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公开(公告)号:US20200211834A1
公开(公告)日:2020-07-02
申请号:US16725226
申请日:2019-12-23
Applicant: Applied Materials, Inc.
Inventor: Chuanxi YANG , Hang YU , Sanjay KAMATH , Deenesh PADHI , Honggun KIM , Euhngi LEE , Zubin HUANG , Diwakar N. KEDLAYA , Rui CHENG , Karthik JANAKIRAMAN
IPC: H01L21/02 , C23C16/34 , C23C16/02 , C23C16/513
Abstract: Methods for forming the silicon boron nitride layer are provided. The method includes positioning a substrate on a pedestal in a process region within a process chamber, heating a pedestal retaining the substrate, and introducing a first flow of a first process gas and a second flow of a second process gas to the process region. The first flow of the first process gas contains silane, ammonia, helium, nitrogen, argon, and hydrogen. The second flow of the second process gas contains diborane and hydrogen. The method also includes forming a plasma concurrently with the first flow of the first process gas and the second flow of the second process gas to the process region and exposing the substrate to the first process gas, the second process gas, and the plasma to deposit the silicon boron nitride layer on the substrate.
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公开(公告)号:US20200321210A1
公开(公告)日:2020-10-08
申请号:US16797111
申请日:2020-02-21
Applicant: Applied Materials, Inc.
Inventor: Meenakshi GUPTA , Rui CHENG , Srinivas GUGGILLA , Karthik JANAKIRAMAN , Diwakar N. KEDLAYA , Zubin HUANG
IPC: H01L21/027 , H01L21/32 , H01L21/02
Abstract: Embodiments for processing a substrate are provided and include a method of trimming photoresist to provide photoresist profiles with smooth sidewall surfaces and to tune critical dimensions (CD) for the patterned features and/or a subsequently deposited dielectric layer. The method can include depositing a sacrificial structure layer on the substrate, depositing a photoresist on the sacrificial structure layer, and patterning the photoresist to produce a crude photoresist profile on the sacrificial structure layer. The method also includes trimming the photoresist with a plasma to produce a refined photoresist profile covering a first portion of the sacrificial structure layer while a second portion of the sacrificial structure layer is exposed, etching the second portion of the sacrificial structure layer to form patterned features disposed on the substrate, and depositing a dielectric layer on the patterned features.
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公开(公告)号:US20200043722A1
公开(公告)日:2020-02-06
申请号:US16514534
申请日:2019-07-17
Applicant: Applied Materials, Inc.
Inventor: Rui CHENG , Karthik JANAKIRAMAN , Zubin HUANG , Diwakar N. KEDLAYA
IPC: H01L21/02 , H01L21/033
Abstract: Embodiments of the present disclosure relate to deposition methods for dielectric layers with zero pattern loading characteristics. In one embodiment, the method includes depositing a conformal dielectric layer on the substrate having a patterned area and a blanket area by exposing the substrate to a deposition precursor and a tuning gas simultaneously without the presence of plasma in a process chamber, wherein the deposition precursor is reacted to form a chemical reaction by-product, and the chemical reaction by-product is the same as the tuning gas, and wherein the deposition precursor and the tuning gas are provided at an amount that is more than required for the deposition reaction to occur at the patterned area and the blanket area.
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公开(公告)号:US20200041407A1
公开(公告)日:2020-02-06
申请号:US16460309
申请日:2019-07-02
Applicant: Applied Materials, Inc.
Inventor: Zubin HUANG , Sarah Langlois WHITE , Jonathan Robert BAKKE , Diwakar N. KEDLAYA , Juan Carlos ROCHA , Fang RUAN
IPC: G01N21/3504 , G01N21/33 , H01L21/02 , H01L21/67 , C23C16/448 , C23C16/52
Abstract: Systems and methods used to deliver a processing gas having a desired diborane concentration to a processing volume of a processing chamber are provided herein. In one embodiment a system includes a borane concentration sensor. The borane concentration sensor includes a body and a plurality of windows. Here, individual ones of the plurality of windows are disposed at opposite ends of the body and the body and the plurality of windows collectively define a cell volume. The borane concentration sensor further includes a radiation source disposed outside of the cell volume proximate to a first window of the plurality of windows, and a radiation detector disposed outside the cell volume proximate to a second window of the plurality of windows.
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公开(公告)号:US20200258720A1
公开(公告)日:2020-08-13
申请号:US16785331
申请日:2020-02-07
Applicant: Applied Materials, Inc.
Inventor: Krishna NITTALA , Diwakar N. KEDLAYA , Karthik JANAKIRAMAN , Yi YANG , Rui CHENG
IPC: H01J37/32 , H01L21/02 , C23C16/505 , C23C16/515
Abstract: Systems and methods of using pulsed RF plasma to form amorphous and microcrystalline films are discussed herein. Methods of forming films can include (a) forming a plasma in a process chamber from a film precursor and (b) pulsing an RF power source to cause a duty cycle on time (TON) of a duty cycle of a pulse generated by the RF power source to be less than about 20% of a total cycle time (TTOT) of the duty cycle to form the film. The methods can further include (c) depositing a first film interlayer on a substrate in the process chamber; (d) subsequent to (c), purging the process chamber; and (e) subsequent to (d), introducing a hydrogen plasma to the process chamber. Further in the method, (b)-(e) are repeated to form a film. The film can have an in-film hydrogen content of less than about 10%.
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公开(公告)号:US20200234932A1
公开(公告)日:2020-07-23
申请号:US16703140
申请日:2019-12-04
Applicant: Applied Materials, Inc.
Inventor: Venkata Sharat Chandra PARIMI , Zubin HUANG , Jian LI , Satish RADHAKRISHNAN , Rui CHENG , Diwakar N. KEDLAYA , Juan Carlos ROCHA-ALVAREZ , Umesh M. KELKAR , Karthik JANAKIRAMAN , Sarah Michelle BOBEK , Prashant Kumar KULSHRESHTHA , Vinay K. PRABHAKAR , Byung Seok KWON
IPC: H01J37/32 , C23C16/458 , C23C16/46 , C23C16/50
Abstract: Embodiments of the present disclosure generally relate to a pedestal for increasing temperature uniformity in a substrate supported thereon. The pedestal comprises a body having a heater embedded therein. The body comprises a patterned surface that includes a first region having a first plurality of posts extending from a base surface of the body at a first height, and a second region surrounding the central region having a second plurality of posts extending from the base surface at a second height that is greater than the first height, wherein an upper surface of each of the first plurality of posts and the second plurality of posts are substantially coplanar and define a substrate receiving surface.
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公开(公告)号:US20170032865A1
公开(公告)日:2017-02-02
申请号:US15213844
申请日:2016-07-19
Applicant: Applied Materials, Inc.
Inventor: Joseph M. RANISH , Shashank SHARMA , Diwakar N. KEDLAYA , Aaron Muir HUNTER
IPC: G21K5/10
CPC classification number: G21K5/10 , H01L21/67115
Abstract: Embodiments of the present disclosure relate to thermal processing of substrates. More specifically, embodiments described herein relate to flash on spike annealing processes and apparatus suitable for performing such processes. In one embodiment, a thermal processing apparatus may include a lamp radiation source, a laser source, and a reflector plate disposed between the lamp radiation source and the laser source. One or more apertures may be formed in the reflector plate and the laser source may be positioned adjacent to the reflector plate such that a laser beam emitted from the laser source propagates through the one or more apertures. In one embodiment, the reflector plate may be substantially circular and the one or more apertures may approximate a sector of the reflector plate.
Abstract translation: 本公开的实施例涉及基板的热处理。 更具体地说,本文描述的实施例涉及闪光退火工艺和适于执行这些工艺的装置。 在一个实施例中,热处理设备可以包括灯辐射源,激光源和设置在灯辐射源和激光源之间的反射板。 可以在反射板中形成一个或多个孔,并且激光源可以邻近反射板定位,使得从激光源发射的激光束传播通过一个或多个孔。 在一个实施例中,反射板可以是基本上圆形的并且一个或多个孔可以接近反射板的扇形。
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公开(公告)号:US20150165551A1
公开(公告)日:2015-06-18
申请号:US14172422
申请日:2014-02-04
Applicant: Applied Materials, Inc.
Inventor: Douglas E. HOLMGREN , Samuel C. HOWELLS , Aaron Muir HUNTER , Theodore P. MOFFITT , Diwakar N. KEDLAYA
Abstract: Embodiments described herein relate to the rapid thermal processing of substrates. A fiber coupled laser diode array is provided in an optical system configured to generate a uniform irradiance pattern on the surface of a substrate. A plurality of individually controllable laser diodes are optically coupled via a plurality of fibers to one or more lenses. The fiber coupled laser diode array generates a Gaussian radiation profile which is defocused by the lenses to generate a uniform intensity image. In one embodiment, a field stop is disposed within the optical system.
Abstract translation: 本文所述的实施例涉及衬底的快速热处理。 在配置成在衬底的表面上产生均匀辐照度图案的光学系统中提供光纤耦合激光二极管阵列。 多个可单独控制的激光二极管通过多个光纤光耦合到一个或多个透镜。 光纤耦合的激光二极管阵列产生高斯辐射分布,其由透镜散焦以产生均匀的强度图像。 在一个实施例中,场停止件设置在光学系统内。
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公开(公告)号:US20240304437A1
公开(公告)日:2024-09-12
申请号:US18650014
申请日:2024-04-29
Applicant: Applied Materials, Inc.
Inventor: Chuanxi YANG , Hang YU , Sanjay KAMATH , Deenesh PADHI , Honggun KIM , Euhngi LEE , Zubin HUANG , Diwakar N. KEDLAYA , Rui CHENG , Karthik JANAKIRAMAN
IPC: H01L21/02 , C23C16/02 , C23C16/34 , C23C16/513
CPC classification number: H01L21/0217 , C23C16/0209 , C23C16/345 , C23C16/513 , H01L21/02274
Abstract: Capacitor devices containing silicon boron nitride with high boron concentration are provided. In one or more examples, a capacitor device is provided and contains a stopper layer containing silicon boron nitride and disposed on a substrate, a dielectric layer disposed on the stopper layer, vias formed within the dielectric layer and the stopper layer, metal contacts disposed on bottoms of the vias, a nitride barrier layer containing a metal nitride material and disposed on walls of the vias and disposed on the metal contacts, and an oxide layer disposed within the vias on the nitride barrier layer, wherein the oxide layer contains one or more holes or voids formed therein. The silicon boron nitride contains about 18 atomic percent (at %) to about 50 at % of boron.
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公开(公告)号:US20200291522A1
公开(公告)日:2020-09-17
申请号:US16802284
申请日:2020-02-26
Applicant: Applied Materials, Inc.
Inventor: Hanish Kumar PANAVALAPPIL KUMARANKUTTY , Prashant A. DESAI , Diwakar N. KEDLAYA , Sumit AGARWAL , Vidyadharan Srinivasa Murthy BANGALORE , Truong NGUYEN , Zubin HUANG
IPC: C23C16/455
Abstract: The present disclosure relates to a lid assembly apparatus and related methods for substrate processing chambers. In one implementation, a lid assembly includes a gas manifold. The gas manifold includes a first gas channel configured to receive a process gas, a second gas channel configured to receive a doping gas, and a third gas channel configured to receive a cleaning gas. The lid assembly also includes a showerhead. The showerhead includes one or more first gas openings that are configured to receive the process gas, and one or more second gas openings that are configured to receive the doping gas.
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