Abstract:
A substrate treating method may be performed by a plasma treating apparatus. The substrate treating method may include: providing a substrate on a platform in a lower portion of an inner space of a process chamber; directing a first process gas upward from a first nozzle formed at an inner wall of the process chamber into an upper portion of the inner space, the first process gas being an inert gas and wherein the first nozzle is an obliquely upward-oriented nozzle structured to direct the first process gas upward; directing a second process gas downward from a second nozzle formed at a inner wall of the process chamber into a lower portion of the inner space, the second process gas being hydrogen gas and wherein the second nozzle is an obliquely downward-oriented nozzle structured to direct the second process gas downward; and applying a microwave to the upper portion of the inner space to excite the first process gas and the second process gas into plasma, and then processing the substrate.
Abstract:
A substrate treating method may be performed by a plasma treating apparatus. The substrate treating method may include: providing a substrate on a platform in a lower portion of an inner space of a process chamber; directing a first process gas upward from a first nozzle formed at an inner wall of the process chamber into an upper portion of the inner space, the first process gas being an inert gas and wherein the first nozzle is an obliquely upward-oriented nozzle structured to direct the first process gas upward; directing a second process gas downward from a second nozzle formed at a inner wall of the process chamber into a lower portion of the inner space, the second process gas being hydrogen gas and wherein the second nozzle is an obliquely downward-oriented nozzle structured to direct the second process gas downward; and applying a microwave to the upper portion of the inner space to excite the first process gas and the second process gas into plasma, and then processing the substrate.
Abstract:
An apparatus and a method of processing a specimen includes a final analysis specimen that is manufactured by sequentially performing specimen processing processes using a laser beam with respect to an initial laminate specimen loaded on a stage. As a result, the final specimen manufacturing time may be reduced and the quality of the final specimen may be improved.
Abstract:
Provided is a method of manufacturing oxide-based nano-structured materials using a chemical wet process, and thus, the method can be employed to manufacture oxide-based nano-structured materials having uniform composition and good electrical characteristics in large quantities, the method having a relatively simple process which does not use large growing equipment. The method includes preparing a first organic solution that comprises a metal, mixing the first organic solution with a second organic solution that contains hydroxyl radicals (—OH), filtering the mixed solution using a filter in order to extract oxide-based nano-structured materials formed in the mixed solution, drying the extracted oxide-based nano-structured materials to remove any remaining organic solution, and heat treating the dried oxide-based nano-structured materials.
Abstract:
A method for the fabrication of a mesoporous metal electrode in a non-liquid crystalline phase was tested. Specifically, there was tested the efficacy of the method for the fabrication of a mesoporous metal electrode which comprises forming the mesoporous metal electrode on a substrate by chemical or electrochemical reduction of a mixture comprising a solvent, a structure-directing agent, and a source of a metal, characterized in that the mixture is maintained in a non-liquid crystal phase. Furthermore, the usefulness of the mesoporous metal electrode thus prepared from the non-liquid crystalline phase was also tested. The mesoporous metal electrode prepared from the non-liquid crystalline phase had a large surface area, and a roughness factor thereof was controlled by charges passed during electroplating. The method made it possible to fabricate the mesoporous metal electrode in the non-liquid crystalline phase, even more flexible than a liquid crystalline phase. The mesoporous metal electrode prepared by the method had randomly distributed mesopores on the surface thereof and retained a large roughness factor. The method was found to be a good alternative to the conventional fabrication of porous platinum films in the liquid crystalline phase. Furthermore, the method was found to be suitably applicable to automatic processes, because the mesoporous metal electrode was prepared in the highly flexible non-liquid crystalline phase. Recovery and recycling of raw materials were also improved. The mesoporous metal electrode prepared by the method can be suitably used for the detection of glucose and proton, and as a cathode or an anode of fuel cells.
Abstract:
Discrete cosine transform/inverse discrete cosine transform method and device are provided. The discrete cosine transform/inverse discrete cosine transform method includes: generating a table index for only an input value other than 0 (zero) out of input values of coordinates in an input block; reading one or more partial values corresponding to the table index out of a plurality of table information pieces which are generated and stored in advance so as to include partial values corresponding to a multiplication of a weight value and an index; and adding the read partial value and calculating the resultant value of each coordinate in an output block. Accordingly, it is possible to perform a fast DCT/IDCT operation and to reduce the energy consumption for the transform.
Abstract:
A method of manufacturing a semiconductor device includes forming a first plurality of recessed regions in a substrate, the substrate having a protruded active region between the first plurality of recessed regions and the protruded active region having an upper surface and a sidewall, forming a device isolation film in the first plurality of recessed regions, the device isolation film exposing the upper surface and an upper portion of the sidewall of the protruded active region, and performing a first plasma treatment on the exposed surface of the protruded active region, wherein the plasma treatment is performed using a plasma gas containing at least one of an inert gas and a hydrogen gas in a temperature of less than or equal to about 700.
Abstract:
An organometallic compound represented by Formula 1: M(L1)(L2) Formula 1 wherein in Formula 1, M, L1, and L2 are the same as described in the specificaiton.
Abstract:
A semiconductor device may include a fin active region including a lower fin region surrounded by a device isolation layer and an upper fin active region protruding from a top surface of the device isolation layer, a gate pattern disposed on top and side surfaces of the upper fin active region, and a source/drain region formed in the fin active region located at a side of the gate pattern. The gate pattern extends onto the device isolation region. The source/drain region includes a trench and epitaxial layers that fill the trench. Sidewalls of the trench include first sidewalls and second sidewalls that connect the first sidewalls to a bottom surface of the trench. The bottom surface of the trench is located at a lower level than the top surface of the device isolation layer beneath the gate pattern, and the second sidewalk of the trench have inclined {111} planes.