公开(公告)号：US20120187181A1

公开(公告)日：2012-07-26

申请号：US13436843

申请日：2012-03-31

申请人： Hiroyuki MATSUI ,  Hirohisa Matsuki ,  Koki Otake

发明人： Hiroyuki MATSUI ,  Hirohisa Matsuki ,  Koki Otake

IPC分类号： B23K31/02

CPC分类号： H01L24/11 ,  H01L24/742 ,  H01L24/81 ,  H01L2224/13099 ,  H01L2224/81011 ,  H01L2224/81815 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/3025

摘要： A reflow apparatus, where formic acid is used for cleaning a surface of a solder electrode on a processing target, is disclosed. The reflow apparatus includes a processing chamber, a formic acid introduction mechanism for supplying an atmosphere gas containing formic acid to the processing chamber, and a shielding member that is made of a material having corrosion resistance against formic acid. The shielding member is arranged between a reflow processing section of the processing chamber and an inner wall of the processing chamber. In place of or in addition to the shielding member, the reflow apparatus may include a heater for decomposing residual formic acid.

摘要翻译： 公开了一种回流装置，其中使用甲酸清洗处理对象上的焊料电极的表面。 回流装置包括处理室，用于向处理室供给含有甲酸的气氛气体的甲酸引入机构，以及由对甲酸具有耐腐蚀性的材料制成的屏蔽构件。 屏蔽部件配置在处理室的回流处理部和处理室的内壁之间。 代替或除了屏蔽构件之外，回流装置可以包括用于分解残余甲酸的加热器。

公开(公告)号：US6090301A

公开(公告)日：2000-07-18

申请号：US848717

申请日：1997-05-19

申请人： Masataka Mizukoshi ,  Ichiro Yamaguchi ,  Masahiro Yoshikawa ,  Koki Otake ,  Junichi Kasai

发明人： Masataka Mizukoshi ,  Ichiro Yamaguchi ,  Masahiro Yoshikawa ,  Koki Otake ,  Junichi Kasai

IPC分类号： H01L21/48 ,  H01L21/60 ,  H01L21/68 ,  H05K3/34 ,  H01L21/302

CPC分类号： H05K3/3484 ,  H01L21/4853 ,  H01L21/6835 ,  H01L24/11 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01072 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H05K2201/10734 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/043 ,  H05K3/3478

摘要： A method for fabricating a bump forming plate member by which bumps can be formed on an electronic component. A mask is formed on a surface of a crystalline plate, and the crystalline plate is subjected to anisotropic etching to form a plurality of grooves. The crystalline plate is also subjected to isotropic etching to deepen the grooves. The method can further includes additional anisotropic and isotropic etchings. Also, a method for fabricating a metallic bump forming plate member is disclosed. This method uses the above described crystalline plate having the grooves, and includes fabrication of a replica using the crystalline plate as an original, and fabrication of a metallic bump forming plate member using the replica as an original.

摘要翻译： 一种用于制造凸块形成板构件的方法，通过该凸块形成板构件可以在电子部件上形成凸块。 在结晶板的表面上形成掩模，对各结晶板进行各向异性蚀刻，形成多个槽。 晶片也进行各向同性蚀刻以加深槽。 该方法还可以包括额外的各向异性和各向同性蚀刻。 此外，公开了一种用于制造金属凸块形成板构件的方法。 该方法使用上述具有凹槽的晶片，并且包括使用原版的晶体板制造复制品，以及使用该复制品作为原件制造金属凸块形成板构件。

公开(公告)号：US06732911B2

公开(公告)日：2004-05-11

申请号：US09970802

申请日：2001-10-05

申请人： Hirohisa Matsuki ,  Hiroyuki Matsui ,  Eiji Yoshida ,  Takao Ohno ,  Koki Otake ,  Akiyo Mizutani ,  Motoshu Miyajima ,  Masataka Mizukoshi ,  Eiji Watanabe

发明人： Hirohisa Matsuki ,  Hiroyuki Matsui ,  Eiji Yoshida ,  Takao Ohno ,  Koki Otake ,  Akiyo Mizutani ,  Motoshu Miyajima ,  Masataka Mizukoshi ,  Eiji Watanabe

IPC分类号： B23K3538

CPC分类号： B23K1/008 ,  B23K2101/36 ,  H05K3/3489

摘要： There is provided a chamber open to the outside through openings through which a solder-adhered object is passed and the chamber having a heating/melting area, a carrying mechanism for carrying the solder-adhered object into the heating/melting area, a formic-acid supplying means for supplying a formic acid into the heating/melting area, an exhausting means for exhausting a gas from the heating/melting area and its neighboring area to create a lower pressure area in the heating/melting area as compared to the pressure of outside the chamber, heating means for heating directly or indirectly the solder-adhered object in the heating/melting area, and an air-stream suppressing means for disturbing a gas flow between the heating/melting area and the carrying areas. Accordingly, there can be provided a solder jointing system for jointing solder layers of a semiconductor device, an electronic device, or the like to the wirings or the pads, which is capable of having a high processing ability and preventing re-oxidation.

摘要翻译： 设置有通过开口穿过焊料粘附物体的开口的室，并且具有加热/熔化区域的室，用于将焊料粘附物携带到加热/熔融区域中的承载机构， 用于将甲酸供应到加热/熔化区域的酸供应装置，用于从加热/熔化区域及其相邻区域排出气体的排气装置，以在加热/熔化区域中产生较低压力区域， 在室外，用于在加热/熔化区域中直接或间接加热焊接物体的加热装置，以及用于扰乱加热/熔化区域和承载区域之间的气流的气流抑制装置。 因此，可以提供一种用于将半导体器件，电子器件等的焊料层接合到布线或焊盘上的焊接接合系统，其能够具有高处理能力并防止再氧化。

公开(公告)号：US06528346B2

公开(公告)日：2003-03-04

申请号：US09749521

申请日：2000-12-28

申请人： Masayuki Ochiai ,  Hidefumi Ueda ,  Michio Sono ,  Ichiro Yamaguchi ,  Kazuhiko Mitobe ,  Koki Otake ,  Junichi Kasai ,  Nobuo Kamehara ,  Yasuo Yamagishi ,  Masataka Mizukoshi

发明人： Masayuki Ochiai ,  Hidefumi Ueda ,  Michio Sono ,  Ichiro Yamaguchi ,  Kazuhiko Mitobe ,  Koki Otake ,  Junichi Kasai ,  Nobuo Kamehara ,  Yasuo Yamagishi ,  Masataka Mizukoshi

IPC分类号： H01L2148

CPC分类号： B23K3/0623 ,  H01L21/4853 ,  H01L21/6835 ,  H01L24/11 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15787 ,  H01L2924/351 ,  H05K3/3463 ,  H05K3/3478 ,  H05K3/3484 ,  H05K3/3489 ,  H05K2201/10992 ,  H05K2203/0113 ,  H05K2203/016 ,  H05K2203/0278 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/0557 ,  H05K2203/087 ,  H05K2203/1105 ,  H05K2203/1157 ,  H05K2203/1476 ,  H01L2924/00 ,  H01L2224/05599

摘要： First and second ball forming plates are prepared. The cavities of the first plate and the cavities of the second plate 20 are filled with solder paste, respectively. The first plate and the second plate are placed in a facing relationship to each other and heated to form metal balls each of which corresponds to the total metal components of the solder paste in one cavity of the first plate and one cavity in the second plate. The metal balls are formed in the cavities of the lower plate 10. The metal balls are transferred from the cavities of the first plate to a device on which bumps are to be formed.

摘要翻译： 制备第一和第二球形成板。 第一板的空腔和第二板20的空腔分别用焊膏填充。 第一板和第二板相互放置成面对的关系，并加热形成金属球，每个金属球对应于第一板的一个空腔中的焊膏的总金属成分和第二板中的一个空腔。 金属球形成在下板10的空腔中。金属球从第一板的空腔传送到要在其上形成凸块的装置。

公开(公告)号：US06319810B1

公开(公告)日：2001-11-20

申请号：US08659356

申请日：1996-06-06

申请人： Masayuki Ochiai ,  Yasuo Yamagishi ,  Ichiro Yamaguchi ,  Masahiro Yoshikawa ,  Koki Otake ,  Masataka Mizukoshi ,  Yuuji Watanabe

发明人： Masayuki Ochiai ,  Yasuo Yamagishi ,  Ichiro Yamaguchi ,  Masahiro Yoshikawa ,  Koki Otake ,  Masataka Mizukoshi ,  Yuuji Watanabe

IPC分类号： H01L2144

CPC分类号： H01L24/12 ,  B23K3/0623 ,  H01L21/4853 ,  H01L21/6835 ,  H01L24/11 ,  H01L2224/11003 ,  H01L2224/1111 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/45124 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H05K3/3463 ,  H05K3/3478 ,  H05K3/3484 ,  H05K3/3489 ,  H05K2201/10992 ,  H05K2203/0113 ,  H05K2203/016 ,  H05K2203/0278 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/0557 ,  H05K2203/087 ,  H05K2203/1105 ,  H05K2203/1157 ,  H05K2203/1476 ,  H01L2924/00 ,  H01L2224/48

摘要： Method for forming solder bumps on a first member such as a semiconductor chip having electrode pads formed thereon. A flat plate having holes is prepared and the holes are filled with solder paste by squeezing. The flat plate is then overlapped with the first member with the flat plate above the first plate. The flat plate and the first member are heated to a temperature higher than the melting point of the solder alloy in the solder paste. Therefore, solder bumps having identical sizes and uniform structures can be obtained.

摘要翻译： 在诸如其上形成有电极焊盘的半导体芯片的第一部件上形成焊料凸块的方法。 准备具有孔的平板，并通过挤压填充焊膏。 然后平板与第一构件重叠，平板在第一板上。 平板和第一构件被加热到高于焊膏中的焊料合金的熔点的温度。 因此，可以获得具有相同尺寸和均匀结构的焊料凸块。

公开(公告)号：US6022759A

公开(公告)日：2000-02-08

申请号：US25327

申请日：1998-02-18

申请人： Masaaki Seki ,  Michio Sono ,  Ichiro Yamaguchi ,  Kazuhiko Mitobe ,  Lim Cheang Hai ,  Koki Otake ,  Susumu Abe ,  Junichi Kasai ,  Masao Sakuma ,  Yoshimi Suzuki ,  Yasuhiro Shinma

发明人： Masaaki Seki ,  Michio Sono ,  Ichiro Yamaguchi ,  Kazuhiko Mitobe ,  Lim Cheang Hai ,  Koki Otake ,  Susumu Abe ,  Junichi Kasai ,  Masao Sakuma ,  Yoshimi Suzuki ,  Yasuhiro Shinma

IPC分类号： H01L23/13 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L25/10 ,  H01L21/44 ,  H01L21/58

CPC分类号： H01L23/49816 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49805 ,  H01L25/105 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/8547 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1094 ,  H01L23/5387 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19107

摘要： A semiconductor device includes a semiconductor element, a semiconductor device base member having an element mounting portion on which the semiconductor element is mounted, external connection terminals provided on the semiconductor device base member and electrically connected to the semiconductor element, and a resin sealing the semiconductor element. The semiconductor device base member includes a base part and lead parts supported by the base part. The lead parts are electrically connected to the external connection terminals. The semiconductor device base member has bent portions in which the lead parts are located on outer sides of the semiconductor device base member. The bent portions are located in edge portions of the semiconductor device base member.

摘要翻译： 半导体器件包括半导体元件，半导体器件基底元件，其具有安装半导体元件的元件安装部分，设置在半导体器件基底元件上并与半导体元件电连接的外部连接端子，以及密封半导体元件的树脂 元件。 半导体器件基底部件包括基部和由基部支撑的引线部。 引线部分电连接到外部连接端子。 半导体器件基体具有弯曲部分，其中引线部分位于半导体器件基底部件的外侧。 弯曲部分位于半导体器件基底部件的边缘部分。

公开(公告)号：US5920117A

公开(公告)日：1999-07-06

申请号：US819806

申请日：1997-03-18

申请人： Michio Sono ,  Masashi Takenaka ,  Masanori Yoshimoto ,  Tsuyoshi Aoki ,  Ichiro Yamaguchi ,  Koki Otake

发明人： Michio Sono ,  Masashi Takenaka ,  Masanori Yoshimoto ,  Tsuyoshi Aoki ,  Ichiro Yamaguchi ,  Koki Otake

IPC分类号： H01L23/28 ,  H01L23/12 ,  H01L23/13 ,  H01L23/31 ,  H01L23/433 ,  H01L23/495

CPC分类号： H01L23/13 ,  H01L23/3128 ,  H01L23/4334 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107

摘要： A semiconductor device includes a board having a lower surface, a container part created in the board, external-connection nodes provided on the lower surface of the board, a supporting member provided inside the container part and secured by the board, a semiconductor chip secured on the supporting member and electrically connected with the external-connection nodes, and a sealing resin fully filling the container part so as to completely cover the semiconductor chip.

摘要翻译： 一种半导体器件，包括具有下表面的板，在板上形成的容器部分，设置在板的下表面上的外部连接节点，设置在容器部分内部并由板固定的支撑构件，半导体芯片固定 在支撑构件上并与外部连接节点电连接，并且密封树脂完全填充容器部分以完全覆盖半导体芯片。

公开(公告)号：US08336756B2

公开(公告)日：2012-12-25

申请号：US11361041

申请日：2006-02-24

申请人： Hiroyuki Matsui ,  Hirohisa Matsuki ,  Koki Otake

发明人： Hiroyuki Matsui ,  Hirohisa Matsuki ,  Koki Otake

IPC分类号： B23K1/00 ,  H01L21/44

CPC分类号： H01L24/11 ,  H01L24/742 ,  H01L24/81 ,  H01L2224/13099 ,  H01L2224/81011 ,  H01L2224/81815 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/3025

摘要： A reflow apparatus, where formic acid is used for cleaning a surface of a solder electrode on a processing target, is disclosed. The reflow apparatus includes a processing chamber, a formic acid introduction mechanism for supplying an atmosphere gas containing formic acid to the processing chamber, and a shielding member that is made of a material having corrosion resistance against formic acid. The shielding member is arranged between a reflow processing section of the processing chamber and an inner wall of the processing chamber. In place of or in addition to the shielding member, the reflow apparatus may include a heater for decomposing residual formic acid.

摘要翻译： 公开了一种回流装置，其中使用甲酸清洗处理对象上的焊料电极的表面。 回流装置包括处理室，用于向处理室供给含有甲酸的气氛气体的甲酸引入机构，以及由对甲酸具有耐腐蚀性的材料制成的屏蔽构件。 屏蔽部件配置在处理室的回流处理部和处理室的内壁之间。 代替或除了屏蔽构件之外，回流装置可以包括用于分解残余甲酸的加热器。

公开(公告)号：US08490857B2

公开(公告)日：2013-07-23

申请号：US13436843

申请日：2012-03-31

申请人： Hiroyuki Matsui ,  Hirohisa Matsuki ,  Koki Otake

发明人： Hiroyuki Matsui ,  Hirohisa Matsuki ,  Koki Otake

IPC分类号： B23K1/00 ,  H01L21/44

CPC分类号： H01L24/11 ,  H01L24/742 ,  H01L24/81 ,  H01L2224/13099 ,  H01L2224/81011 ,  H01L2224/81815 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/3025

摘要： A reflow apparatus, where formic acid is used for cleaning a surface of a solder electrode on a processing target, is disclosed. The reflow apparatus includes a processing chamber, a formic acid introduction mechanism for supplying an atmosphere gas containing formic acid to the processing chamber, and a shielding member that is made of a material having corrosion resistance against formic acid. The shielding member is arranged between a reflow processing section of the processing chamber and an inner wall of the processing chamber. In place of or in addition to the shielding member, the reflow apparatus may include a heater for decomposing residual formic acid.

摘要翻译： 公开了一种回流装置，其中使用甲酸清洗处理对象上的焊料电极的表面。 回流装置包括处理室，用于向处理室供给含有甲酸的气氛气体的甲酸引入机构，以及由对甲酸具有耐腐蚀性的材料制成的屏蔽构件。 屏蔽部件配置在处理室的回流处理部和处理室的内壁之间。 代替或除了屏蔽构件之外，回流装置可以包括用于分解残余甲酸的加热器。

公开(公告)号：US20070099411A1

公开(公告)日：2007-05-03

申请号：US11361041

申请日：2006-02-24

申请人： Hiroyuki Matsui ,  Hirohisa Matsuki ,  Koki Otake

发明人： Hiroyuki Matsui ,  Hirohisa Matsuki ,  Koki Otake

IPC分类号： H01L21/44 ,  H01L21/00

CPC分类号： H01L24/11 ,  H01L24/742 ,  H01L24/81 ,  H01L2224/13099 ,  H01L2224/81011 ,  H01L2224/81815 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/3025

摘要： A reflow apparatus, where formic acid is used for cleaning a surface of a solder electrode on a processing target, is disclosed. The reflow apparatus includes a processing chamber, a formic acid introduction mechanism for supplying an atmosphere gas containing formic acid to the processing chamber, and a shielding member that is made of a material having corrosion resistance against formic acid. The shielding member is arranged between a reflow processing section of the processing chamber and an inner wall of the processing chamber. In place of or in addition to the shielding member, the reflow apparatus may include a heater for decomposing residual formic acid.

摘要翻译： 公开了一种回流装置，其中使用甲酸清洗处理对象上的焊料电极的表面。 回流装置包括处理室，用于向处理室供给含有甲酸的气氛气体的甲酸引入机构，以及由对甲酸具有耐腐蚀性的材料制成的屏蔽构件。 屏蔽部件配置在处理室的回流处理部和处理室的内壁之间。 代替或除了屏蔽构件之外，回流装置可以包括用于分解残余甲酸的加热器。