Invention Application
- Patent Title: SUBSTRATE PROCESSING MONITORING
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Application No.: US16938510Application Date: 2020-07-24
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Publication No.: US20210028075A1Publication Date: 2021-01-28
- Inventor: Zuoming ZHU , Shu-Kwan LAU , Ala MORADIAN , Enle CHOO , Flora Fong-Song CHANG , Vilen K. NESTOROV , Zhiyuan YE , Bindusagar MARATH SANKARATHODI , Maxim D. SHAPOSHNIKOV , Surendra Singh SRIVASTAVA , Zhepeng CONG , Patricia M. LIU , Errol C. SANCHEZ , Jenny C. LIN , Schubert S. CHU , Balakrishnam R. JAMPANA
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L21/66
- IPC: H01L21/66 ; H01L21/67
Abstract:
A method for processing a substrate within a processing chamber comprises receiving a first radiation signal corresponding to a film on a target element disposed within the processing chamber, analyzing the first radiation signal, and controlling the processing of the substrate based on the analyzed first radiation signal. The processing chamber includes a substrate support configured to support the substrate within a processing volume and a controller coupled to a first sensing device configured to receive the first radiation signal.
Public/Granted literature
- US12165934B2 Substrate processing monitoring Public/Granted day:2024-12-10
Information query
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