公开(公告)号：US20070022602A1

公开(公告)日：2007-02-01

申请号：US11495045

申请日：2006-07-28

申请人： Howard Kingsford ,  William Clune ,  Kristel Ferry

发明人： Howard Kingsford ,  William Clune ,  Kristel Ferry

IPC分类号： H01K3/22

CPC分类号： B29C43/222 ,  A44B18/0049 ,  B29C43/46 ,  B29C2043/461 ,  B29C2043/465 ,  B29L2031/729 ,  H05K1/0284 ,  H05K1/0393 ,  H05K3/0014 ,  H05K3/0058 ,  H05K3/0091 ,  H05K3/107 ,  H05K3/125 ,  H05K3/1258 ,  H05K3/28 ,  H05K2201/0129 ,  H05K2201/09036 ,  H05K2201/09118 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2201/209 ,  H05K2203/0108 ,  H05K2203/013 ,  H05K2203/0143 ,  H05K2203/1366 ,  H05K2203/1545 ,  Y10T29/49128 ,  Y10T29/49158

摘要： A method of forming a flexible conductive strip includes: molding a continuous, flexible base of an electrically insulating thermoplastic resin, while forming channels in a surface of the base; at least partially filling the formed channels with a flowable, electrically conductive composition; and then stabilizing the flowable composition in the channels to form a pattern of stable, electrically conductive traces within the channels. A method of forming a flexible circuit board having loop-engageable touch fastener elements includes: molding a continuous, flexible base from an electrically insulating thermoplastic resin, while forming a field of stems integrally molded with and extending from a first side of the base; applying a conductive material to the base to form a pattern of electrically conductive traces in accordance with a circuit design; and forming loop-engageable heads on the stems.

摘要翻译： 一种形成柔性导电带的方法包括：在电绝缘热塑性树脂的模制中模制连续的柔性基底，同时在基底表面形成通道; 至少部分地用可流动的导电组合物填充所形成的通道; 然后稳定通道中的可流动组合物，以在通道内形成稳定的导电迹线图案。 一种形成具有可环路接触的紧固件元件的柔性电路板的方法包括：从电绝缘热塑性树脂模制连续的柔性基座，同时形成与基座的第一侧整体模制并从基座的第一侧延伸的杆的场; 将导电材料施加到基底以根据电路设计形成导电迹线图案; 并在茎上形成可圈套的头部。

公开(公告)号：US20050098262A1

公开(公告)日：2005-05-12

申请号：US11015273

申请日：2004-12-16

申请人： Chia-Pin Lin ,  Chih-Peng Fan ,  Chang-Yun Hung ,  Sheng-Chou Lee

发明人： Chia-Pin Lin ,  Chih-Peng Fan ,  Chang-Yun Hung ,  Sheng-Chou Lee

IPC分类号： B32B15/04 ,  B32B15/20 ,  H05K3/38 ,  B32B31/26

CPC分类号： B32B15/04 ,  B32B15/20 ,  B32B2037/243 ,  B32B2038/0076 ,  B32B2307/3065 ,  B32B2311/12 ,  B32B2379/08 ,  B32B2457/08 ,  H05K3/386 ,  H05K2201/0355 ,  H05K2203/0143 ,  H05K2203/0759 ,  H05K2203/1366

摘要： A method of laminating copper foil onto a substrate of a printed circuit board, wherein the substrate has an upper surface and a lower surface. Isolating material is coated onto both surfaces of the substrate to form isolating layers on the substrate. The isolating layers can be formed by roll coating, spray coating or screen printing. The thickness of the isolating layers can be controlled in accordance to the requirements of the circuits. Various types of metal foils can be laminated onto the isolating layers, followed by heating and pressurization processes to secure the metal foil onto the substrate.

摘要翻译： 一种将铜箔层压到印刷电路板的基板上的方法，其中基板具有上表面和下表面。 将隔离材料涂覆在基板的两个表面上以在基板上形成隔离层。 隔离层可以通过辊涂，喷涂或丝网印刷形成。 隔离层的厚度可以根据电路的要求进行控制。 可以将各种类型的金属箔层压到隔离层上，然后进行加热和加压工艺以将金属箔固定到基底上。

公开(公告)号：US5843621A

公开(公告)日：1998-12-01

申请号：US549684

申请日：1996-02-27

申请人： Hans-Jurgen Schafer

发明人： Hans-Jurgen Schafer

IPC分类号： G03F7/16 ,  H05K3/00 ,  H05K3/12 ,  H05K3/22 ,  G03F7/38 ,  B05B5/00 ,  B05C1/00 ,  B05C11/00

CPC分类号： H05K3/0091 ,  G03F7/16 ,  H05K2203/0143 ,  H05K2203/0577 ,  H05K2203/111 ,  H05K2203/1366 ,  H05K2203/1476 ,  H05K2203/1509 ,  H05K2203/1572 ,  H05K2203/159 ,  H05K3/1216 ,  H05K3/227

摘要： A process for coating printed circuit boards is described, comprising the following process steps: the printed circuit boards on the coating side are kept at room temperature and, as appropriate, are heated to approximately 120.degree. C.; then in a first step, a preferably photopolymerisable, meltable, low-molecular-weight coating composition that preferably has an average molecular weight of from 500 to 1500 and that is highly viscous to solid at room temperature is coated in a thickness of approximately from 10 .mu.m to 200 .mu.m on to the surface(s) of the printed circuit board to be coated; in a second step, a second, high-molecular-weight, photopolymerisable coating composition preferably having an average molecular weight of from 2000 to 10000 is applied in a thickness of from 2 .mu.m to 20 .mu.m over the first layer; and the printed circuit boards so coated are cooled to room temperature and the two-layer photopolymerisable coating is exposed, preferably in contact with a mask, is developed and is cured fully. An apparatus for carrying out the process outlined above is also described.

摘要翻译： PCT No.PCT / IB94 / 00101 Sec。 371日期1996年2月27日 102（e）日期1996年2月27日PCT 1994年5月10日PCT公布。 公开号WO94 / 27189 日期：1994年11月24日描述了印刷电路板的涂布方法，其包括以下工序：将涂布侧的印刷电路板保持在室温，并适当地加热至约120℃。 然后在第一步骤中，优选可光聚合的，可熔融的低分子量涂料组合物，其涂层厚度约为10，优选平均分子量为500至1500，并且在室温下具有高粘度性至固体。 在待涂布的印刷电路板的表面上，至少200μm; 在第二步中，优选在平均分子量为2000〜10000的第二高分子量可光聚合涂料组合物上涂覆厚度为2μm至20μm的第一层; 并将如此涂布的印刷电路板冷却至室温，并且显影两层可光聚合涂层，优选与面罩接触，并完全固化。 还描述了用于执行上述过程的装置。

公开(公告)号：US5733376A

公开(公告)日：1998-03-31

申请号：US283987

申请日：1994-08-01

申请人： Bernard J. Costello

发明人： Bernard J. Costello

IPC分类号： B05B13/04 ,  B05C9/04 ,  H05K3/00 ,  B05C11/00

CPC分类号： B05B13/041 ,  H05K3/0091 ,  B05C9/04 ,  H05K2203/1366 ,  H05K2203/1476 ,  H05K2203/1509 ,  H05K2203/1572 ,  H05K2203/1581

摘要： Apparatus for sequentially coating opposite major surfaces of a workpiece such as a printed circuit board and wherein the amount of manual handling is significantly reduced. Boards are arranged end-to-end preferably in closely spaced fashion upon a conveyor having an adjustable drive. First and second spray assemblies provide a low pressure spray having a substantially oval-shaped spray pattern and are arranged upon guide tracks to move in a reciprocating fashion in a direction transverse to the direction of movement of the conveyor for coating opposing surfaces of the workpiece. The speed of movement of the spray heads and the extreme ends of the range of movement are adjustable by controlling the operation of a drive motor to create a substantially Z-shaped spray pattern on the workpiece with the size of the Z-shaped pattern being a function of the conveyor speed spray head assembly, drive speed and range of movement of each spray head assembly. Control may be exerted by a microprocessor based computer system receiving input information regarding size of workpiece, thickness of coating and the like for automatically controlling the conveyor motor and the spray assembly motor thus further simplifying the speed and ease of setup changes as well as significantly reducing waste of coating material and the like. An exhaust system is provided for each spray assembly to remove and dispose of unused spray, fumes and the like. Shields are provided to shield marginal edges of workpieces and the edge conveyors from overspray and to divert accumulated overspray to a collector.

摘要翻译： 用于顺序地涂覆诸如印刷电路板的工件的相对主表面的装置，并且其中手动处理的量显着减少。 板被优选以紧密间隔的方式端对端设置在具有可调驱动器的输送机上。 第一和第二喷射组件提供具有基本上椭圆形喷雾图案的低压喷雾，并且布置在导轨上以沿着与传送器的运动方向相反的方向往复运动的方式移动以涂覆工件的相对表面。 喷头的移动速度和运动范围的末端可通过控制驱动马达的操作来调节，以在工件上形成基本上Z形的喷雾图案，其中Z形图案的尺寸为 输送机速度喷头组件的功能，每个喷头组件的驱动速度和运动范围。 可以通过接收关于工件尺寸，涂层厚度等的输入信息的微处理器计算机系统来进行控制，以便自动控制输送机马达和喷雾组件马达，从而进一步简化了设置变化的速度和容易程度以及显着降低 废弃涂料等。 为每个喷雾组件提供排气系统以去除和处理未使用的喷雾，烟雾等。 提供防护罩以屏蔽工件的边缘边缘和边缘输送机，防止过度喷涂，并将累积的过度喷涂转移到收集器。

公开(公告)号：US5387444A

公开(公告)日：1995-02-07

申请号：US842459

申请日：1992-02-27

申请人： Andrew G. Bachmann

发明人： Andrew G. Bachmann

IPC分类号： B05B17/06 ,  B05D1/02 ,  B05D1/34 ,  H01L21/00 ,  H05K3/00 ,  H05K3/28 ,  H05K13/00 ,  B05D1/40

CPC分类号： H01L21/6715 ,  B05B17/0623 ,  B05D1/34 ,  H05K13/0469 ,  H05K3/0091 ,  B05D1/02 ,  H05K2203/0285 ,  H05K2203/1366 ,  H05K3/284

摘要： A system and method for effecting the continuous, in-line coating of workpieces, freely supported upon a conveyor, utilizes an ultrasonic spray unit for delivery of a photo-polymerizable coating material. The deposited liquid is immediately irradiated to initiate curing, and the system and method are particularly well adapted for the formation of conformal coatings on printed circuit boards, utilizing two-part coating compositions.

摘要翻译： 用于实现自由地支撑在输送机上的工件的连续的在线涂覆的系统和方法利用超声波喷射单元来输送可光聚合涂层材料。 立即照射沉积的液体以引发固化，并且该系统和方法特别适用于利用两部分涂料组合物在印刷电路板上形成保形涂层。

公开(公告)号：US5308658A

公开(公告)日：1994-05-03

申请号：US13058

申请日：1993-02-03

申请人： Gilbert V. Morris

发明人： Gilbert V. Morris

IPC分类号： B05B7/02 ,  B05B7/08 ,  B05B13/02 ,  B05B15/04 ,  B05B15/12 ,  B05D1/02 ,  H05K3/00 ,  B05B7/06

CPC分类号： H05K3/0091 ,  B05B13/0207 ,  B05B13/0221 ,  B05B15/04 ,  B05B7/0884 ,  B05D1/02 ,  H05K2203/1366 ,  H05K2203/1518 ,  H05K2203/1572

摘要： Improved non-electrostatic spray coating process and apparatus are provided. The process and apparatus of the present invention permit significant reduction in over-spray conditions as well as, the disadvantages and drawbacks associated therewith, without causing corresponding reduction in coating efficiency.

摘要翻译： 提供了改进的非静电喷涂工艺和设备。 本发明的方法和装置允许显着降低过喷射条件以及与其相关的缺点和缺点，而不会引起涂层效率的相应降低。

公开(公告)号：US5288027A

公开(公告)日：1994-02-22

申请号：US915113

申请日：1992-07-17

申请人： Glen Herstek ,  William E. Donges ,  James J. Turner ,  Ronald Bernt

发明人： Glen Herstek ,  William E. Donges ,  James J. Turner ,  Ronald Bernt

IPC分类号： B05C5/00 ,  B05B1/04 ,  B05B15/06 ,  H05K3/00 ,  H05K3/28

CPC分类号： B05B1/042 ,  B05B15/066 ,  H05K3/0091 ,  H05K2203/1366 ,  H05K2203/1509 ,  H05K3/284

摘要： A dispensing apparatus including an airless ribbon nozzle having a nozzle tip formed with a nozzle bore tapering radially inwardly from an inlet end to a semispherical-shaped discharge end which intersects a rectangular-shaped discharge slot. The nozzle is mounted in position on a coating dispenser such that the inlet of the nozzle tip communicates with a coating passageway within the dispenser to receive coating material which is emitted from the discharge slot of the nozzle tip in a wide, splash-free, leaf-shaped pattern.

摘要翻译： 一种分配装置，包括一个无空气色带喷嘴，该喷嘴尖端形成有从入口端向半球状排放端径向向内逐渐变细的喷嘴孔，该喷嘴孔与矩形排放槽相交。 喷嘴安装在涂布分配器上的适当位置，使得喷嘴头的入口与分配器内的涂覆通道连通，以接收从喷嘴尖端的排放槽排出的广泛，无飞溅的叶片 形图案。

公开(公告)号：US5240746A

公开(公告)日：1993-08-31

申请号：US811873

申请日：1991-12-19

申请人： Mary O'Connell Litteral

发明人： Mary O'Connell Litteral

IPC分类号： B05B13/02 ,  B05B5/00 ,  B05C9/12 ,  B05C13/02 ,  B23Q41/04 ,  C23F1/00 ,  C23F1/08 ,  G05B19/418 ,  H05K3/00 ,  H05K3/28 ,  H05K13/00

CPC分类号： H05K3/0091 ,  H05K13/0061 ,  H05K13/0469 ,  H05K3/00 ,  H05K2201/09872 ,  H05K2203/0165 ,  H05K2203/1366 ,  H05K2203/1509 ,  Y10T29/49126 ,  Y10T29/49829 ,  Y10T29/53404

摘要： Related operations are performed on workpieces, e.g., coating and curing circuit boards, of different types in random order in assembly line fashion on a rotary table of an apparatus under programmed control. The table is rotated stepwise to move successive sections thereof from a load-unload station at which the respective workpieces are loaded and unloaded in random order, to a sensing station at which the type and orientation of the workpiece is sensed, next to an initial work station at which initial work, e.g., coating, is performed on the workpiece in dependence upon its type and orientation previously sensed at the sensing station, then to a subsequent work station at which related subsequent work is performed on the workpiece, e.g., curing of the coating, and in turn back to the load-unload station to complete a cycle. The workpiece is either changed in orientation on the table section for a repeat cycle to perform further work thereon or is replaced by another workpiece in random order.

公开(公告)号：US4880663A

公开(公告)日：1989-11-14

申请号：US206199

申请日：1988-06-13

申请人： Takaji Shimada

发明人： Takaji Shimada

IPC分类号： H05K3/28 ,  B05B1/04 ,  B05B13/04 ,  B05D1/02 ,  B05D1/32 ,  H05K3/00

CPC分类号： H05K3/0091 ,  B05B1/04 ,  B05B13/04 ,  B05D1/26 ,  B05D1/30 ,  H05K2201/0989 ,  H05K2203/1366 ,  H05K2203/1509 ,  H05K3/284

摘要： A method of applying coating material to only selected areas of a packaged printed circuit board wherein the coating material is supplied to a flat-pattern nozzle at a pressure sufficient to produce a liquid film emission in a flat triangular or dovetail shaped pattern which portion of the nozzle emission is substantially free of atomized particles. The circuit board is positioned relative the nozzle to place the board in the path of the film pattern and relative movement between the nozzle and board is effect in conjunction with controlling the supply of coating to the nozzle to coat only desired regions of the board while avoiding deposit of coating material on areas to be left uncoated.

公开(公告)号：US3634168A

公开(公告)日：1972-01-11

申请号：US3634168D

申请日：1970-04-03

申请人： PHILIPS CORP

发明人： JANSSEN CASPER JOHANNES GERARD ,  JONKER HENDRIK ,  THIJSSENS THEODORUS PETRUS GER

IPC分类号： H05K3/06 ,  G11C11/06 ,  G11C11/08 ,  H01F41/04 ,  H01H11/04 ,  H05K1/05 ,  H05K3/00 ,  H05K3/18 ,  H05K3/38 ,  H05K3/42 ,  H05K3/44 ,  H05K13/00

CPC分类号： H05K3/445 ,  G11C11/06085 ,  H05K1/056 ,  H05K3/0023 ,  H05K3/181 ,  H05K3/387 ,  H05K3/426 ,  H05K2201/0195 ,  H05K2203/1366

摘要： A method of applying a printed circuit to a coherent memory plate by coating the plate with photoresist, hardening the photoresist, applying adhesive, which may be hardened at less than 130* C., to the photoresist and providing a printed metallic circuit on the hardened adhesive.

摘要翻译： 通过用光致抗蚀剂涂覆板将硬化光致抗蚀剂施加印刷电路的方法，将可在低于130℃硬化的粘合剂施加到光致抗蚀剂上并在硬化后提供印刷的金属电路 胶粘剂。