Abstract:
Embodiments of the present invention provide apparatus and method for reducing non uniformity during thermal processing. One embodiment provides an apparatus for processing a substrate comprising a chamber body defining a processing volume, a substrate support disposed in the processing volume, wherein the substrate support is configured to rotate the substrate, a sensor assembly configured to measure temperature of the substrate at a plurality of locations, and one or more pulse heating elements configured to provide pulsed energy towards the processing volume.
Abstract:
Embodiments of the present disclosure generally relate to organic vapor deposition systems and substrate processing methods related thereto. In one embodiment, a processing system comprises a lid assembly and a plurality of material delivery systems. The lid assembly includes lid plate having a first surface and a second surface disposed opposite of the first surface and a showerhead assembly coupled to the first surface. The showerhead assembly comprises a plurality of showerheads. Individual ones of the plurality of material delivery systems are fluidly coupled to one or more of the plurality of showerheads and are disposed on the second surface of the lid plate. Each of the material delivery systems comprise a delivery line, a delivery line valve disposed on the delivery line, a bypass line fluidly coupled to the delivery line at a point disposed between the delivery line valve and the showerhead, and a bypass valve disposed on the bypass line.
Abstract:
A support member for a thermal processing chamber is described. The support member has a sol coating on at least one surface. The sol coating contains a material that blocks a desired wavelength or spectrum of radiation from being transmitted by the material of the support member. The sol coating may be a multi-layer structure that may include adhesion layers, transition layers, and cap layers, in addition to radiation-blocking layers.
Abstract:
Implementations described herein provide apparatus and methods for laser-assisted deposition of films while forming electronic devices. In one implementation, a method for depositing a layer on one or more substrates is provided. The method comprises flowing a deposition precursor gas across a surface of the one or more substrates disposed within a processing volume of a processing chamber, thermally activating the deposition precursor gas to deposit a material layer on the surface of the one or more substrates, dissociating an etch precursor gas in a gas activation cell by exposing the etch precursor gas to photons from an energy source assembly having a wavelength selected for pyrolytic dissociation of the etch precursor gas and introducing the dissociated etch precursor gas into the processing volume to etch at least a portion of the material layer from the surface of the one or more substrates.
Abstract:
Embodiments of the present disclosure relate to thermal processing of substrates. More specifically, embodiments described herein relate to flash on spike annealing processes and apparatus suitable for performing such processes. In one embodiment, a thermal processing apparatus may include a lamp radiation source, a laser source, and a reflector plate disposed between the lamp radiation source and the laser source. One or more apertures may be formed in the reflector plate and the laser source may be positioned adjacent to the reflector plate such that a laser beam emitted from the laser source propagates through the one or more apertures. In one embodiment, the reflector plate may be substantially circular and the one or more apertures may approximate a sector of the reflector plate.
Abstract:
Apparatus for providing energy to a process chamber are provided herein. In one embodiment, the apparatus include a supporting substrate, a first plurality of solid state light sources disposed on a first surface of the supporting substrate, and a second plurality of solid state light sources disposed on the top surface of the supporting substrate, wherein the first and second plurality of solid state light sources are aligned and electrically isolated from each other, and the first plurality of solid state light sources is in physical contact with the second plurality of solid state light sources.
Abstract:
Embodiments of the present invention generally relate to a tubular lamp with a coiled filament having an overwind wrapped around the coil. In one embodiment, the tubular lamp has a coiled coil filament, and the coiled coil has an overwind wrapped around the coiled coil.
Abstract:
Embodiments described herein generally relate to an improved power distribution assembly for a lamphead assembly used in a thermal processing chamber. In one embodiment, the lamphead assembly includes a plurality of lamps for thermal processing of semiconductor substrates, and a power distribution assembly having a plurality of openings, the power distribution assembly provides power to the plurality of lamps, and each opening is sized to allow passage of the lamp therethough.
Abstract:
A support member for a thermal processing chamber is described. The support member has a sol coating on at least one surface. The sol coating contains a material that blocks a desired wavelength or spectrum of radiation from being transmitted by the material of the support member. The sol coating may be a multi-layer structure that may include adhesion layers, transition layers, and cap layers, in addition to radiation-blocking layers.
Abstract:
A processing chamber is described. The processing chamber includes a chamber having an interior volume, a light pipe window structure coupled to the chamber, the light pipe window structure having a first transparent plate disposed within the interior volume of the chamber, and a radiant heat source coupled to a second transparent plate of the light pipe window structure in a position outside of the interior volume of the chamber, wherein the light pipe window structure includes a plurality of light pipe structures disposed between the first transparent plate and the second transparent plate.