Manufacturing method for frame body and frame body
    1.
    发明授权
    Manufacturing method for frame body and frame body 有权
    框架体和框架体的制造方法

    公开(公告)号:US07290337B2

    公开(公告)日:2007-11-06

    申请号:US10520968

    申请日:2003-07-10

    IPC分类号: B21K21/06

    摘要: In this manufacturing method for a frame body, after ring rolling a metal material to form a ring-shaped member, a rectangular member is formed by pressing and deforming this ring-shaped member in the radial direction. At this time, an angle of corner portions that impart the rectangular shape to the rectangular member is formed smaller than an angle of the frame body that is to be obtained by die forging the rectangular member. According to the frame body obtained by this manufacturing method for a frame body, it is possible to increase the mechanical strength, and in particular, the creep strength. Furthermore, when forming the frame body, the occurrence of defects during manufacture may be restrained, it becomes possible to realize a reduction of the amount of waste metal material and the manufacturing time, and thereby this frame body may be formed inexpensively.

    摘要翻译: 在该框体的制造方法中,在环状轧制金属材料以形成环状构件之后,通过使该环形构件在径向上进行压制和变形来形成矩形构件。 此时,形成矩形构件的矩形形状的角部的角度小于通过锻造矩形构件而获得的框体的角度。 根据通过该框体的制造方法获得的框体,可以增加机械强度,特别是增加蠕变强度。 此外,当形成框体时,可以抑制制造时的缺陷的发生,可以实现废金属材料的量的减少和制造时间,从而可以廉价地形成框架体。

    Drill
    2.
    发明申请
    Drill 有权
    钻头

    公开(公告)号:US20060115339A1

    公开(公告)日:2006-06-01

    申请号:US11124095

    申请日:2005-05-09

    IPC分类号: B23B51/02

    摘要: To provide a drill which has a small diameter but deteriorates neither in rigidity like the type having two cut blades and two chip discharging grooves nor in cutting chip discharging property like the type having one cut blade and one cutting chip discharge groove, and which is extremely excellent in practical use while performing the enhancement in hole position precision by a simple improvement, there is provided a drill in which a chisel edge 6 is provided at a tip end portion, a spiral first chip discharging groove 1 and a spiral second chip discharging groove 2 are provided, a land portion 3, 4 is provided between the first chip discharging groove 1 and the second chip discharging groove 2, and a cut blade 5 is provided at an edge of a rake surface 7 of the first chip discharging groove 1, characterized in that the first chip discharging groove 1 and the second chip discharging groove 2 are provided asymmetrically with respect to a drill rotational center O and a land portion 3 behind the first chip discharging groove 1 is larger than a land portion 4 behind the second chip discharging groove 2.

    摘要翻译: 为了提供具有小直径的钻头,既不具有如具有两个切割刀片和两个切屑排出槽的类型的刚度也不像具有一个切割刀片和一个切屑排屑槽的类型那样具有切削屑排出性能的钻头,并且极端 通过简单的改进,在进行孔位精度的提高的同时,实用上是优异的,提供了一种钻头,其中在前端部设置有凿子边缘6,螺旋形的第一切屑排出槽1和螺旋形的第二切屑排出槽 如图2所示,在第一排屑槽1和第二排屑槽2之间设置有陆部区域3,4,并且在第一排屑槽1的前刀面7的边缘设置切割刀片5, 其特征在于,第一排屑槽1和第二排屑槽2相对于钻头旋转中心O和陆部3不对称地设置 第一排屑槽1的后方大于第二排屑槽2后面的陆部4。

    Photoelectronic device and method of manufacturing the same

    公开(公告)号:US06371664B1

    公开(公告)日:2002-04-16

    申请号:US09864317

    申请日:2001-05-25

    IPC分类号: G02B636

    摘要: There is provided a method for manufacturing a photoelectronic device comprising a silicon platform (support substrate) having a groove for guiding an optical fiber, a semiconductor laser chip secured on the substrate and an optical fiber fitted in the groove at one end thereof to be secured on the support substrate wherein the optical fiber fitted in the groove is secured on the support substrate with a first bonding element constituted by an adhesive injected to fill the groove under the optical fiber; one surface of the support substrate is covered with silicone gel; the support substrate is secured in a package made of plastic; and the package is filled with the silicone gel which is a protective film transparent to light transmitted by the optical fiber and resistant to humidity.

    Photoelectronic device and method of manufacturing the same
    4.
    发明授权
    Photoelectronic device and method of manufacturing the same 有权
    光电器件及其制造方法

    公开(公告)号:US06282350B1

    公开(公告)日:2001-08-28

    申请号:US09379468

    申请日:1999-08-24

    IPC分类号: G02B636

    摘要: There is provided a method for manufacturing a photoelectronic device comprising a silicon platform (support substrate) having a groove for guiding an optical fiber, a semiconductor laser chip secured on the substrate and an optical fiber fitted in the groove at one end thereof to be secured on the support substrate wherein the optical fiber fitted in the groove is secured on the support substrate with a first bonding element constituted by an adhesive injected to fill the groove under the optical fiber; one surface of the support substrate is covered with silicone gel; the support substrate is secured in a package made of plastic; and the package is filled with the silicone gel which is a protective film transparent to light transmitted by the optical fiber and resistant to humidity.

    摘要翻译: 提供了一种制造光电器件的方法,该光电子器件包括具有用于引导光纤的沟槽的硅平台(支撑衬底),固定在衬底上的半导体激光器芯片和在其一端嵌入槽中的光纤以固定 在支撑基板上,其中安装在凹槽中的光纤被固定在支撑基板上,第一接合元件由注入的粘合剂构成,以填充光纤下方的凹槽; 支撑基板的一个表面被硅胶覆盖; 支撑基板被固定在由塑料制成的包装中; 并且该封装填充有硅凝胶,该硅凝胶是对由光纤传输的光透明并且耐潮湿的保护膜。

    Optoelectronic device
    7.
    发明授权
    Optoelectronic device 失效
    光电器件

    公开(公告)号:US5408559A

    公开(公告)日:1995-04-18

    申请号:US150307

    申请日:1993-11-12

    CPC分类号: G02B6/422 G02B6/4246

    摘要: In a transmitting and receiving optoelectronic device, a wave-separating filter (16) is disposed at a position deviated from 45.degree. with respect to the optical axis of transmission light (6), or the internal wall surface of a light passage hole (15A) of a support (15) is inclined with respect to the optical axis of the transmission light (5). In another arrangement, a light-transmitting optical unit (1) and a wave-separating optical unit (13) are provided as separate units, and optical-axis adjustment is performed with only the light-transmitting optical unit (1).

    摘要翻译: 在发送和接收光电子器件中,波分离滤光器(16)设置在相对于透射光(6)的光轴偏离45°的位置,或者光通孔(15A)的内壁表面 )相对于透射光(5)的光轴倾斜。 在另一种布置中,光传输光学单元(1)和波分离光学单元(13)被设置为分离单元,并且仅使用透光光学单元(1)进行光轴调节。