公开(公告)号：US5506049C1

公开(公告)日：2001-05-29

申请号：US17719893

申请日：1993-12-30

Applicant: WORLD PROPERTIES INC

Inventor： SWEI GWO S ,  ARTHUR DAVID J

IPC: B29C41/28 ,  B29D7/01 ,  C08J3/00 ,  C08J3/215 ,  C08J9/26 ,  H05K1/03 ,  H05K1/05 ,  H05K3/38 ,  B32B5/16

CPC classification number: C08J9/26 ,  B29C41/28 ,  B29D7/01 ,  B29K2027/18 ,  B29K2105/04 ,  B29K2105/16 ,  C08J3/005 ,  C08J3/215 ,  C08J2327/12 ,  H05K1/034 ,  H05K1/0373 ,  H05K1/056 ,  H05K3/386 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0215 ,  H05K2201/0239 ,  Y02P20/582 ,  Y10S428/901 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/264

公开(公告)号：US6166333A

公开(公告)日：2000-12-26

申请号：US6805

申请日：1998-01-14

Applicant: William R. Crumly ,  Haim Feigenbaum

Inventor： William R. Crumly ,  Haim Feigenbaum

IPC: H01L21/48 ,  H01L21/60 ,  H01L23/13 ,  H01L23/14 ,  H01L23/15 ,  H01L23/498 ,  H05K3/00 ,  H05K3/20 ,  H05K3/40 ,  H05K1/03

CPC classification number: H01L24/81 ,  H01L21/4846 ,  H01L23/13 ,  H01L23/145 ,  H01L23/15 ,  H01L23/49811 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05572 ,  H01L2224/16225 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K3/205 ,  H05K3/4007 ,  H05K3/4691 ,  H05K2201/0133 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0187 ,  H05K2201/0367 ,  H05K2201/068 ,  H05K2203/0113 ,  Y10T29/49144 ,  Y10T29/49155 ,  H01L2224/05005 ,  H01L2224/05541 ,  H01L2224/05599 ,  H01L2224/05099

Abstract: The present invention includes composite support substrate for both flexible and rigid board circuit applications and method of making the same. The composite substrate is composed of at least two materials formed under the circuitry. A first material is a conventional matrix such as a polyimide/acrylic adhesive, and a second material having unique properties that are useful locally in isolated locations. For instance, the second material may be nonporous to moisture, optically clear, and/or thermally conductive. The second material is integrated into the circuit matrix at specific localized areas where desired with portions coplanar with the first material so that circuit traces remain continuous as they pass from the first material to the second. For example, an integrated circuit chip may be isolated from the polyimide matrix, which is porous in moisture, by using the second material that is nonporous to moisture at locations where the integrated circuit chip is to be attached, thus isolating the integrated circuit chip from the polyimide and preventing moisture from flowing through to the chip.

Abstract translation: 本发明包括用于柔性和刚性电路板电路应用的复合支撑基板及其制造方法。 复合衬底由在电路下形成的至少两种材料组成。 第一种材料是常规的基质，例如聚酰亚胺/丙烯酸粘合剂，以及具有独特性质的第二种材料，其在局部在隔离的位置是有用的。 例如，第二种材料可以是无孔的，透湿的和/或导热的。 第二材料在特定的局部区域集成到电路矩阵中，其中期望的是与第一材料共面的部分，使得电路迹线在从第一材料通过到第二材料时保持连续。 例如，集成电路芯片可以与聚酰亚胺基体隔离，该聚酰亚胺基体在湿气中是多孔的，通过使用在要连接集成电路芯片的位置处无孔的第二种材料，从而将集成电路芯片与 聚酰亚胺并防止水分流入芯片。

公开(公告)号：US6130015A

公开(公告)日：2000-10-10

申请号：US496676

申请日：2000-02-03

Applicant: David B. Noddin ,  Donald G. Hutchins

Inventor： David B. Noddin ,  Donald G. Hutchins

IPC: B23K26/00 ,  B23K26/38 ,  B23K101/38 ,  H01L21/48 ,  H01L21/768 ,  H01L23/12 ,  H01L23/538 ,  H01L23/544 ,  H05K1/02 ,  H05K1/16 ,  H05K3/00 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46 ,  G03F9/00

CPC classification number: H05K3/4679 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/544 ,  H05K1/0269 ,  H05K3/0026 ,  H01L2223/54473 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K1/0268 ,  H05K1/167 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/09918 ,  H05K3/0008 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/429 ,  H05K3/445 ,  H05K3/4641 ,  H05K3/4652 ,  Y10S430/146

Abstract: A method of making a laminated substrate by forming a registration mark on a core layer of the substrate. Then, forming a first layer on the core layer using the registration mark as a fiducial registration point. The first layer is laser drilled through to expose the registration mark on the core layer. A second layer is then formed on the first layer using the registration mark as a fiducial point.

Abstract translation: 一种通过在基板的芯层上形成配准标记来制造层叠基板的方法。 然后，使用对准标记作为基准登记点在芯层上形成第一层。 第一层被激光穿过以暴露核心层上的对准标记。 然后使用对准标记作为基准点在第一层上形成第二层。

公开(公告)号：US6121171A

公开(公告)日：2000-09-19

申请号：US56864

申请日：1998-04-08

Applicant: Tsutomu Takahashi ,  Hiroaki Kumada

Inventor： Tsutomu Takahashi ,  Hiroaki Kumada

IPC: C08J5/04 ,  C08J5/18 ,  C08L77/10 ,  H05K1/02 ,  H05K1/03 ,  B32B27/34

CPC classification number: C08J5/18 ,  C08J5/04 ,  C08L77/10 ,  H05K1/0366 ,  C08J2377/10 ,  H05K1/024 ,  H05K2201/0129 ,  H05K2201/015 ,  H05K2201/0166 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10T428/249958 ,  Y10T442/3854 ,  Y10T442/3878 ,  Y10T442/3894

Abstract: Provided is a composite film comprising a continuous phase of para-oriented aromatic polyamide and a phase of low-dielectric resin, said film having a dielectric constant at 1 MHz of not more than 3.2 and a linear thermal expansion coefficient at 200 to 300.degree. C. of within .+-.50.times.10.sup.-6 /.degree.C. The composite film has characteristics such as a low dielectric constant, favorable mechanical strength, homogeneous structure, light weight, and a low linear thermal expansion coefficient, and the film is useful as a base substrate for a flexible printed circuit board.

Abstract translation: 提供了包含对位芳族聚酰胺的连续相和低介电常数树脂相的复合膜，所述膜的介电常数在1MHz不大于3.2，线性热膨胀系数在200至300℃ 在+/- 50×10 -6 /℃以内。复合膜具有低介电常数，良好的机械强度，均匀的结构，重量轻和线性热膨胀系数低的特性，并且该膜可用作 用于柔性印刷电路板的基底。

公开(公告)号：US6114005A

公开(公告)日：2000-09-05

申请号：US859659

申请日：1997-05-20

Applicant: Akira Nagai ,  Masatsugu Ogata ,  Shuji Eguchi ,  Masahiko Ogino ,  Toshiaki Ishii ,  Masanori Segawa ,  Hiroyoshi Kokaku ,  Ryo Moteki ,  Ichiro Anjoh

Inventor： Akira Nagai ,  Masatsugu Ogata ,  Shuji Eguchi ,  Masahiko Ogino ,  Toshiaki Ishii ,  Masanori Segawa ,  Hiroyoshi Kokaku ,  Ryo Moteki ,  Ichiro Anjoh

IPC: B32B27/12 ,  H01L23/14 ,  H05K1/03 ,  B32B5/12

CPC classification number: B32B27/12 ,  H01L23/145 ,  H05K1/0373 ,  H01L2224/48227 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/029 ,  H05K2201/068 ,  Y10S428/901 ,  Y10T428/24132 ,  Y10T428/254

Abstract: A laminate capable of mounting semiconductor elements thereon; comprising an insulating layer which is constituted by a resin portion of sea-island structure and a woven reinforcement. The resin portion of sea-island structure is, for example, such that a resin as islands are dispersed in a resin as a matrix. Thus, the insulating layer exhibits a coefficient of thermal expansion of 3.0.about.10 (ppm/K) in a planar direction thereof and a glass transition temperature of 150.about.300 (.degree.C.). Owing to these physical properties, thermal stresses which the laminate undergoes in packaging the semiconductor elements thereon can be reduced, so that the connections of the laminate with the semiconductor elements can be made highly reliable.

Abstract translation: 能够在其上安装半导体元件的层压体; 包括由海岛结构的树脂部分和织造加强件构成的绝缘层。 例如，海岛结构的树脂部分使得岛状树脂以树脂为基体分散。 因此，绝缘层在其平面方向上的热膨胀系数为3.0D（ppm / K），玻璃化转变温度为150℃（℃）。 由于这些物理性质，可以减少层压体在其上封装半导体元件时的热应力，使得层压体与半导体元件的连接可以高度可靠。

公开(公告)号：US5965273A

公开(公告)日：1999-10-12

申请号：US792333

申请日：1997-01-31

Applicant: Lakshaman M. Walpita ,  Michael R. Ahern

Inventor： Lakshaman M. Walpita ,  Michael R. Ahern

IPC: B32B15/08 ,  C08K3/00 ,  C08L45/00 ,  C08L81/02 ,  H01B3/00 ,  H01B3/30 ,  H01B3/44 ,  H05K1/02 ,  H05K1/03 ,  H05K1/16 ,  B32B3/00

CPC classification number: H05K1/0373 ,  B32B15/08 ,  H01B3/301 ,  H05K1/0228 ,  H05K1/024 ,  H05K1/162 ,  H05K2201/0129 ,  H05K2201/015 ,  H05K2201/0209 ,  Y10S428/901 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/256 ,  Y10T428/31678 ,  Y10T428/31692 ,  Y10T428/31855

Abstract: A polymeric composition which has a dielectric constant K' greater than 4 at 20.degree. C. which varies little with temperature is made from a polymer or mixture of polymers and a ceramic or a mixture of ceramics, where the polymer or mixture of polymers has a dielectric constant K' in the range of about 1.5 to about 3.5 and a temperature coefficient of dielectric constant TCK' that is negative and is between 0 and about -300 ppm/degree C.; and the ceramic includes a first ceramic, which may be one ceramic or a mixture of ceramics, each having a dielectric constant in the range of about 15 to about 200 and a TCK' that is positive and is between zero and about 3000 ppm/degree C.; and an optional second ceramic, which may be one ceramic or a mixture of ceramics, each having a dielectric constant in the range from about 3 up to about 15 and a TCK' that is positive and is between zero and about 300 ppm/degree C.

Abstract translation: 在20℃下介电常数K'大于4的聚合物组合物与温度变化很小的聚合物组合物由聚合物或陶瓷或陶瓷混合物的聚合物或混合物制成，其中聚合物或聚合物混合物具有 介电常数K'在约1.5至约3.5的范围内，介电常数TCK'的温度系数为负，介于0和约-300ppm /℃之间; 并且陶瓷包括第一陶瓷，其可以是一种陶瓷或陶瓷的混合物，每种陶瓷或陶瓷的混合物的介电常数在约15至约200的范围内，TCK'为正，为零至约3000ppm /度之间 C。; 和可选的第二陶瓷，其可以是一种陶瓷或陶瓷的混合物，每种陶瓷或陶瓷的混合物的介电常数在约3至约15的范围内，TCK'为正，为零至约300ppm /℃之间 。

公开(公告)号：US5958592A

公开(公告)日：1999-09-28

申请号：US6444

申请日：1998-01-13

Applicant: Arthur W. Snow ,  Leonard J. Buckley

Inventor： Arthur W. Snow ,  Leonard J. Buckley

IPC: C08G73/06 ,  H05K1/03 ,  B32B9/00

CPC classification number: C08G73/065 ,  C08G73/0644 ,  C08G73/0655 ,  H05K1/0366 ,  H05K1/0346 ,  H05K1/0373 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0278 ,  Y10S428/924 ,  Y10T428/24926 ,  Y10T428/31504 ,  Y10T428/31525

Abstract: The present invention is a cyanate resin monomer having the formula:NCO--CH.sub.2 --(CF.sub.2).sub.n --CH.sub.2 --OCNwhere n is an even integer from 6 to 10, inclusive.Another aspect of the invention is an essentially pure cyanate resin mono having the formula:NCO--CH.sub.2 --(CF.sub.2).sub.n --CH.sub.2 --OCNwhere n=3, 4, 6, 8, or 10. Another aspect of the invention is a prepolymer made by the process of heating a monomer of the invention to a conversion below the gel point. Another aspect of the invention is a method for depositing an interlevel dielectric resin on an integrated circuit, having the steps: (a) coating the integrated circuit with a thin film of a prepolymer made by the process of heating a monomer of the invention to below the gel point, and (b) curing the prepolymer to at least the gel point. Another aspect of the invention is a low dielectric thermoset polymer resin made from these monomers. Another aspect of the invention is a composite of a resin of the invention combined with another material or materials, for structural and/or electronic applications. Such materials include powders and fibers made from, e.g., fused silica or quartz. Another aspect of the invention is making and purifying the monomers of the invention.

Abstract translation: 本发明是具有下式的氰酸酯树脂单体：NCO-CH2-（CF2）n-CH2-OCN，其中n为6-10的均匀整数，包括端值。 本发明的另一方面是具有下式的基本上纯的氰酸酯树脂单体：NCO-CH2-（CF2）n-CH2-OCN，其中n = 3,4,6,8或10.本发明的另一方面是预聚物 通过将本发明的单体加热到低于凝胶点的转化率的方法制备。 本发明的另一方面是一种用于在集成电路上沉积层间电介质树脂的方法，具有以下步骤：（a）用通过将本发明的单体加热到下面的方法制备的预聚物的薄膜涂覆集成电路 凝胶点，和（b）将预聚物固化至少至凝胶点。 本发明的另一方面是由这些单体制成的低介电性热固性聚合物树脂。 本发明的另一方面是本发明的树脂与用于结构和/或电子应用的另一材料或材料的组合。 这些材料包括由例如熔融二氧化硅或石英制成的粉末和纤维。 本发明的另一方面是制备和纯化本发明的单体。

公开(公告)号：US5870274A

公开(公告)日：1999-02-09

申请号：US880661

申请日：1997-06-23

Applicant: Gregory L. Lucas

Inventor： Gregory L. Lucas

IPC: H05K1/03 ,  H05K1/16 ,  H05K3/38 ,  H05K3/46 ,  H01G4/06 ,  B32B9/00 ,  H01G4/20

CPC classification number: H05K3/4641 ,  H05K1/0373 ,  H05K1/162 ,  H05K1/0366 ,  H05K2201/015 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/0257 ,  H05K2201/0355 ,  H05K2201/09309 ,  H05K3/385 ,  H05K3/386 ,  H05K3/4611 ,  Y10T29/435 ,  Y10T29/49126 ,  Y10T29/49144

Abstract: An in situ method for forming a bypass capacitor element internally within a PCB including the steps of arranging one or more uncured dielectric sheets with conductive foils on opposite sides thereof and laminating the conductive foils to the dielectric sheet simultaneously as the PCB is formed by a final lamination step, the conductive foils preferably being laminated to another layer of the PCB prior to their arrangement adjacent the dielectric sheet or sheets, the dielectric foils even more preferably being initially laminated to additional dielectric sheets in order to form multiple bypass capacitive elements as a compound subassembly within the PCB. A number of different dielectric materials and resins are disclosed for forming the capacitor element. A dielectric component in the capacitor element preferably includes dielectric material and thermally responsive material, the thermally responsive material either forming a carrier for the dielectric material or formed as two separate sheets on opposite sides of a sheet of the dielectric material.

Abstract translation: 一种用于在PCB内部形成旁路电容器元件的原位方法，包括以下步骤：在导电箔的相对侧上布置一个或多个未固化的电介质片，同时将导电箔层压到电介质片上， 层压步骤，导电箔优选地在邻近电介质片或片之前层压到PCB的另一层上，电介质箔甚至更优选最初层压到附加的电介质片上，以形成多个旁路电容元件作为化合物 PCB内的子组件。 公开了用于形成电容器元件的许多不同介电材料和树脂。 电容器元件中的电介质元件优选地包括电介质材料和热响应材料，该热响应材料形成用于电介质材料的载体或者在电介质材料片的相对侧上形成为两个分开的片。

公开(公告)号：US5833759A

公开(公告)日：1998-11-10

申请号：US747170

申请日：1996-11-08

Applicant: Randy E. Haslow ,  Donald G. Hutchins ,  Michael R. Leaf

Inventor： Randy E. Haslow ,  Donald G. Hutchins ,  Michael R. Leaf

IPC: H01L21/28 ,  H01L21/48 ,  H01L21/768 ,  H01L23/12 ,  H05K3/00 ,  H05K3/26 ,  H05K3/46 ,  B08B3/12 ,  B44C1/22 ,  H01B13/00

CPC classification number: H01L21/486 ,  H05K3/0032 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K3/0035 ,  H05K3/0055 ,  H05K3/4652

Abstract: The invention relates to a method for cleaning vias in electronic component substrates prior to metallization thereof.

Abstract translation: 本发明涉及一种在金属化之前清洁电子部件基板中的通孔的方法。

公开(公告)号：US5814180A

公开(公告)日：1998-09-29

申请号：US689448

申请日：1996-08-09

Applicant: David Robert King

Inventor： David Robert King

IPC: C09J9/02 ,  H01L21/60 ,  H01L23/482 ,  H05K3/32 ,  C09J5/08

CPC classification number: H01L24/83 ,  C09J9/02 ,  H01L23/4828 ,  H01L24/29 ,  H05K3/323 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0781 ,  H05K1/0215 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/0278 ,  H05K2201/10378 ,  H05K2203/0278 ,  H05K3/321 ,  Y10T428/249982 ,  Y10T428/249983 ,  Y10T428/249984 ,  Y10T428/249985 ,  Y10T428/28 ,  Y10T428/2804 ,  Y10T428/2848

Abstract: A method for low temperature attachment of components is provided which uses an electrically conductive adhesive. The electrically conductive adhesive may be defined by a substrate having numerous passageways through the substrate. The passageways are defined by a plurality of walls of the material making up the substrate. The walls are covered with a layer of conductive metal. The passageways at the outer surfaces are filled with a non-conductive pressure sensitive adhesive resin.

Abstract translation: 提供了一种使用导电粘合剂的部件的低温附着方法。 导电粘合剂可以由具有穿过基底的多个通道的基底限定。 通道由构成基底的材料的多个壁限定。 墙壁上覆盖着一层导电金属。 外表面的通道填充有非导电压敏粘合剂树脂。