公开(公告)号：US20180045575A1

公开(公告)日：2018-02-15

申请号：US15665545

申请日：2017-08-01

Applicant: Applied Materials, Inc.

Inventor： Kailash Kiran PATALAY ,  Aaron Muir HUNTER

IPC: G01J5/10 ,  H01L21/67 ,  G01J5/00

CPC classification number: G01J5/10 ,  G01J2005/0048 ,  H01L21/67115 ,  H01L21/67248

Abstract: The embodiments described herein generally relate to systems for noise compensation for proper temperature detection in thermal processing chambers and devices for achieving the same. In one embodiment, a system is disclosed herein. The system includes a processing chamber, a substrate, a pyrometer, and a controller. The processing chamber is configured to process a substrate. The substrate support is disposed in the processing chamber. The pyrometer is positioned to receive radiation emitted by a substrate or a component of the processing chamber and generating a pyrometer signal indicative of the received radiation. The controller is configured to subtract a time invariant noise component and a time variant noise component from the pyrometer signal during processing of a substrate.

公开(公告)号：US20140199056A1

公开(公告)日：2014-07-17

申请号：US14132215

申请日：2013-12-18

Applicant: APPLIED MATERIALS, INC.

Inventor： Anzhong CHANG ,  Paul BRILLHART ,  Surajit KUMAR ,  Satheesh KUPPURAO ,  Mehmet Tugrul SAMIR ,  David K. CARLSON ,  Steve ABOAGYE ,  Anh N. NGUYEN ,  Kailash Kiran PATALAY ,  Joseph M. RANISH ,  Oleg SEREBRYANOV ,  Dongming IU ,  Shu-Kwan LAU ,  Zuoming ZHU ,  Herman DINIZ

IPC: H01L21/67

CPC classification number: H01L21/67115 ,  C23C16/45504

Abstract: Embodiments of the invention relate to a dome assembly. The dome assembly includes an upper dome comprising a central window, and an upper peripheral flange engaging the central window at a circumference of the central window, wherein a tangent line on an inside surface of the central window that passes through an intersection of the central window and the upper peripheral flange is at an angle of about 8° to about 16° with respect to a planar upper surface of the peripheral flange, a lower dome comprising a lower peripheral flange and a bottom connecting the lower peripheral flange with a central opening, wherein a tangent line on an outside surface of the bottom that passes through an intersection of the bottom and the lower peripheral flange is at an angle of about 8° to about 16° with respect to a planar bottom surface of the lower peripheral flange.

Abstract translation: 本发明的实施例涉及一种圆顶组件。 圆顶组件包括上拱顶，其包括中心窗，以及在中心窗的圆周处接合中心窗的上周缘，其中中心窗的内表面上的切线穿过中心窗的交点 并且上周缘相对于周缘凸缘的平面上表面成大约8°至大约16°的​​角度，下圆顶包括下周边凸缘和将下周边凸缘连接到中心开口的底部， 其中穿过底部和下部周边凸缘的交叉点的底部外表面上的切线相对于下部周边凸缘的平坦底面成约8°至约16°的​​角度。

公开(公告)号：US20140175054A1

公开(公告)日：2014-06-26

申请号：US14195423

申请日：2014-03-03

Applicant: Applied Materials, Inc.

Inventor： David Keith CARLSON ,  Satheesh KUPPURAO ,  Howard BECKFORD ,  Herman DINIZ ,  Kailash Kiran PATALAY ,  Brian Hayes BURROWS ,  Jeffery Ronald CAMPBELL ,  Zuoming ZHU ,  Xiaowei LI ,  Errol Antonio SANCHEZ

IPC: C23C16/455 ,  C23C16/22

CPC classification number: C23C16/455 ,  C23C16/22 ,  C23C16/452 ,  H01L21/02532 ,  H01L21/0262 ,  Y10T137/0318

Abstract: In one embodiment, a gas distribution assembly includes an injection block having at least one inlet to deliver a precursor gas to a plurality of plenums from at least two gas sources, a perforated plate bounding at least one side of each of the plurality of plenums, at least one radiant energy source positioned within each of the plurality of plenums to provide energy to the precursor gas from one or both of the at least two gas sources and flow an energized gas though openings in the perforated plate and into a chamber, and a variable power source coupled to each of the radiant energy sources positioned within each of the plurality of plenums.

Abstract translation: 在一个实施例中，气体分配组件包括注入块，其具有至少一个入口，以将前体气体从至少两个气体源输送到多个增压室，多孔板限定多个通气室中的每一个的至少一侧， 至少一个辐射能源，其定位在所述多个增压室的每一个内，以从所述至少两个气体源中的一个或两个向所述前体气体提供能量，并且使通电气体通过所述多孔板中的开口并进入腔室，并且 可变电源耦合到位于多个通风室中的每一个内的每个辐射能源。

公开(公告)号：US20180084610A1

公开(公告)日：2018-03-22

申请号：US15824489

申请日：2017-11-28

Applicant: Applied Materials, Inc.

Inventor： Kin Pong LO ,  Paul BRILLHART ,  Ramachandran BALASUBRAMANIAN ,  Satheesh KUPPURAO ,  Daniel REDFIELD ,  Joseph M. RANISH ,  James Francis MACK ,  Kailash Kiran PATALAY ,  Michael OLSEN ,  Eddie FEIGEL ,  Richard HALPIN ,  Brett VETORINO

IPC: H05B3/00 ,  H01L21/67

CPC classification number: H05B3/0047 ,  H01L21/67115

Abstract: Embodiments of the disclosure generally relate to a reflector for use in a thermal processing chamber. In one embodiment, the thermal processing chamber generally includes an upper dome, a lower dome opposing the upper dome, the upper dome and the lower dome defining an internal volume of the processing chamber, a substrate support disposed within the internal volume, and a reflector positioned above and proximate to the upper dome, wherein the reflector has a heat absorptive coating layer deposited on a side of the reflector facing the substrate support.

公开(公告)号：US20180005856A1

公开(公告)日：2018-01-04

申请号：US15707810

申请日：2017-09-18

Applicant: Applied Materials, Inc.

Inventor： Anzhong CHANG ,  Paul BRILLHART ,  Surajit KUMAR ,  Satheesh KUPPURAO ,  Mehmet Tugrul SAMIR ,  David K. CARLSON ,  Steve ABOAGYE ,  Anh N. NGUYEN ,  Kailash Kiran PATALAY ,  Joseph M. RANISH ,  Oleg V. SEREBRYANOV ,  Dongming IU ,  Shu-Kwan LAU ,  Zuoming ZHU ,  Herman DINIZ

IPC: H01L21/67 ,  C23C16/455

CPC classification number: H01L21/67115 ,  C23C16/45504

Abstract: Embodiments of the invention relate to a dome assembly. The dome assembly includes an upper dome comprising a central window, and an upper peripheral flange engaging the central window at a circumference of the central window, wherein a tangent line on an inside surface of the central window that passes through an intersection of the central window and the upper peripheral flange is at an angle of about 8° to about 16° with respect to a planar upper surface of the peripheral flange, a lower dome comprising a lower peripheral flange and a bottom connecting the lower peripheral flange with a central opening, wherein a tangent line on an outside surface of the bottom that passes through an intersection of the bottom and the lower peripheral flange is at an angle of about 8° to about 16° with respect to a planar bottom surface of the lower peripheral flange.

公开(公告)号：US20170362702A9

公开(公告)日：2017-12-21

申请号：US14195423

申请日：2014-03-03

Applicant: Applied Materials, Inc.

Inventor： David Keith CARLSON ,  Satheesh KUPPURAO ,  Howard BECKFORD ,  Herman DINIZ ,  Kailash Kiran PATALAY ,  Brian Hayes BURROWS ,  Jeffery Ronald CAMPBELL ,  Zuoming ZHU ,  Xiaowei LI ,  Errol Antonio SANCHEZ

IPC: C23C16/455 ,  C23C16/22 ,  C23C16/452 ,  H01L21/02

CPC classification number: C23C16/455 ,  C23C16/22 ,  C23C16/452 ,  H01L21/02532 ,  H01L21/0262 ,  Y10T137/0318

Abstract: In one embodiment, a gas distribution assembly includes an injection block having at least one inlet to deliver a precursor gas to a plurality of plenums from at least two gas sources, a perforated plate bounding at least one side of each of the plurality of plenums, at least one radiant energy source positioned within each of the plurality of plenums to provide energy to the precursor gas from one or both of the at least two gas sources and flow an energized gas though openings in the perforated plate and into a chamber, and a variable power source coupled to each of the radiant energy sources positioned within each of the plurality of plenums.

公开(公告)号：US20140345525A1

公开(公告)日：2014-11-27

申请号：US14272428

申请日：2014-05-07

Applicant: Applied Materials, Inc.

Inventor： Joseph M. RANISH ,  Satheesh KUPPURAO ,  Kailash Kiran PATALAY ,  Paul BRILLHART

IPC: H01L21/02

CPC classification number: H01L21/02293 ,  C23C16/4411 ,  C23C16/481

Abstract: Embodiments disclosed herein relate to coated liner assemblies for use in a semiconductor processing chamber. In one embodiment, a liner assembly for use in a semiconductor processing chamber includes a liner body having a cylindrical ring form and a coating layer coating the liner body, wherein the coating layer is opaque at one or more wavelengths between about 200 nm and about 5000 nm. In another embodiment, an apparatus for depositing a dielectric layer on a substrate includes a processing chamber having an interior volume defined in a chamber body of the processing chamber, a liner assembly disposed in the processing chamber, wherein the liner assembly further comprises a liner body having a cylindrical ring form, and a coating layer coating an outer wall of the liner body and facing the chamber body, wherein the coating layer is opaque at one or more wavelengths between about 200 nm and about 5000 nm.

Abstract translation: 本文公开的实施例涉及用于半导体处理室的涂覆的衬垫组件。 在一个实施例中，用于半导体处理室的衬套组件包括具有圆柱形环形式的衬垫体和涂覆衬套本体的涂层，其中涂层在约200nm至约5000之间的一个或多个波长处是不透明的 nm。 在另一个实施例中，用于在衬底上沉积电介质层的装置包括处理室，其具有限定在处理室的室主体中的内部容积，设置在处理室中的衬垫组件，其中衬套组件还包括衬垫体 具有圆柱形环形，以及涂覆衬套主体的外壁并面向腔室主体的涂层，其中涂层在约200nm至约5000nm之间的一个或多个波长处是不透明的。

公开(公告)号：US20150023385A1

公开(公告)日：2015-01-22

申请号：US14257665

申请日：2014-04-21

Applicant: Applied Materials, Inc.

Inventor： Kailash Kiran PATALAY ,  Aaron Muir HUNTER

IPC: G01J5/10 ,  H01L21/67

CPC classification number: G01J5/10 ,  G01J2005/0048 ,  H01L21/67115 ,  H01L21/67248

Abstract: The embodiments described herein generally relate to methods of noise compensation for proper temperature detection in thermal processing chambers and devices for achieving the same. Methods can include determining noise produced by a lamp zone and extrapolating the noise from the detected photocurrent. Devices can include a processing chamber, a substrate support disposed in the processing chamber, the substrate support having a high thermal mass, a pyrometer below the substrate support and oriented to view radiation emitted by the substrate and a controller configured to subtract a time invariant noise component and a time variant noise component from the pyrometer signal.

Abstract translation: 本文描述的实施例通常涉及用于实现其的热处理室中的适当温度检测的噪声补偿方法。 方法可以包括确定灯区产生的噪声，并从检测到的光电流中推断噪声。 设备可以包括处理室，设置在处理室中的衬底支撑件，具有高热质量的衬底支撑件，在衬底支撑件下方的高温计，并且被定向成观察由衬底发射的辐射;以及控制器，被配置为减去时间不变噪声 分量和来自高温计信号的时变噪声分量。

公开(公告)号：US20140345526A1

公开(公告)日：2014-11-27

申请号：US14284570

申请日：2014-05-22

Applicant: Applied Materials, Inc.

Inventor： Joseph M. RANISH ,  Satheesh KUPPURAO ,  Kailash Kiran PATALAY ,  Paul BRILLHART

IPC: H01L21/02

CPC classification number: H01L21/02293 ,  C23C16/4411 ,  C23C16/481

Abstract: Embodiments disclosed herein relate to coated liner assemblies for use in a semiconductor processing chamber. In one embodiment, a liner assembly for use in a semiconductor processing chamber includes a liner body having a cylindrical ring form and a coating layer coating the liner body, wherein the coating layer is opaque at one or more wavelengths between about 200 nm and about 5000 nm. In another embodiment, an apparatus for depositing a dielectric layer on a substrate includes a processing chamber having an interior volume defined in a chamber body of the processing chamber, a liner assembly disposed in the processing chamber, wherein the liner assembly further comprises a liner body having a cylindrical ring form, and a coating layer coating an outer wall of the liner body and facing the chamber body, wherein the coating layer is opaque at one or more wavelengths between about 200 nm and about 5000 nm.