公开(公告)号：US08864888B2

公开(公告)日：2014-10-21

申请号：US13514480

申请日：2010-12-09

Applicant: Noriyoshi Osawa ,  Makoto Kitano ,  Kenji Sato

Inventor： Noriyoshi Osawa ,  Makoto Kitano ,  Kenji Sato

IPC: B01D17/028 ,  B01D47/06 ,  B01D17/04 ,  C10G33/06

CPC classification number: B01D17/045 ,  C10G33/06

Abstract: This oil-water separation device includes: a supply port (3b) for oily water; a flow passage that causes oily water (X4, X7) supplied from the supply port to flow so that a flow component in a horizontal direction is a main flow component; a floated oil recovery port (F) provided above an upper portion of the flow passage and also at a position spaced from a start end of the flow passage; and a settled oil recovery port (T) provided beneath the flow passage. According to the oil-water separation device, it is possible to separate an oil component from oily water that contains an oil component with higher viscosity.

Abstract translation: 该油水分离装置包括：用于油性水的供给口（3b） 使从所述供给口供给的油性水（X4，X7）流动的流路使得水平方向的流动成分为主流量成分; 浮动油回收口（F），设置在流路的上部的上方，并且在与流路的起始端隔开的位置; 以及设置在流路下方的沉降式油回收口（T）。 根据油水分离装置，可以将油成分与含有较高粘度的油性成分的油性水分离。

公开(公告)号：US20120288927A1

公开(公告)日：2012-11-15

申请号：US13522602

申请日：2011-01-18

Applicant: Norimitsu Kaneko ,  Makoto Kitano ,  Kenji Sato ,  Kentaro Nariai ,  Michikazu Hara ,  Daizo Yamaguchi

Inventor： Norimitsu Kaneko ,  Makoto Kitano ,  Kenji Sato ,  Kentaro Nariai ,  Michikazu Hara ,  Daizo Yamaguchi

IPC: B01J19/00 ,  C12M1/02

CPC classification number: C13K1/02 ,  C12M45/09 ,  C13K13/002 ,  F28D2021/0077

Abstract: A biomass treatment device (A) includes a hot compressed water reaction device (1) that hydrolyzes a biomass by passing hot compressed water to the biomass to prepare polysaccharides, and a solid-acid catalytic reaction device (2 and 3) that generates monosaccharides from the polysaccharides using a solid-acid catalyst, and the device includes at least one of a first heat exchanger (1b and 1b′) for heating the hot compressed water by the heat of a monosaccharide solution including the monosaccharides delivered from the solid-acid-catalytic reaction device and a second heat exchanger (1c) for heating the hot compressed water by the heat of a polysaccharide solution including the polysaccharides introduced into the solid-acid-catalytic reaction device from the hot compressed water reaction device. According to the biomass treatment device, it is possible to improve the energy efficiency more than the related art.

Abstract translation: 一种生物质处理装置（A）包括热压缩水反应装置（1），其通过将热的压缩水通过生物质水解生物质以制备多糖;以及固体酸催化反应装置（2和3），其从 使用固体酸催化剂的多糖，并且该装置包括用于通过单糖溶液的热量加热热压缩水的第一热交换器（1b和1b'）中的至少一种，所述单糖溶液包括从固体酸 - 催化反应装置和第二热交换器（1c），用于通过包含从热压缩水反应装置引入固体酸催化反应装置的多糖的多糖溶液的热量加热热压缩水。 根据生物质处理装置，与现有技术相比，能够提高能量效率。

公开(公告)号：US20070202379A1

公开(公告)日：2007-08-30

申请号：US11526748

申请日：2006-09-26

Applicant: Ryuji Kohno ,  Makoto Kitano ,  Hayami Toba ,  Miyuki Fukushi

Inventor： Ryuji Kohno ,  Makoto Kitano ,  Hayami Toba ,  Miyuki Fukushi

IPC: H01M8/02 ,  H01M8/04 ,  B67D5/08

CPC classification number: H01M8/04097 ,  H01M8/04186 ,  H01M8/04201 ,  H01M8/1011 ,  H01M2250/30 ,  Y02B90/18 ,  Y02E60/523

Abstract: A fuel cell having a membrane electrode assembly to cause an electrochemical reaction in a fuel so as to generate electric power, a fuel holding body for holding the fuel to supply the fuel to the membrane electrode assembly, a fuel supply path to supply the fuel being pressurized to the fuel holding body and a fuel exhausting path to exhaust the fuel from the fuel holding body by using an internal pressure of the fuel.

Abstract translation: 一种燃料电池，其具有在燃料中产生电力发生电化学反应的膜电极组件，用于保持燃料以将燃料供给到膜电极组件的燃料保持体，供给燃料的燃料供给路径 加压到燃料保持体和燃料排出路径，以通过使用燃料的内部压力从燃料保持体排出燃料。

公开(公告)号：US20070154732A1

公开(公告)日：2007-07-05

申请号：US10571568

申请日：2004-09-10

Applicant: Makoto Kitano ,  Yoshiaki Tsubata

Inventor： Makoto Kitano ,  Yoshiaki Tsubata

IPC: C08G73/00 ,  B32B19/00

CPC classification number: H01L51/0034 ,  C07F15/0033 ,  C09K11/06 ,  C09K2211/1011 ,  C09K2211/1029 ,  C09K2211/1092 ,  C09K2211/182 ,  C09K2211/185 ,  H01L51/0072 ,  H01L51/0074 ,  H01L51/0085 ,  H01L51/0087 ,  H01L51/0089 ,  H05B33/14 ,  Y10T428/12944

Abstract: A dendrimer compound characterized by comprising a core represented by the following formula (1-1), (1-2), (1-3), or (1-4) and at least one kind of dendritic structure selected among dendritic structures represented by the following formulae (3) and (4).

Abstract translation: 一种树枝状大分子化合物，其特征在于包含由下式（1-1），（1-2），（1-3）或（1-4）表示的核心和至少一种选自树突状结构中的树枝状结构， 通过下式（3）和（4）。

公开(公告)号：US07208567B2

公开(公告)日：2007-04-24

申请号：US10386710

申请日：2003-03-13

Applicant: Jun Oguma ,  Takahiro Ueoka ,  Yoshiaki Tsubata ,  Makoto Kitano ,  Chizu Sekine

Inventor： Jun Oguma ,  Takahiro Ueoka ,  Yoshiaki Tsubata ,  Makoto Kitano ,  Chizu Sekine

IPC: C08G75/24 ,  C08G73/56 ,  C08G65/34

CPC classification number: H01L51/0036 ,  C08G61/122 ,  C08G61/125 ,  C08G61/126 ,  C08G2261/11 ,  C08G2261/122 ,  C08G2261/3162 ,  C08G2261/3241 ,  C08G2261/3242 ,  C08G2261/3243 ,  C08G2261/5222 ,  C09K11/06 ,  C09K2211/1408 ,  C09K2211/1416 ,  C09K2211/1433 ,  C09K2211/145 ,  C09K2211/1458 ,  C09K2211/1466 ,  C09K2211/1483 ,  H01L51/0035 ,  H01L51/0038 ,  H01L51/0043 ,  H01L51/0052 ,  H01L51/0059 ,  H01L51/0077 ,  H01L51/0084 ,  H01L51/0085 ,  H01L51/5012 ,  H01L51/5048 ,  Y10S428/917

Abstract: Provided is a polymer compound having a polystyrene reduced number average molecular weight of 103-108, and comprising a repeating unit represented by the below formula (1-1) or (1-2), wherein Ring A, Ring B, Ring C, or Ring D each independently represent an aromatic ring, and X represents S or O. The compound is usable as a light-emitting material, a charge transporting material, etc.

Abstract translation: 本发明提供聚苯乙烯换算数均分子量为10 -3 -10 8的高分子化合物，其包含由下式（1-1）表示的重复单元或 （1-2），其中环A，环B，环C或环D各自独立地表示芳环，X表示S或O.该化合物可用作发光材料，电荷输送材料等 。

公开(公告)号：US07119362B2

公开(公告)日：2006-10-10

申请号：US10326663

申请日：2002-12-23

Applicant: Ryuji Kono ,  Makoto Kitano ,  Hideo Miura ,  Hiroyuki Ota ,  Yoshishige Endo ,  Takeshi Harada ,  Masatoshi Kanamaru ,  Teruhisa Akashi ,  Atsushi Hosogane ,  Akihiko Ariga ,  Naoto Ban

Inventor： Ryuji Kono ,  Makoto Kitano ,  Hideo Miura ,  Hiroyuki Ota ,  Yoshishige Endo ,  Takeshi Harada ,  Masatoshi Kanamaru ,  Teruhisa Akashi ,  Atsushi Hosogane ,  Akihiko Ariga ,  Naoto Ban

IPC: H01L23/58

CPC classification number: G01R1/07314 ,  G01R1/06744 ,  G01R3/00 ,  G01R31/2863

Abstract: In an electric characteristic testing process corresponding to a process of the semiconductor apparatus manufacturing processes, in order to test a large area of the electrode pad of the body to be tested in a lump, an electric characteristic testing is performed by pressing a testing structure provided with electrically independent projections having a number equal to a number of conductor portions to be tested formed on an area to be tested of a body to be tested to the body to be tested.

公开(公告)号：US06972954B2

公开(公告)日：2005-12-06

申请号：US11079264

申请日：2005-03-15

Applicant: Rintaro Minamitani ,  Makoto Kitano ,  Noriyuki Ashiwake ,  Shigeo Ohashi ,  Yoshihiro Kondo ,  Takashi Naganawa ,  Yuji Yoshitomi ,  Tsuyoshi Nakagawa

Inventor： Rintaro Minamitani ,  Makoto Kitano ,  Noriyuki Ashiwake ,  Shigeo Ohashi ,  Yoshihiro Kondo ,  Takashi Naganawa ,  Yuji Yoshitomi ,  Tsuyoshi Nakagawa

IPC: F28D15/02 ,  F01P11/06 ,  G06F1/20 ,  H01L23/473 ,  H05K7/20

CPC classification number: G06F1/203 ,  F01P2011/066 ,  F28D15/0266 ,  G06F2200/201 ,  Y10S165/905

Abstract: A liquid cooling system which is utilizable in a personal computer includes a pump for supplying a cooling liquid; a heat receiving jacket supplied with the cooling liquid and positioned to receive heat generated from a heat generation body, a heat radiation pipe for radiating heat which is supplied by the cooling liquid passing through the heat receiving jacket, and a passage for circulating the cooling liquid passing through the heat radiation pipe into the pump. The heat radiation pipe is made of material having a corrosion resistance that is higher than that of the heat receiving jacket.

Abstract translation: 可用于个人计算机的液体冷却系统包括用于供应冷却液的泵; 提供有冷却液并被定位成接收从发热体产生的热量的热接收套管，用于散发由通过热接收套的冷却液供给的热量的散热管，以及用于使冷却液循环的通道 通过热辐射管进入泵。 散热管由具有高于受热护套的耐腐蚀性的材料制成。

公开(公告)号：US06919622B2

公开(公告)日：2005-07-19

申请号：US10774405

申请日：2004-02-10

Applicant: Gen Murakami ,  Kunihiro Tsubosaki ,  Masahiro Ichitani ,  Kunihiko Nishi ,  Ichiro Anjo ,  Asao Nishimura ,  Makoto Kitano ,  Akihiro Yaguchi ,  Sueo Kawai ,  Masatsugu Ogata ,  Syuuji Eguchi ,  Hiroyoshi Kokaku ,  Masanori Segawa ,  Hiroshi Hozoji ,  Takashi Yokoyama ,  Noriyuki Kinjo ,  Aizo Kaneda ,  Junichi Saeki ,  Shozo Nakamura ,  Akio Hasebe ,  Hiroshi Kikuchi ,  Isamu Yoshida ,  Takashi Yamazaki ,  Kazuyoshi Oshima ,  Tetsuro Matsumoto

Inventor： Gen Murakami ,  Kunihiro Tsubosaki ,  Masahiro Ichitani ,  Kunihiko Nishi ,  Ichiro Anjo ,  Asao Nishimura ,  Makoto Kitano ,  Akihiro Yaguchi ,  Sueo Kawai ,  Masatsugu Ogata ,  Syuuji Eguchi ,  Hiroyoshi Kokaku ,  Masanori Segawa ,  Hiroshi Hozoji ,  Takashi Yokoyama ,  Noriyuki Kinjo ,  Aizo Kaneda ,  Junichi Saeki ,  Shozo Nakamura ,  Akio Hasebe ,  Hiroshi Kikuchi ,  Isamu Yoshida ,  Takashi Yamazaki ,  Kazuyoshi Oshima ,  Tetsuro Matsumoto

IPC: H01L21/52 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50 ,  H01L25/10 ,  H01L29/06 ,  H05K1/14 ,  H05K1/18 ,  H05K3/34

CPC classification number: H01L23/3107 ,  H01L23/4951 ,  H01L23/49555 ,  H01L23/49558 ,  H01L23/49568 ,  H01L23/49586 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/105 ,  H01L29/0657 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/16245 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85205 ,  H01L2224/8592 ,  H01L2224/92147 ,  H01L2225/1005 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01092 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/144 ,  H05K1/181 ,  H05K3/3421 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2924/0695 ,  H01L2224/85399

Abstract: As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the “Lead-On-Chip” or “Chip-On-Lead” structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.

Abstract translation: 由于半导体芯片尺寸大，高集成度和加速度，所以难以将半导体芯片与包装中的引线组合在一起。 鉴于这种困难，已经采用称为半导体和引线堆叠和封装的称为“片上引线”或“引线芯片”结构的封装结构。 在该结构的封装中，根据本发明，内引线和半导体芯片的前端部之间的间隙比除引导端部和半导体芯片之外的内引线部分之间的间隙宽，从而减小 杂散容量，提高信号传输速率和减少电气噪声。

公开(公告)号：US06741464B2

公开(公告)日：2004-05-25

申请号：US09921925

申请日：2001-08-06

Applicant: Makoto Kitano ,  Takashi Naganawa ,  Yuji Yoshitomi ,  Rintaro Minamitani ,  Shigeo Ohashi ,  Noriyuki Ashiwake ,  Yoshihiro Kondo ,  Tsuyoshi Nakagawa

Inventor： Makoto Kitano ,  Takashi Naganawa ,  Yuji Yoshitomi ,  Rintaro Minamitani ,  Shigeo Ohashi ,  Noriyuki Ashiwake ,  Yoshihiro Kondo ,  Tsuyoshi Nakagawa

IPC: G06F120

CPC classification number: G06F1/203 ,  G06F2200/201 ,  G06F2200/203

Abstract: A liquid cooling system for cooling a high heat generating body, such as a semiconductor element or the like, of the type used in an electronic apparatus that is small and thin in size, or in a personal computer equipped with such a structure therein. The system has a pump of the reciprocal movement type, a heat receiving jacket, a heat radiation pipe, and a connector pipe for connecting those parts with one another so as to form a closed loop filled with a cooling liquid. In the system, &Dgr;Vs is equal to or greater than &Dgr;Vp, wherein the inner volume change when the pump emits pulsation therefrom is &Dgr;Vp, the pressure caused by the volume change is P, and the volume change due to the pressure P that occurs in flow passage of the cooling liquid &Dgr;Vp other than within the pump, is &Dgr;Vs.

Abstract translation: 一种液体冷却系统，用于冷却尺寸小的电子设备中使用的类型的诸如半导体元件等的高发热体或在其中配备有这种结构的个人计算机中的类型。 该系统具有往复运动型泵，热接收套管，散热管和用于将这些部件彼此连接的连接管，以便形成填充有冷却液体的闭合回路。 在该系统中，DeltaV等于或大于DeltaVp，其中当泵从其发出脉动时的内部体积变化为DeltaVp，由体积变化引起的压力为P，并且由于在流动中发生的压力P导致的体积变化 冷却液通道DeltaVp除泵内外，均为DeltaVs。

公开(公告)号：US06455335B1

公开(公告)日：2002-09-24

申请号：US09653624

申请日：2000-08-31

Applicant: Ryuji Kohno ,  Tetsuo Kumazawa ,  Makoto Kitano ,  Akihiko Ariga ,  Yuji Wada ,  Naoto Ban ,  Shuji Shibuya ,  Yasuhiro Motoyama ,  Kunio Matsumoto ,  Susumu Kasukabe ,  Terutaka Mori ,  Hidetaka Shigi ,  Takayoshi Watanabe

Inventor： Ryuji Kohno ,  Tetsuo Kumazawa ,  Makoto Kitano ,  Akihiko Ariga ,  Yuji Wada ,  Naoto Ban ,  Shuji Shibuya ,  Yasuhiro Motoyama ,  Kunio Matsumoto ,  Susumu Kasukabe ,  Terutaka Mori ,  Hidetaka Shigi ,  Takayoshi Watanabe

IPC: G01R3126

CPC classification number: G01R3/00 ,  G01R1/0735

Abstract: Dispersion of load may be kept within an allowance even when a plurality of probes in a large area are pressed in batch by pressing the probes provided in a membrane to a wafer by applying a pressure load to a plurality of places of a plane of pressure members on the side opposite from the wafer in a probe test step/burn-in test step which is one of semiconductor device manufacturing steps. It is then possible to provide semiconductor devices and a manufacturing method thereof which enhance the reliability and productivity of the semiconductor devices by probing a large number of integrated circuits or a large size integrated circuit in the same time.