公开(公告)号：US11149460B2

公开(公告)日：2021-10-19

申请号：US16607614

申请日：2018-05-04

Applicant: EFFECT PARKING LIMITED (HONG KONG) ,  George Wing Chung Lee

Inventor： George Wing Chung Lee ,  Man Wing Lee

IPC: E04H6/18 ,  B66F7/02 ,  B66F7/28

Abstract: A parking system is described. The system includes a parking tower. The parking tower includes at least two levels and a vertical passageway. A vehicle gripping system is provided. The vehicle gripping system includes a 5 vertical lift frame vertically movable in the passageway. The vehicle gripping system also includes a horizontal slide frame slidably coupled to the vertical lift frame and horizontally movable relative to the vertical lift frame and across each level. A sliding wheel gripper is slidably coupled to and extending downwards from the horizontal slide frame, for releasably gripping a vehicle 10 by gripping the wheels of the vehicle. The sliding wheel gripper is longitudinally slidable along the horizontal slide frame between a release position and a gripping position.

公开(公告)号：US09437459B2

公开(公告)日：2016-09-06

申请号：US14267378

申请日：2014-05-01

Applicant: Burton J. Carpenter ,  Chu-Chung Lee ,  Tu-Anh N. Tran

Inventor： Burton J. Carpenter ,  Chu-Chung Lee ,  Tu-Anh N. Tran

IPC: H01L21/48 ,  H01L21/56 ,  H01L23/498 ,  H01L23/31

CPC classification number: H01L21/4853 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49866 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45664 ,  H01L2224/48091 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: An electronic component package that includes a package substrate having an aluminum bond pad formed from an aluminum clad copper structure. The aluminum clad copper structure is attached to a dielectric layer. An electronic component is attached to the substrate and includes a conductive structure electrically coupled to the aluminum bond pad. The aluminum bond pad, the electronic component, and at least a portion of the substrate are encapsulated with an encapsulant.

Abstract translation: 一种电子部件封装，其包括具有由铝包铜结构形成的铝接合焊盘的封装基板。 铝包铜结构附着在电介质层上。 电子部件附接到基板并且包括电耦合到铝接合焊盘的导电结构。 铝合金焊盘，电子部件以及基板的至少一部分用密封剂封装。

公开(公告)号：US09331050B2

公开(公告)日：2016-05-03

申请号：US13355748

申请日：2012-01-23

Applicant: Kevin J. Hess ,  Chu-Chung Lee

Inventor： Kevin J. Hess ,  Chu-Chung Lee

IPC: H01L23/00

CPC classification number: H01L24/85 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05009 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/05664 ,  H01L2224/05669 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4556 ,  H01L2224/45599 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48453 ,  H01L2224/48465 ,  H01L2224/48507 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48664 ,  H01L2224/48669 ,  H01L2224/48724 ,  H01L2224/48747 ,  H01L2224/48764 ,  H01L2224/48769 ,  H01L2224/48824 ,  H01L2224/48847 ,  H01L2224/48864 ,  H01L2224/49171 ,  H01L2224/78301 ,  H01L2224/85205 ,  H01L2224/85424 ,  H01L2224/85447 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/48869 ,  H01L2924/00015 ,  H01L2924/013 ,  H01L2924/00013

Abstract: Methods of forming gold-aluminum electrical interconnects are described. The method may include interposing a diffusion retardant layer between the gold and the aluminum, the diffusion retardant layer including regions containing and regions substantially devoid of a diffusion retardant material; bringing into contact the diffusion retardant layer, the gold, and the aluminum; forming alloys of gold and the diffusion retardant material in regions containing the material and forming gold-aluminum intermetallic compounds in regions substantially devoid of the material; and forming a continuous electrically conducting path between the aluminum and the gold. A structure for gold-aluminum interconnect is provided. The structure may include an aluminum alloy bond pad and a diffusion retardant layer in contact with the bond pad, the diffusion retardant layer including regions containing and regions substantially devoid of a diffusion retardant material. The structure may include a gold free air ball in contact with the diffusion retardant layer.

Abstract translation: 描述形成金 - 铝电互连的方法。 该方法可以包括在金和铝之间插入扩散阻挡层，扩散阻挡层包含含有基本上没有扩散阻挡材料的区域; 与扩散阻挡层，金和铝接触; 在含有材料的区域中形成金和扩散阻挡材料的合金，并在基本上不含该材料的区域中形成金 - 铝金属间化合物; 并在铝和金之间形成连续的导电路径。 提供了金 - 铝互连结构。 该结构可以包括铝合金接合焊盘和与接合焊盘接触的扩散阻挡层，扩散阻挡层包括含有基本上没有扩散阻挡材料的区域。 该结构可以包括与扩散阻挡层接触的无金空气球。

公开(公告)号：US20150303169A1

公开(公告)日：2015-10-22

申请号：US14255450

申请日：2014-04-17

Applicant: Tu-Anh N. Tran ,  Yin Kheng Au ,  Burton J. Carpenter ,  Chu-Chung Lee

Inventor： Tu-Anh N. Tran ,  Yin Kheng Au ,  Burton J. Carpenter ,  Chu-Chung Lee

IPC: H01L23/00

CPC classification number: H01L24/85 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48451 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48507 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/78303 ,  H01L2224/85045 ,  H01L2224/85181 ,  H01L2224/85444 ,  H01L2224/85801 ,  H01L2924/00014 ,  H01L2924/15747 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

Abstract: A method for forming a semiconductor device includes forming a first ball bond on a first contact pad, in which the first ball bond has a first wire segment of a bonding wire extending from the ball bond; forming a mid-span ball in the first wire segment at a first distance from the ball bond; and after the forming the mid-span ball, attaching the mid-span ball to a second contact pad to form a second ball bond.

Abstract translation: 一种形成半导体器件的方法包括在第一接触焊盘上形成第一球焊，其中第一球焊接具有从球焊接延伸的接合线的第一线段; 在距离球接头的第一距离处在第一线段中形成中跨球; 并且在形成中跨球之后，将中跨球附接到第二接触垫以形成第二球接合。

公开(公告)号：US20150090480A1

公开(公告)日：2015-04-02

申请号：US14042662

申请日：2013-09-30

Applicant: TU-ANH N. TRAN ,  Chu-Chung Lee

Inventor： TU-ANH N. TRAN ,  Chu-Chung Lee

IPC: H05K1/11 ,  H05K3/40 ,  H05K1/09

CPC classification number: H01L24/85 ,  H01L24/03 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/04042 ,  H01L2224/05017 ,  H01L2224/05085 ,  H01L2224/05558 ,  H01L2224/05624 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/45644 ,  H01L2224/45664 ,  H01L2224/48453 ,  H01L2224/48463 ,  H01L2224/48507 ,  H01L2224/48824 ,  H01L2224/78301 ,  H01L2224/85181 ,  H01L2224/85207 ,  H01L2224/8581 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  Y10T29/49124 ,  H01L2924/01004 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/01012 ,  H01L2924/01016 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An electronic component package includes a substrate and dielectric structure. The dielectric structure includes a top surface having a protrusion portion and a lower portion. The protrusion portion is located at first height that is greater than a second height of the lower portion. A conductive bond pad is located over the dielectric structure. A ball bond electrically couples the bond pad and a bond wire. An intermetallic compound located between the ball bond and bond pad is formed of material of the ball bond and bond pad and electrically couples the bond pad to the ball bond. A portion of the bond pad is vertically located between a portion of the lower portion of the top surface of the dielectric structure and the intermetallic compound. No portion of the bond pad is vertically located between at least a portion of the protrusion portion and the intermetallic compound.

Abstract translation: 电子部件封装包括基板和电介质结构。 电介质结构包括具有突出部分和下部分的顶表面。 突出部位于大于下部的第二高度的第一高度。 导电接合焊盘位于电介质结构之上。 球接合电耦合接合焊盘和接合线。 位于球焊接和焊盘之间的金属间化合物由球焊和焊盘的材料形成，并将焊接焊盘电连接到球焊上。 接合焊盘的一部分垂直地位于电介质结构的顶表面的下部的一部分和金属间化合物之间。 接合焊盘的没有部分垂直地位于突出部分的至少一部分和金属间化合物之间。

公开(公告)号：US08975255B2

公开(公告)日：2015-03-10

申请号：US13571158

申请日：2012-08-09

Applicant: Deh-Ming Chang ,  Hsu-Shan Huang ,  Chia-Chung Lee ,  Chun-Liang Chen

Inventor： Deh-Ming Chang ,  Hsu-Shan Huang ,  Chia-Chung Lee ,  Chun-Liang Chen

IPC: C07D265/26 ,  A61K31/538

CPC classification number: C07D265/18 ,  C07C47/55 ,  C07C231/10 ,  C07C235/64 ,  C07C255/60 ,  C07D265/26

Abstract: The present invention provides a biphenyl benzamide-derived derivatives, which structure is selected from formula I or formula II: and the synthesis and the application thereof.

Abstract translation: 本发明提供了联苯苯甲酰胺衍生物，其结构选自式I或式II：及其合成及应用。

公开(公告)号：US08912667B2

公开(公告)日：2014-12-16

申请号：US13362636

申请日：2012-01-31

Applicant: Robert J. Wenzel ,  Kevin J. Hess ,  Chu-Chung Lee

Inventor： Robert J. Wenzel ,  Kevin J. Hess ,  Chu-Chung Lee

IPC: H01L29/40 ,  H01L21/44 ,  H01L23/532 ,  H01L21/02 ,  H01L23/00

CPC classification number: H01L23/5329 ,  H01L21/02126 ,  H01L23/295 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/32225 ,  H01L2224/48135 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49095 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/3025 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A semiconductor device includes an integrated circuit die on a substrate. A first subset of wire bonds is between the substrate and the die. A second subset of wire bonds is between the substrate and the die. A dielectric material coats the first subset of the wire bonds along a majority of length of the first subset of the wire bonds. A medium is in contact with the second subset of the wire bonds along a majority of length of the second subset of the wire bonds.

Abstract translation: 半导体器件包括在衬底上的集成电路管芯。 引线键合的第一子集在基片和芯片之间。 引线键合的第二个子集在基片和芯片之间。 电介质材料沿引线键的第一子集的大部分长度覆盖引线键的第一子集。 介质沿着线接合的第二子集的长度的大部分与引线键的第二子集接触。

公开(公告)号：USD718675S1

公开(公告)日：2014-12-02

申请号：US29458682

申请日：2013-06-21

Applicant: Matthew Niven Sperling ,  Chung Lee

Designer： Matthew Niven Sperling ,  Chung Lee

公开(公告)号：USD716195S1

公开(公告)日：2014-10-28

申请号：US29458695

申请日：2013-06-21

Applicant: Matthew Niven Sperling ,  Chung Lee

Designer： Matthew Niven Sperling ,  Chung Lee

公开(公告)号：US20140190571A1

公开(公告)日：2014-07-10

申请号：US14209216

申请日：2014-03-13

Applicant: Junhua Ding ,  Michael L'Bassi ,  Tseng-Chung Lee

Inventor： Junhua Ding ,  Michael L'Bassi ,  Tseng-Chung Lee

IPC: G05D7/06

CPC classification number: G05D7/0635 ,  Y10T137/0318 ,  Y10T137/86389

Abstract: A system for delivering pulses of a desired mass of gas to a tool, comprising: a mass flow controller including flow sensor, a control valve and a dedicated controller configured and arranged to receive a recipe of a sequence of steps for opening and closing the control valve so as to deliver as sequence of gas pulses as a function of the recipe. The mass flow controller is configured and arranged so as to operate in either one of at least two modes: as a traditional mass flow controller (MFC) mode or in a pulse gas delivery (PGD) mode. Further, the mass flow controller includes an input configured to receive an input signal; an output configured to provide an output signal; a communication port configured to receive program instructions; memory configured and arranged to receive programming data determining the programmed configuration of the mass flow controller as either a digital or analog configuration; and a processor/controller for operating the mass flow controller in accordance with the programmed configuration.

Abstract translation: 一种用于将期望质量的气体脉冲输送到工具的系统，包括：质量流量控制器，包括流量传感器，控制阀和专用控制器，其被配置和布置成接收用于打开和关闭控制的一系列步骤的配方 阀门，以作为配方的函数输送气体脉冲序列。 质量流量控制器被配置和布置成以至少两种模式中的任一种操作：作为传统质量流量控制器（MFC）模式或脉冲气体输送（PGD）模式。 此外，质量流量控制器包括被配置为接收输入信号的输入; 被配置为提供输出信号的输出; 通信端口，被配置为接收程序指令; 存储器被配置和布置成接收将质量流量控制器的编程配置确定为数字或模拟配置的编程数据; 以及用于根据编程配置操作质量流量控制器的处理器/控制器。