公开(公告)号：US20140231859A1

公开(公告)日：2014-08-21

申请号：US14236582

申请日：2011-08-01

Applicant: Jae Yoon Kim ,  Seok Min Hwang ,  Su Yeol Lee ,  Seung Wan Chae ,  Jae Ho Han ,  Jin Bock Lee

Inventor： Jae Yoon Kim ,  Seok Min Hwang ,  Su Yeol Lee ,  Seung Wan Chae ,  Jae Ho Han ,  Jin Bock Lee

IPC: H01L33/38 ,  H01L33/62 ,  H01L33/32

CPC classification number: H01L33/387 ,  H01L33/20 ,  H01L33/32 ,  H01L33/38 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0016 ,  H01L2924/00

Abstract: A semiconductor light emitting device may include: a light emitting structure including an n-type semiconductor layer, a p-type semiconductor layer, and an active layer interposed therebetween; a first electrode connected to one of the n-type semiconductor layer and the p-type semiconductor layer; and a second electrode connected to the other of the n-type semiconductor layer and the p-type semiconductor layer. The first electrode may include a first electrode pad disposed in a central portion of one side of the light emitting structure and first to third branch electrodes connected to the first electrode pad, having a fork shape. The second electrode may include second and third electrode pads disposed separately in both corners of the other side opposing the one side and fourth to seventh branch electrodes connected thereto. The fourth and seventh branch electrodes may extend in an interdigitated manner between the first to third branch electrodes.

Abstract translation: 半导体发光器件可以包括：包含n型半导体层，p型半导体层和插入其间的有源层的发光结构; 连接到所述n型半导体层和所述p型半导体层之一的第一电极; 以及与n型半导体层和p型半导体层中的另一方连接的第二电极。 第一电极可以包括设置在发光结构的一侧的中心部分中的第一电极焊盘和连接到具有叉形状的第一电极焊盘的第一至第三分支电极。 第二电极可以包括分别位于与一侧相对的另一侧的两个角部和与其连接的第四至第七分支电极的第二和第三电极焊盘。 第四和第七分支电极可以在第一至第三分支电极之间以叉指方式延伸。

公开(公告)号：US20110169359A1

公开(公告)日：2011-07-14

申请号：US12773725

申请日：2010-05-04

Applicant: Jin Sun MIN ,  Dong Yeon Shin ,  Jae Yoon Kim

Inventor： Jin Sun MIN ,  Dong Yeon Shin ,  Jae Yoon Kim

IPC: H02K5/16

CPC classification number: H02K5/163 ,  F16C35/02

Abstract: Disclosed herein is an assembly structure of a bearing and a holder of a brushless DC motor. The bearing is forcibly fitted into a hollow space formed through the holder. A beveled mouth edge is formed on the upper end of the circumferential inner surface of the holder through which the bearing enters the holder. Therefore, the assembly structure can enhance the workability of the process of assembling the bearing with the holder.

Abstract translation: 这里公开了一种无刷直流电动机的轴承和保持器的组装结构。 轴承被强制地装配到通过支架形成的中空空间中。 在支架的周向内表面的上端形成有斜口嘴缘，轴承进入保持器。 因此，组装结构可以提高轴承与支架的组装过程的可加工性。

公开(公告)号：US07944043B1

公开(公告)日：2011-05-17

申请号：US12169151

申请日：2008-07-08

Applicant: Young Suk Chung ,  Jae Yoon Kim ,  Tae Yong Lee

Inventor： Young Suk Chung ,  Jae Yoon Kim ,  Tae Yong Lee

IPC: H01L23/04

CPC classification number: H01L23/3128 ,  H01L21/4832 ,  H01L21/486 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49582 ,  H01L23/498 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2221/68345 ,  H01L2224/32225 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/85001 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18165 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package has an insulative layer having at least one channel formed on a first surface thereof. A conductive pattern conforming to the at least one channel and exposed to a bottom surface of the semiconductor package is formed. A semiconductor die is electrically connected to the conductive patterns. An encapsulant is used to at least partially filling the at least one channel.

Abstract translation: 半导体封装具有在其第一表面上形成有至少一个沟道的绝缘层。 形成符合至少一个通道并暴露于半导体封装的底表面的导电图案。 半导体管芯电连接到导电图案。 密封剂用于至少部分填充至少一个通道。

公开(公告)号：US06040390A

公开(公告)日：2000-03-21

申请号：US119340

申请日：1998-07-20

Applicant: Young-Hoon Ko ,  Jung-Goo Lee ,  Jae-Yoon Kim

Inventor： Young-Hoon Ko ,  Jung-Goo Lee ,  Jae-Yoon Kim

IPC: C08C19/02 ,  C08F8/04 ,  C08F36/04 ,  C08F236/10

CPC classification number: C08F8/04 ,  C08C19/02

Abstract: This invention relates to a process for hydrogenating selectively the unsaturated double bonds of copolymer having the double bonds of conjugated diene unit, which has been widely used as a modifier of transparent impact-resistant resin or polyolefin, and polystyrene resin. According to this invention, the copolymer is saturated via hydrogenation in the presence of a novel homogeneous system organotitanium catalyst without a separate reducing agent, thus representing an extremely high hydrogenation yield with remarkable hydrogenation reproducibility. Hence, a compound represented by the following formula I is employed as an appropriate catalyst.Formula I ##STR1## Wherein Cp is a cyclopentadienyl (C.sub.5 H.sub.5) group; R.sub.1, R.sub.2 and R.sub.3 are hydrogen atom or alkyl group of 1 to 3 carbon atoms; andR.sub.1, R.sub.2 and R.sub.3 can be the same or different.

Abstract translation: 本发明涉及一种已广泛用作透明耐冲击性树脂或聚烯烃改性剂和聚苯乙烯树脂的共轭二烯单元双键共聚物的不饱和双键氢化方法。 根据本发明，在没有单独的还原剂的新型均相体系的有机钛催化剂的存在下，通过氢化使共聚物饱和，从而以显着的氢化重现性表现出非常高的氢化产率。 因此，使用下式I表示的化合物作为合适的催化剂。 其中Cp是环戊二烯基（C 5 H 5）基团; R1，R2和R3是氢原子或1〜3个碳原子的烷基; 并且R 1，R 2和R 3可以相同或不同。

公开(公告)号：US09130125B2

公开(公告)日：2015-09-08

申请号：US14237461

申请日：2011-08-17

Applicant: Seok Min Hwang ,  Hae Soo Ha ,  Jae Yoon Kim ,  Jae Ho Han

Inventor： Seok Min Hwang ,  Hae Soo Ha ,  Jae Yoon Kim ,  Jae Ho Han

IPC: H01L33/38 ,  H01L33/20

CPC classification number: H01L33/38 ,  H01L33/20

Abstract: A semiconductor light emitting device may include an n-type semiconductor layer, an active layer and a p-type semiconductor layer disposed in a first region corresponding to a portion of an upper surface of the n-type semiconductor layer, an n-type electrode formed in a second region distinct from the first region on the n-type semiconductor layer to be electrically connected to the n-type semiconductor layer and including an n-type electrode pad and first and second n-type electrode fingers, and a p-type electrode formed on the p-type semiconductor layer to be electrically connected to the p-type semiconductor layer and including a p-type electrode pad and a p-type electrode finger. A distance between n-type and p-type electrodes may be constant to significantly reduce a phenomenon of concentration of a current in a specific region of an electrode.

Abstract translation: 半导体发光器件可以包括n型半导体层，有源层和p型半导体层，其设置在与n型半导体层的上表面的一部分对应的第一区域中，n型电极 形成在与n型半导体层上的与n型半导体层电连接的第一区域不同的第二区域中，并且包括n型电极焊盘和第一和第n型电极指， 形成在p型半导体层上以与p型半导体层电连接并且包括p型电极焊盘和p型电极指的p型电极。 n型和p型电极之间的距离可以是恒定的，以显着减少电极的特定区域中的电流浓度的现象。

公开(公告)号：US08829540B2

公开(公告)日：2014-09-09

申请号：US13029739

申请日：2011-02-17

Applicant: Sung Tae Kim ,  Tae Hun Kim ,  Jae Yoon Kim ,  Hae Soo Ha

Inventor： Sung Tae Kim ,  Tae Hun Kim ,  Jae Yoon Kim ,  Hae Soo Ha

IPC: H01L29/18 ,  H01L27/15 ,  H01L33/62 ,  H01L33/46 ,  H01L33/60 ,  H01L33/20

CPC classification number: H01L27/156 ,  H01L33/20 ,  H01L33/46 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2933/0091 ,  H01L2924/00014

Abstract: A semiconductor light emitting device includes a substrate, a plurality of light emitting cells, a connection part, and a concavo-convex part. The light emitting cells are arrayed on the top surface of the substrate. Each of the light emitting cells has a first-conductivity-type semiconductor layer, an active layer, and a second-conductivity-type semiconductor layer that are sequentially stacked on the top surface of the substrate. The connection part is formed to connect the light emitting cells in series, parallel or series-parallel. The concavo-convex part is formed in at least one of the bottom surface of the substrate and the top surface of an isolation region between the light emitting cells.

Abstract translation: 半导体发光器件包括衬底，多个发光单元，连接部分和凹凸部分。 发光单元排列在基板的顶表面上。 每个发光单元具有依次层叠在基板的顶面上的第一导电型半导体层，有源层和第二导电型半导体层。 连接部分形成为将发光单元串联，并联或串联连接。 凹凸部形成在基板的底表面和发光单元之间的隔离区域的顶表面中的至少一个中。

公开(公告)号：US08674485B1

公开(公告)日：2014-03-18

申请号：US12963431

申请日：2010-12-08

Applicant: Gi Jeong Kim ,  Jae Yoon Kim ,  Kyu Won Lee

Inventor： Gi Jeong Kim ,  Jae Yoon Kim ,  Kyu Won Lee

IPC: H01L23/495

CPC classification number: H01L23/49575 ,  H01L23/49541 ,  H01L23/49551 ,  H01L23/49558 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: In one embodiment, a semiconductor package includes a generally planar die paddle or die pad that defines multiple peripheral edge segments, and includes one or more tie bars protruding therefrom. In addition, the semiconductor package includes a plurality of leads, portions of which protrude from respective side surfaces of a package body of the semiconductor package. Connected to the top surface of the die pad is at least one semiconductor die which is electrically connected to at least some of the leads. At least portions of the die pad, the leads, and the semiconductor die are encapsulated by the package body. The one or more tie bars and the plurality of leads include downsets that are sized and oriented relative to each other to facilitate enhanced manufacturing.

Abstract translation: 在一个实施例中，半导体封装包括限定多个周边边缘段的大致平面的管芯焊盘或管芯焊盘，并且包括从其突出的一个或多个连接杆。 此外，半导体封装包括多个引线，其多个引线从半导体封装的封装主体的相应侧表面突出。 连接到管芯焊盘的顶表面的是至少一个半导体管芯，其电连接到至少一些引线。 芯片焊盘，引线和半导体管芯的至少一部分被封装体封装。 一个或多个连接杆和多个引线包括相对于彼此定尺寸和定向的下沉，以有助于增强制造。

公开(公告)号：US08484669B2

公开(公告)日：2013-07-09

申请号：US12926776

申请日：2010-12-08

Applicant: Viatcheslav Smirnov ,  Kyung Su Park ,  Jae Yoon Kim

Inventor： Viatcheslav Smirnov ,  Kyung Su Park ,  Jae Yoon Kim

IPC: G11B17/03 ,  G11B17/028 ,  G11B19/20 ,  H02K5/00 ,  F16C33/02

CPC classification number: H02K5/1675 ,  G11B19/2009 ,  H02K1/187

Abstract: A motor in which a coupling structure between a sleeve holder and a base plate is improved. The motor may include a base plate including at least one protrusion supporting part formed therein; and a sleeve holder including a cylindrical shaped body part to which a sleeve is fastened in an inside of the sleeve holder, an extension part protruded such that an outer diameter is extended along an outer circumferential surface of the body part, and a flange part vertically protruded in an outer diameter direction from a lower end portion of the extension part so as to make surface contact with an upper surface of the base plate, where the sleeve holder is fastened to the base plate while an outer circumferential surface of the protrusion supporting part is brought into contact with an inner circumferential surface of the extension part.

Abstract translation: 一种电动机，其中套筒保持架和基板之间的联接结构得到改善。 马达可以包括：底板，其包括形成在其中的至少一个突起支撑部; 以及套筒保持器，其包括圆筒形主体部分，套筒紧固在套筒保持器的内部，延伸部分突出，使得外径沿着主体部分的外周表面延伸，并且凸缘部分垂直 从延伸部的下端部沿外径方向突出，以便与基板的上表面接触，其中套筒保持器固定在基板上，而突起支撑部分的外周面 与延伸部的内周面接触。

公开(公告)号：US08258662B2

公开(公告)日：2012-09-04

申请号：US12773725

申请日：2010-05-04

Applicant: Jin Sun Min ,  Dong Yeon Shin ,  Jae Yoon Kim

Inventor： Jin Sun Min ,  Dong Yeon Shin ,  Jae Yoon Kim

IPC: H02K5/00

CPC classification number: H02K5/163 ,  F16C35/02

Abstract: Disclosed herein is an assembly structure of a bearing and a holder of a brushless DC motor. The bearing is forcibly fitted into a hollow space formed through the holder. A beveled mouth edge is formed on the upper end of the circumferential inner surface of the holder through which the bearing enters the holder. Therefore, the assembly structure can enhance the workability of the process of assembling the bearing with the holder.

Abstract translation: 这里公开了一种无刷直流电动机的轴承和保持器的组装结构。 轴承被强制地装配到通过支架形成的中空空间中。 在支架的周向内表面的上端形成有斜口嘴缘，轴承进入保持器。 因此，组装结构可以提高轴承与支架的组装过程的可加工性。

公开(公告)号：US08227921B1

公开(公告)日：2012-07-24

申请号：US13290451

申请日：2011-11-07

Applicant: Doo Hyun Park ,  Jae Yoon Kim ,  Yoon Ha Jung

Inventor： Doo Hyun Park ,  Jae Yoon Kim ,  Yoon Ha Jung

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/12 ,  H01L21/44

CPC classification number: H01L24/97 ,  H01L21/4832 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49582 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/16245 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/838 ,  H01L2224/85001 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512

Abstract: The present invention is related to a semiconductor package and method for fabricating the same wherein the semiconductor package includes a die pad having a semiconductor die mounted thereto, and two or more sets of leads or I/O pads which extend at least partially about the die pad in spaced relation thereto and to each other. The formation of the die pad and the leads of the leadframe are facilitated by the completion of multiple plating and chemical etching processes in a prescribed sequence. The present invention is further related to a semiconductor package and method for fabricating the same wherein the semiconductor package includes a semiconductor die electrically connected a plurality of leads or I/O pads via a flip chip type connection, each of the leads being formed by the completion of multiple plating and chemical etching processes in a prescribed sequence.

Abstract translation: 本发明涉及一种半导体封装及其制造方法，其中半导体封装包括具有安装在其上的半导体管芯的管芯焊盘，以及至少部分地围绕模具延伸的两组或多组引线或I / O焊盘 衬垫彼此间隔开并且彼此。 通过以规定的顺序完成多次电镀和化学蚀刻工艺，促进了芯片焊盘和引线框架的引线的形成。 本发明还涉及半导体封装及其制造方法，其中半导体封装包括通过倒装芯片型连接电连接多个引线或I / O焊盘的半导体管芯，每个引线由 以规定的顺序完成多次电镀和化学蚀刻工艺。