PROCESS AND DEVICE FOR PREPARING LASER PVC
    7.
    发明公开

    公开(公告)号:US20240091803A1

    公开(公告)日:2024-03-21

    申请号:US18066293

    申请日:2022-12-15

    摘要: The present invention discloses a process and device for preparing laser PVC. The device includes an upper transmission roller, a support mechanism, a spraying mechanism, an impurity removal mechanism, and a lower transmission roller; the upper transmission roller is disposed above the lower transmission roller, and the two are configured to implement delivery of a PVC film at a station for preparing a laser layer by spraying; the support mechanism is disposed between the upper transmission roller and the lower transmission roller and is in contact with a back surface of the PVC film, and the spraying mechanism is disposed opposite to the support mechanism; and a curing mechanism is disposed in a fitting manner at the coating position; and the impurity removal mechanism is disposed at a front end of the spraying mechanism.

    Substrate processing device
    8.
    发明授权

    公开(公告)号:US11935763B2

    公开(公告)日:2024-03-19

    申请号:US17223115

    申请日:2021-04-06

    发明人: Michinori Iwao

    摘要: A substrate processing apparatus includes: a circulation pipe which defines a circulation passage through which a chemical liquid within a chemical-liquid tank is circulated; a supply pipe which guides the chemical liquid from the circulation pipe to a chemical-liquid nozzle; a supply valve which is switched between an open state in which the chemical liquid flowing through the supply pipe toward the chemical-liquid nozzle is passed and a closed state in which the supply of the chemical liquid from the supply pipe to the chemical-liquid nozzle is stopped; a recovery pipe which guides the chemical liquid from a cup to the chemical-liquid tank; and a branch pipe which guides the chemical liquid within the circulation pipe to the recovery pipe.

    SUBSTRATE PROCESSING APPARATUS
    9.
    发明公开

    公开(公告)号:US20240066548A1

    公开(公告)日:2024-02-29

    申请号:US18366068

    申请日:2023-08-07

    发明人: Shuhei NEMOTO

    IPC分类号: B05C11/08 B05C11/10 B05C13/02

    CPC分类号: B05C11/08 B05C11/10 B05C13/02

    摘要: In an substrate processing apparatus according to the present invention, a chamber is configured so as to cover an internal space with a bottom wall, side walls extending from the periphery of the bottom wall, and a ceiling wall covering the upper end of the side walls. A plurality of base support members stand vertically upward from the bottom wall, and the base member is supported by upper end portions of these base support members. A so-called raised floor structure is formed. Then, the substrate processing part is installed on the upper surface of the base member. By adopting such a layout using the raised floor structure, even if leakage of the processing liquid occurs and the processing liquid is pooled on the bottom wall of the chamber, it is possible to reliably prevent the processing liquid from coming into contact with the substrate processing part.

    Holding jig
    10.
    发明授权

    公开(公告)号:US11887882B2

    公开(公告)日:2024-01-30

    申请号:US16683699

    申请日:2019-11-14

    摘要: An object of the present invention is to provide a holding jig that is used for applying a liquid bath treatment to a planar workpiece, has good cleaning capabilities, and avoids intimate contact of the planar workpiece with a rear member of the holding jig so that the planar workpiece can be easily detached from the holding jig after cleaning. A holding jig is used for applying a liquid bath treatment to a planar workpiece. The holding jig comprises a rear member, and a front member that faces the rear member and has an opening portion. The planar workpiece is disposed between the rear member and the front member, and the rear member has a plurality of projections formed on the surface of the rear member facing the front member.