发明授权
- 专利标题： Method for fabricating bump forming plate member
- 专利标题（中）： 凸块形成板构件的制造方法
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申请号： US848717申请日： 1997-05-19
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公开(公告)号： US6090301A公开(公告)日： 2000-07-18
- 发明人: Masataka Mizukoshi , Ichiro Yamaguchi , Masahiro Yoshikawa , Koki Otake , Junichi Kasai
- 申请人： Masataka Mizukoshi , Ichiro Yamaguchi , Masahiro Yoshikawa , Koki Otake , Junichi Kasai
- 申请人地址： JPX Kawasaki
- 专利权人： Fujitsu Limited
- 当前专利权人： Fujitsu Limited
- 当前专利权人地址： JPX Kawasaki
- 优先权： JPX8-321628 19961202
- 主分类号： H01L21/48
- IPC分类号： H01L21/48 ; H01L21/60 ; H01L21/68 ; H05K3/34 ; H01L21/302
摘要：
A method for fabricating a bump forming plate member by which bumps can be formed on an electronic component. A mask is formed on a surface of a crystalline plate, and the crystalline plate is subjected to anisotropic etching to form a plurality of grooves. The crystalline plate is also subjected to isotropic etching to deepen the grooves. The method can further includes additional anisotropic and isotropic etchings. Also, a method for fabricating a metallic bump forming plate member is disclosed. This method uses the above described crystalline plate having the grooves, and includes fabrication of a replica using the crystalline plate as an original, and fabrication of a metallic bump forming plate member using the replica as an original.
公开/授权文献
- US5257790A Combination target 公开/授权日：1993-11-02
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