled to the inner dish proximate the inner edge of the outer rim.

公开(公告)号：US20240021444A1

公开(公告)日：2024-01-18

申请号：US18074239

申请日：2022-12-02

Applicant: Applied Materials, Inc.

Inventor： Manjunath SUBBANNA ,  Ala MORADIAN ,  Errol Antonio C. SANCHEZ ,  Zuoming ZHU ,  Peydaye Saheli GHAZAL ,  Martin Jeffrey SALINAS ,  Aniketnitin PATIL ,  Raja Murali DHAMODHARAN ,  Shu-Kwan LAU

IPC: H01L21/67 ,  H01L21/20 ,  C23C16/44 ,  C23C16/455

CPC classification number: H01L21/67017 ,  H01L21/67103 ,  H01L21/20 ,  C23C16/4412 ,  C23C16/455 ,  H01L21/67739

Abstract: The present disclosure relates to batch processing apparatus, systems, and related methods and structures for epitaxial deposition operations. In one implementation, an apparatus for substrate processing includes a cassette. The cassette is at least partially supported by a pedestal assembly. The cassette includes a plurality of levels arranged vertically with respect to each other, each level of the plurality of levels including a support surface configured to support a substrate. A level spacing between adjacent levels of the plurality of levels is 25 mm or higher, and the level spacing is defined between the support surfaces of the adjacent levels.

公开(公告)号：US20190127851A1

公开(公告)日：2019-05-02

申请号：US16170255

申请日：2018-10-25

Applicant: Applied Materials, Inc.

Inventor： Shu-Kwan LAU ,  Koji NAKANISHI ,  Toshiyuki NAKAGAWA ,  Zuoming ZHU ,  Zhiyuan YE ,  Joseph M. RANISH ,  Nyi O. MYO ,  Errol Antonio C. SANCHEZ ,  Schubert S. CHU

IPC: C23C16/46 ,  H01L21/67 ,  H01L21/687 ,  B23K26/00 ,  B23K26/352 ,  B23K26/12 ,  B23K26/06 ,  B23K26/03 ,  B23K26/08 ,  C23C16/52

Abstract: Embodiments of the present disclosure generally relate to apparatus and methods for semiconductor processing, more particularly, to a thermal process chamber. The thermal process chamber includes a substrate support, a first plurality of heating elements disposed over or below the substrate support, and a spot heating module disposed over the substrate support. The spot heating module is utilized to provide local heating of cold regions on a substrate disposed on the substrate support during processing. Localized heating of the substrate improves temperature profile, which in turn improves deposition uniformity.

公开(公告)号：US20180005856A1

公开(公告)日：2018-01-04

申请号：US15707810

申请日：2017-09-18

Applicant: Applied Materials, Inc.

Inventor： Anzhong CHANG ,  Paul BRILLHART ,  Surajit KUMAR ,  Satheesh KUPPURAO ,  Mehmet Tugrul SAMIR ,  David K. CARLSON ,  Steve ABOAGYE ,  Anh N. NGUYEN ,  Kailash Kiran PATALAY ,  Joseph M. RANISH ,  Oleg V. SEREBRYANOV ,  Dongming IU ,  Shu-Kwan LAU ,  Zuoming ZHU ,  Herman DINIZ

IPC: H01L21/67 ,  C23C16/455

CPC classification number: H01L21/67115 ,  C23C16/45504

Abstract: Embodiments of the invention relate to a dome assembly. The dome assembly includes an upper dome comprising a central window, and an upper peripheral flange engaging the central window at a circumference of the central window, wherein a tangent line on an inside surface of the central window that passes through an intersection of the central window and the upper peripheral flange is at an angle of about 8° to about 16° with respect to a planar upper surface of the peripheral flange, a lower dome comprising a lower peripheral flange and a bottom connecting the lower peripheral flange with a central opening, wherein a tangent line on an outside surface of the bottom that passes through an intersection of the bottom and the lower peripheral flange is at an angle of about 8° to about 16° with respect to a planar bottom surface of the lower peripheral flange.