公开(公告)号：US07530819B2

公开(公告)日：2009-05-12

申请号：US11976769

申请日：2007-10-26

申请人： Masahiko Asano ,  Yasuo Akutsu ,  Shuji Eguchi ,  Kunito Nakatsuru ,  Kaoru Uchiyama

发明人： Masahiko Asano ,  Yasuo Akutsu ,  Shuji Eguchi ,  Kunito Nakatsuru ,  Kaoru Uchiyama

IPC分类号： H01R12/00

CPC分类号： H05K5/0069 ,  H01L23/49811 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/165 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01R12/725 ,  Y10S439/949 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A device for controlling a vehicle 8 comprising a housing 3, a rectangular printed circuit board 4 which is fixed to the inside of the housing and has a control circuit thereon, and plugs 1a and 1b provided along one side of the rectangular printed circuit board 4 to transfer signals between the inside and the outside of said housing 3; wherein the plugs 1a and 1b respectively contain plug pins and the plug pins 2 are electrically connected to the printed circuit board 4 via bonding wires 5 inside the housing 3.

摘要翻译： 一种用于控制车辆8的装置，包括壳体3，固定到壳体内部并且具有控制电路的矩形印刷电路板4，以及沿着矩形印刷电路板4的一侧设置的插头1a和1b 以在所述壳体3的内部和外部之间传送信号; 其中插头1a和1b分别包含插头销，并且插头销2通过外壳3内部的接合线5电连接到印刷电路板4。

公开(公告)号：US20080165511A1

公开(公告)日：2008-07-10

申请号：US12039472

申请日：2008-02-28

申请人： Takuya Mayuzumi ,  Shuji Eguchi ,  Masahiro Sasaki ,  Kiyoomi Kadoya

发明人： Takuya Mayuzumi ,  Shuji Eguchi ,  Masahiro Sasaki ,  Kiyoomi Kadoya

IPC分类号： H05K7/04 ,  H05K3/30

CPC分类号： H05K3/284 ,  B29C45/14639 ,  H05K1/0215 ,  H05K3/0061 ,  H05K3/321 ,  H05K3/3447 ,  H05K5/0034 ,  H05K5/0082 ,  H05K7/20854 ,  H05K2201/09054 ,  H05K2201/10189 ,  H05K2201/2036 ,  Y10T29/49146

摘要： A module comprises a metallic terminal pins for connection and a circuit board with electronic components mounted thereon, a circuit board connecting side of the connector. The electronic components and the circuit board with the electronic components mounted thereon are encapsulated with the same resin. A metallic base is united to the module to obtain an electric conduction between the metallic base and the circuit board.

摘要翻译： 模块包括用于连接的金属端子销和安装有电子部件的电路板，连接器的电路板连接侧。 电子部件和安装有电子部件的电路板用相同的树脂封装。 将金属基体与模块结合，以在金属基座和电路板之间获得电导通。

公开(公告)号：US07303406B2

公开(公告)日：2007-12-04

申请号：US11375057

申请日：2006-03-15

申请人： Masahiko Asano ,  Yasuo Akutsu ,  Shuji Eguchi ,  Kunito Nakatsuru ,  Kaoru Uchiyama

发明人： Masahiko Asano ,  Yasuo Akutsu ,  Shuji Eguchi ,  Kunito Nakatsuru ,  Kaoru Uchiyama

IPC分类号： H01R12/00

CPC分类号： H05K5/0069 ,  H01L23/49811 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/165 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01R12/725 ,  Y10S439/949 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A device for controlling a vehicle 8 has a housing, a rectangular printed circuit board inside of the housing and a control circuit thereon. Plugs are provided along one side of the rectangular printed circuit board to transfer signals between the inside and the outside of the housing. The plugs have plug pins that are electrically connected to the printed circuit board within the housing.

摘要翻译： 用于控制车辆8的装置具有壳体，壳体内部的矩形印刷电路板和其上的控制电路。 插头沿着矩形印刷电路板的一侧设置以在壳体的内部和外部之间传送信号。 插头具有电连接到壳体内的印刷电路板的插头销。

公开(公告)号：US07202570B2

公开(公告)日：2007-04-10

申请号：US10724092

申请日：2003-12-01

申请人： Akira Nagai ,  Shuji Eguchi ,  Masahiko Ogino ,  Masanori Segawa ,  Toshiak Ishii ,  Nobutake Tsuyuno ,  Hiroyoshi Kokaku ,  Rie Hattori ,  Makoto Morishima ,  Ichiro Anjoh ,  Kunihiro Tsubosaki ,  Chuichi Miyazaki ,  Makoto Kitano ,  Mamoru Mita ,  Norio Okabe

发明人： Akira Nagai ,  Shuji Eguchi ,  Masahiko Ogino ,  Masanori Segawa ,  Toshiak Ishii ,  Nobutake Tsuyuno ,  Hiroyoshi Kokaku ,  Rie Hattori ,  Makoto Morishima ,  Ichiro Anjoh ,  Kunihiro Tsubosaki ,  Chuichi Miyazaki ,  Makoto Kitano ,  Mamoru Mita ,  Norio Okabe

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L21/44 ,  H01L21/48 ,  B32B3/06 ,  B32B7/12

CPC分类号： H01L24/06 ,  H01L23/3107 ,  H01L23/4951 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/06136 ,  H01L2224/48 ,  H01L2224/48091 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/30107 ,  H01L2924/351 ,  Y10T156/107 ,  Y10T428/249955 ,  Y10T428/28 ,  Y10T428/2848 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor device having a superior connection reliability is obtained by providing a buffer body for absorbing the difference of thermal expansion between the mounting substrate and the semiconductor element in a semiconductor package structure, even if an organic material is used for the mounting substrate. A film material is used as the body for buffering the thermal stress generated by the difference in thermal expansion between the mounting substrate and the semiconductor element. The film material has modulus of elasticity of at least 1 MPa in the reflow temperature range (200–250° C.).

摘要翻译： 具有优异的连接可靠性的半导体器件通过在半导体封装结构中设置用于吸收安装基板和半导体元件之间的热膨胀差的缓冲体，即使将有机材料用于安装基板也是可以获得的。 使用薄膜材料作为用于缓冲由安装基板和半导体元件之间的热膨胀差异产生的热应力的本体。 膜材料在回流温度范围（200-250℃）中的弹性模量至少为1MPa。

公开(公告)号：US20050200019A1

公开(公告)日：2005-09-15

申请号：US11116209

申请日：2005-04-28

申请人： Chuichi Miyazaki ,  Yukiharu Akiyama ,  Masnori Shibamoto ,  Tomoaki Kudaishi ,  Ichiro Anjoh ,  Kunihiko Nishi ,  Asao Nishimura ,  Hideki Tanaka ,  Ryosuke Kimoto ,  Kunihiro Tsubosaki ,  Akio Hasebe ,  Takehiro Ohnishi ,  Noriou Shimada ,  Shuji Eguchi ,  Hiroshi Koyama ,  Akira Nagai ,  Masahiko Ogino

发明人： Chuichi Miyazaki ,  Yukiharu Akiyama ,  Masnori Shibamoto ,  Tomoaki Kudaishi ,  Ichiro Anjoh ,  Kunihiko Nishi ,  Asao Nishimura ,  Hideki Tanaka ,  Ryosuke Kimoto ,  Kunihiro Tsubosaki ,  Akio Hasebe ,  Takehiro Ohnishi ,  Noriou Shimada ,  Shuji Eguchi ,  Hiroshi Koyama ,  Akira Nagai ,  Masahiko Ogino

IPC分类号： H01L23/31 ,  H01L23/495 ,  H01L23/498 ,  H01L23/48 ,  H01L21/44

CPC分类号： H01L24/50 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49572 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06136 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/50 ,  H01L2224/85951 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599

摘要： A semiconductor device includes a semiconductor chip formed with connection terminals, an elastic structure interposed between a main surface of the chip and a wiring substrate formed with wirings connected at first ends thereof to the connection terminals, and bump electrodes connected to the other ends of the wirings. The connection terminals may be at a center part or in peripheral part(s) of the chip main surface and both the elastic structure and wiring substrate are not provided at locations of connection terminals. A resin body seals at least the connection terminals and the exposed first ends of wirings (leads). In a scheme in which the connection terminals are located in a peripheral part of the chip main surface, the wiring substrate protrudes beyond the chip boundary where the connection terminals are arranged, and the resin body shape is restricted by the protruding part of the wiring substrate.

摘要翻译： 半导体器件包括形成有连接端子的半导体芯片，插入在芯片的主表面之间的弹性结构和形成有连接到连接端子的布线的布线基板，以及连接到连接端子的另一端的凸起电极 布线。 连接端子可以在芯片主表面的中心部分或周边部分，并且弹性结构和布线基板都不设置在连接端子的位置处。 树脂体至少密封连接端子和暴露的布线的第一端（引线）。 在连接端子位于芯片主表面的周边部分的方案中，布线基板突出超过布置有连接端子的芯片边界，并且树脂体形状被布线基板的突出部分限制 。

公开(公告)号：US06888230B1

公开(公告)日：2005-05-03

申请号：US09429297

申请日：1999-10-28

申请人： Masahiko Ogino ,  Takumi Ueno ,  Shuji Eguchi ,  Akira Nagai ,  Toshiya Satoh ,  Toshiaki Ishii ,  Hiroyoshi Kokaku ,  Tadanori Segawa ,  Nobutake Tsuyuno ,  Asao Nishimura ,  Ichiro Anjoh

发明人： Masahiko Ogino ,  Takumi Ueno ,  Shuji Eguchi ,  Akira Nagai ,  Toshiya Satoh ,  Toshiaki Ishii ,  Hiroyoshi Kokaku ,  Tadanori Segawa ,  Nobutake Tsuyuno ,  Asao Nishimura ,  Ichiro Anjoh

IPC分类号： H01L23/12 ,  H01L21/301 ,  H01L21/46 ,  H01L21/48 ,  H01L21/50 ,  H01L21/60 ,  H01L23/28 ,  H01L23/31 ,  H01L23/50 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/3171 ,  H01L23/3114 ,  H01L23/3164 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05026 ,  H01L2224/05569 ,  H01L2224/05571 ,  H01L2224/1147 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2924/00012

摘要： Semiconductor devices, semiconductor wafers, and semiconductor modules are provided, wherein: the semiconductor device has a small warp; damage at the chip edge and cracks occurring in a dropping test are scarcely generated; and the semiconductor device is superior in mounting reliability and mass producibility. The semiconductor includes a semiconductor chip 64; a porous stress relaxing layer 3 provided on the plane, whereon circuits and electrodes are formed, of the semiconductor chip; a circuit layer 2 provided on the stress relaxing layer and connected to the electrodes; and external terminals 10 provided on the circuit layer; wherein an organic protecting film 7 is formed on the plane, opposite to the stress relaxing layer, of the semiconductor chip, and respective side planes of the stress relaxing layer, the semiconductor chip 6, and the protecting film 7 are exposed outside on the same plane.

摘要翻译： 提供半导体器件，半导体晶片和半导体模块，其中：半导体器件具有小的翘曲; 几乎不产生芯片边缘的损伤和在滴下试验中发生的裂纹; 半导体装置的安装可靠性和大规模生产性优异。 该半导体包括半导体芯片64; 设置在半导体芯片的形成有电路和电极的平面上的多孔应力缓和层3; 设置在应力缓和层上并与电极连接的电路层2; 和设置在电路层上的外部端子10; 其中在半导体芯片的与应力缓和层相反的平面上形成有机保护膜7，并且应力缓和层，半导体芯片6和保护膜7的各个侧面在外部暴露在外部 飞机

公开(公告)号：US06371664B1

公开(公告)日：2002-04-16

申请号：US09864317

申请日：2001-05-25

申请人： Shoichi Takahashi ,  Hiroshi Naka ,  Toshimasa Miura ,  Shuji Eguchi

发明人： Shoichi Takahashi ,  Hiroshi Naka ,  Toshimasa Miura ,  Shuji Eguchi

IPC分类号： G02B636

摘要： There is provided a method for manufacturing a photoelectronic device comprising a silicon platform (support substrate) having a groove for guiding an optical fiber, a semiconductor laser chip secured on the substrate and an optical fiber fitted in the groove at one end thereof to be secured on the support substrate wherein the optical fiber fitted in the groove is secured on the support substrate with a first bonding element constituted by an adhesive injected to fill the groove under the optical fiber; one surface of the support substrate is covered with silicone gel; the support substrate is secured in a package made of plastic; and the package is filled with the silicone gel which is a protective film transparent to light transmitted by the optical fiber and resistant to humidity.

公开(公告)号：US06282350B1

公开(公告)日：2001-08-28

申请号：US09379468

申请日：1999-08-24

申请人： Shoichi Takahashi ,  Hiroshi Naka ,  Toshimasa Miura ,  Shuji Eguchi

发明人： Shoichi Takahashi ,  Hiroshi Naka ,  Toshimasa Miura ,  Shuji Eguchi

IPC分类号： G02B636

CPC分类号： G02B6/4239 ,  G02B6/4202 ,  G02B6/423 ,  G02B6/4243 ,  G02B6/4253 ,  G02B6/4257 ,  G02B6/4265 ,  G02B6/4273 ,  G02B6/4286 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2924/00012

摘要： There is provided a method for manufacturing a photoelectronic device comprising a silicon platform (support substrate) having a groove for guiding an optical fiber, a semiconductor laser chip secured on the substrate and an optical fiber fitted in the groove at one end thereof to be secured on the support substrate wherein the optical fiber fitted in the groove is secured on the support substrate with a first bonding element constituted by an adhesive injected to fill the groove under the optical fiber; one surface of the support substrate is covered with silicone gel; the support substrate is secured in a package made of plastic; and the package is filled with the silicone gel which is a protective film transparent to light transmitted by the optical fiber and resistant to humidity.

摘要翻译： 提供了一种制造光电器件的方法，该光电子器件包括具有用于引导光纤的沟槽的硅平台（支撑衬底），固定在衬底上的半导体激光器芯片和在其一端嵌入槽中的光纤以固定 在支撑基板上，其中安装在凹槽中的光纤被固定在支撑基板上，第一接合元件由注入的粘合剂构成，以填充光纤下方的凹槽; 支撑基板的一个表面被硅胶覆盖; 支撑基板被固定在由塑料制成的包装中; 并且该封装填充有硅凝胶，该硅凝胶是对由光纤传输的光透明并且耐潮湿的保护膜。

公开(公告)号：US6049128A

公开(公告)日：2000-04-11

申请号：US820631

申请日：1997-03-19

申请人： Makoto Kitano ,  Ryuji Kohno ,  Naotaka Tanaka ,  Akihiro Yaguchi ,  Tetsuo Kumazawa ,  Ichiro Anjoh ,  Hideki Tanaka ,  Asao Nishimura ,  Shuji Eguchi ,  Akira Nagai ,  Mamoru Mita

发明人： Makoto Kitano ,  Ryuji Kohno ,  Naotaka Tanaka ,  Akihiro Yaguchi ,  Tetsuo Kumazawa ,  Ichiro Anjoh ,  Hideki Tanaka ,  Asao Nishimura ,  Shuji Eguchi ,  Akira Nagai ,  Mamoru Mita

IPC分类号： H01L21/60 ,  H01L23/04 ,  H01L23/12 ,  H01L23/31 ,  H01L23/495 ,  H01L23/48 ,  H01L23/34 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/50 ,  H01L23/3114 ,  H01L23/49572 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01052 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/15787

摘要： A semiconductor device, is provided will semiconductor chips having a plurality of electrodes for external connection, elastomer resin portions formed of an elastomer resin, which are bonded to the semiconductor chip excepting at least some of the plurality of electrodes, a tape layer of resin including tape wiring patterns on the surface thereof, a plurality of solder bumps for bonding the printed wiring pattern to the tape wiring patterns, leads for connecting the plurality of electrodes of the semiconductor chips to the tape wiring patterns, and seal resin for covering the leads and the plurality of electrodes which are connected by the leads. The elastomer resin has a modulus of transverse elasticity not less than 50 MPa and not more than 750 MPa.

摘要翻译： 提供一种半导体器件，具有多个用于外部连接的电极的半导体芯片，除弹性体树脂形成的弹性体树脂部分，其除了多个电极中的至少一些外部结合到半导体芯片，包括树脂的带层，包括 表面上的带状布线图案，用于将印刷布线图案接合到带布线图案的多个焊料凸块，用于将半导体芯片的多个电极连接到带布线图案的引线，以及密封用于覆盖引线的树脂， 由引线连接的多个电极。 弹性体树脂的横向弹性模量不小于50MPa且不大于750MPa。

公开(公告)号：US5677045A

公开(公告)日：1997-10-14

申请号：US430553

申请日：1995-04-28

申请人： Akira Nagai ,  Masatsugu Ogata ,  Shuji Eguchi ,  Masahiko Ogino ,  Toshiaki Ishii ,  Masanori Segawa ,  Hiroyoshi Kokaku ,  Ryo Moteki ,  Ichiro Anjoh

发明人： Akira Nagai ,  Masatsugu Ogata ,  Shuji Eguchi ,  Masahiko Ogino ,  Toshiaki Ishii ,  Masanori Segawa ,  Hiroyoshi Kokaku ,  Ryo Moteki ,  Ichiro Anjoh

IPC分类号： B32B27/12 ,  H01L23/14 ,  H05K1/03 ,  B32B7/00 ,  B32B3/02 ,  B32B5/12 ,  B32B5/16

CPC分类号： B32B27/12 ,  H01L23/145 ,  H05K1/0373 ,  H01L2224/48227 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/029 ,  H05K2201/068 ,  Y10S428/901 ,  Y10T428/23986 ,  Y10T428/24132 ,  Y10T428/254 ,  Y10T442/20 ,  Y10T442/209 ,  Y10T442/2123 ,  Y10T442/3854 ,  Y10T442/3919

摘要： A laminate capable of mounting semiconductor elements thereon; comprising an insulating layer which is constituted by a resin portion of sea-island structure and a woven reinforcement. The resin portion of sea-island structure is, for example, such that a resin as islands are dispersed in a resin as a matrix. Thus, the insulating layer exhibits a coefficient of thermal expansion of 3.0.about.10 (ppm/K) in a planar direction thereof and a glass transition temperature of 150.about.300 (.degree.C.). Owing to these physical properties, thermal stresses which the laminate undergoes in packaging the semiconductor elements thereon can be reduced, so that the connections of the laminate with the semiconductor elements can be made highly reliable.

摘要翻译： 能够在其上安装半导体元件的层压体; 包括由海岛结构的树脂部分和织造加强件构成的绝缘层。 例如，海岛结构的树脂部分使得岛状树脂以树脂为基体分散。 因此，绝缘层在其平面方向上的热膨胀系数为3.0D（ppm / K），玻璃化转变温度为150℃（℃）。 由于这些物理性质，可以减少层压体在其上封装半导体元件时的热应力，使得层压体与半导体元件的连接可以高度可靠。