公开(公告)号：US20180301836A1

公开(公告)日：2018-10-18

申请号：US15490252

申请日：2017-04-18

Applicant: TE CONNECTIVITY CORPORATION

Inventor： Michael David Herring

IPC: H01R12/73 ,  H01R12/70 ,  H05K1/14 ,  H05K1/11

CPC classification number: H05K1/117 ,  H01R12/7005 ,  H01R12/714 ,  H01R12/718 ,  H01R13/6275 ,  H01R13/6335 ,  H05K1/141 ,  H05K2201/049 ,  H05K2201/10121 ,  H05K2201/10189

Abstract: A dual connector system includes a host circuit board, a first electrical connector at a front mounting area of the host circuit board, and a second electrical connector at a rear mounting area of the host circuit board. The first electrical connector has a housing having a card slot for a module circuit board and the second electrical connector has a housing having an upper mating surface for the module circuit board. The housing has towers having ledges defining a gap between the upper mating surface and the ledges. The housing has biasing members at each tower facing the gap configured to engage the module circuit board to locate the module circuit board between the towers. The housing holds second contacts at the upper mating surface.

公开(公告)号：US20180270991A1

公开(公告)日：2018-09-20

申请号：US15903584

申请日：2018-02-23

Applicant: Toshiba Memory Corporation

Inventor： Akitoshi SUZUKI

IPC: H05K7/20 ,  H05K5/00 ,  H05K1/02

CPC classification number: H05K7/20436 ,  H05K1/0203 ,  H05K1/144 ,  H05K1/181 ,  H05K5/0008 ,  H05K5/006 ,  H05K7/20136 ,  H05K7/20472 ,  H05K2201/042 ,  H05K2201/10015 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10409 ,  H05K2201/10424 ,  H05K2201/10522

Abstract: An electronic device includes a top plate having a first surface and a second surface that is positioned at an elevation that is lower than an elevation of the first surface, the second surface extending from a first end part of the top plate to a second end part of the top plate, a bottom plate provided under the top plate, and a circuit board placed between the top plate and the bottom plate and mounted with an electronic component. The top plate has opposing first and second edges and opposing third and fourth edges that are perpendicular to the first and the second edges, the first end part being formed at the first edge and the second end part being formed at the second edge.

公开(公告)号：US10074938B2

公开(公告)日：2018-09-11

申请号：US15470186

申请日：2017-03-27

Applicant: CommScope Technologies LLC

Inventor： David Patrick Murray ,  Bernard Harold Hammond, Jr.

IPC: H01R13/64 ,  H01R13/6466 ,  H05K1/02 ,  H01R13/66 ,  H01R24/64

CPC classification number: H01R13/6466 ,  H01R13/6461 ,  H01R13/6464 ,  H01R13/6658 ,  H01R13/6691 ,  H01R24/64 ,  H05K1/0228 ,  H05K1/162 ,  H05K2201/09236 ,  H05K2201/09672 ,  H05K2201/10189 ,  Y10S439/941 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/53209

Abstract: Methods and systems for providing crosstalk compensation in a jack are disclosed. According to one method, the crosstalk compensation is adapted to compensate for undesired crosstalk generated at a capacitive coupling located at a plug inserted within the jack. The method includes positioning a first capacitive coupling a first time delay away from the capacitive coupling of the plug, the first capacitive coupling having a greater magnitude and an opposite polarity as compared to the capacitive coupling of the plug. The method also includes positioning a second capacitive coupling at a second time delay from the first capacitive coupling, the second time delay corresponding to an average time delay that optimizes near end crosstalk. The second capacitive coupling has generally the same overall magnitude but an opposite polarity as compared to the first capacitive coupling, and includes two capacitive elements spaced at different time delays from the first capacitive coupling.

公开(公告)号：US20180233860A1

公开(公告)日：2018-08-16

申请号：US15892743

申请日：2018-02-09

Applicant: LOTES CO., LTD

Inventor： Chin Chi Lin ,  Cheng Wei Lo

IPC: H01R13/66 ,  H01R13/506 ,  H01R12/57 ,  H01R12/53 ,  H01R13/516 ,  H05K1/02

CPC classification number: H01R13/6591 ,  H01L23/3675 ,  H01R12/53 ,  H01R12/57 ,  H01R12/716 ,  H01R12/725 ,  H01R12/732 ,  H01R13/405 ,  H01R13/506 ,  H01R13/516 ,  H01R13/5213 ,  H01R13/5216 ,  H01R13/6581 ,  H01R13/6594 ,  H01R13/665 ,  H05K1/0203 ,  H05K1/0209 ,  H05K3/284 ,  H05K7/20154 ,  H05K7/2039 ,  H05K2201/0215 ,  H05K2201/10189 ,  H05K2201/10371 ,  H05K2201/10446

Abstract: An electrical connector assembly includes: a circuit board; a connector, located in front of the circuit board and electrically connected to the circuit board; a chip, provided on the circuit board, and electrically connected to the circuit board; a metal shell, covering the connector and the circuit board; and an inner film, made of a high heat conductive material, and wrapping the chip and the circuit board. At least a part of the inner film is located between the metal shell and the circuit board. When the chip generates a great amount of heat, the inner film, serving as a medium, can absorb the heat rapidly and conduct the heat to the metal shell so as to dissipate the heat outside.

公开(公告)号：US20180228039A1

公开(公告)日：2018-08-09

申请号：US15872238

申请日：2018-01-16

Applicant: Google LLC

Inventor： David Kyungtag Lim ,  Jason Edward Jordan

IPC: H05K5/00 ,  H04N5/225 ,  H05K7/14 ,  H05K1/14 ,  H05K1/02 ,  H04R3/00 ,  H04R1/02

CPC classification number: H05K5/0086 ,  G06F1/1635 ,  G06F1/184 ,  H04M1/0262 ,  H04M1/0274 ,  H04M1/0277 ,  H04N5/2256 ,  H04N5/2257 ,  H04R1/025 ,  H04R3/00 ,  H04R2499/11 ,  H05K1/028 ,  H05K1/14 ,  H05K1/148 ,  H05K7/1427 ,  H05K2201/04 ,  H05K2201/10037 ,  H05K2201/10189

Abstract: An electronic device is provided. In some embodiments, the electronic device includes an electronic device housing having a major planar face, first and second circuit boards oriented parallel to the major planar face, a third circuit board electrically connected with the first and second circuit boards, and a battery partially surrounded by the first, second, and third circuit boards. At least a portion of the third circuit board is oriented perpendicular to the major planar face between the first and second circuit boards.

公开(公告)号：US20180205392A1

公开(公告)日：2018-07-19

申请号：US15854261

申请日：2017-12-26

Applicant: Intel Corporation

Inventor： Vinodh Gopal ,  James D. Guilford ,  Kirk S. Yap

IPC: H03M7/40

CPC classification number: H03M7/3084 ,  B25J15/0014 ,  B65G1/0492 ,  G02B6/3882 ,  G02B6/3893 ,  G02B6/3897 ,  G02B6/4292 ,  G02B6/4452 ,  G05D23/1921 ,  G05D23/2039 ,  G06F1/183 ,  G06F3/061 ,  G06F3/0611 ,  G06F3/0616 ,  G06F3/0619 ,  G06F3/0625 ,  G06F3/0631 ,  G06F3/0638 ,  G06F3/064 ,  G06F3/0647 ,  G06F3/0653 ,  G06F3/0658 ,  G06F3/0659 ,  G06F3/0664 ,  G06F3/0665 ,  G06F3/067 ,  G06F3/0673 ,  G06F3/0679 ,  G06F3/0683 ,  G06F3/0688 ,  G06F3/0689 ,  G06F8/65 ,  G06F9/4401 ,  G06F9/5016 ,  G06F9/5044 ,  G06F9/505 ,  G06F9/5072 ,  G06F9/5077 ,  G06F11/141 ,  G06F11/3414 ,  G06F12/0862 ,  G06F12/0893 ,  G06F12/10 ,  G06F12/109 ,  G06F12/1408 ,  G06F13/161 ,  G06F13/1668 ,  G06F13/1694 ,  G06F13/4022 ,  G06F13/4068 ,  G06F13/409 ,  G06F13/42 ,  G06F13/4282 ,  G06F15/8061 ,  G06F17/30949 ,  G06F2209/5019 ,  G06F2209/5022 ,  G06F2212/1008 ,  G06F2212/1024 ,  G06F2212/1041 ,  G06F2212/1044 ,  G06F2212/152 ,  G06F2212/202 ,  G06F2212/401 ,  G06F2212/402 ,  G06F2212/7207 ,  G06Q10/06 ,  G06Q10/06314 ,  G06Q10/087 ,  G06Q10/20 ,  G06Q50/04 ,  G07C5/008 ,  G08C17/02 ,  G08C2200/00 ,  G11C5/02 ,  G11C5/06 ,  G11C7/1072 ,  G11C11/56 ,  G11C14/0009 ,  H03M7/30 ,  H03M7/3086 ,  H03M7/40 ,  H03M7/4031 ,  H03M7/4056 ,  H03M7/4081 ,  H03M7/6005 ,  H03M7/6023 ,  H04B10/25 ,  H04B10/2504 ,  H04L9/0643 ,  H04L9/14 ,  H04L9/3247 ,  H04L9/3263 ,  H04L12/2809 ,  H04L29/12009 ,  H04L41/024 ,  H04L41/046 ,  H04L41/0813 ,  H04L41/082 ,  H04L41/0896 ,  H04L41/12 ,  H04L41/145 ,  H04L41/147 ,  H04L41/5019 ,  H04L43/065 ,  H04L43/08 ,  H04L43/0817 ,  H04L43/0876 ,  H04L43/0894 ,  H04L43/16 ,  H04L45/02 ,  H04L45/52 ,  H04L47/24 ,  H04L47/38 ,  H04L47/765 ,  H04L47/782 ,  H04L47/805 ,  H04L47/82 ,  H04L47/823 ,  H04L49/15 ,  H04L49/25 ,  H04L49/357 ,  H04L49/45 ,  H04L49/555 ,  H04L67/02 ,  H04L67/10 ,  H04L67/1004 ,  H04L67/1008 ,  H04L67/1012 ,  H04L67/1014 ,  H04L67/1029 ,  H04L67/1034 ,  H04L67/1097 ,  H04L67/12 ,  H04L67/16 ,  H04L67/306 ,  H04L67/34 ,  H04L69/04 ,  H04L69/329 ,  H04Q1/04 ,  H04Q11/00 ,  H04Q11/0003 ,  H04Q11/0005 ,  H04Q11/0062 ,  H04Q11/0071 ,  H04Q2011/0037 ,  H04Q2011/0041 ,  H04Q2011/0052 ,  H04Q2011/0073 ,  H04Q2011/0079 ,  H04Q2011/0086 ,  H04Q2213/13523 ,  H04Q2213/13527 ,  H04W4/023 ,  H04W4/80 ,  H05K1/0203 ,  H05K1/181 ,  H05K5/0204 ,  H05K7/1418 ,  H05K7/1421 ,  H05K7/1422 ,  H05K7/1447 ,  H05K7/1461 ,  H05K7/1485 ,  H05K7/1487 ,  H05K7/1489 ,  H05K7/1491 ,  H05K7/1492 ,  H05K7/1498 ,  H05K7/2039 ,  H05K7/20709 ,  H05K7/20727 ,  H05K7/20736 ,  H05K7/20745 ,  H05K7/20836 ,  H05K13/0486 ,  H05K2201/066 ,  H05K2201/10121 ,  H05K2201/10159 ,  H05K2201/10189 ,  Y02D10/14 ,  Y02D10/151 ,  Y02P90/30 ,  Y10S901/01

Abstract: Technologies for performing speculative decompression include a managed node to decode a variable size code at a present position in compressed data with a deterministic decoder and concurrently perform speculative decodes over a range of subsequent positions in the compressed data, determine the position of the next code, determine whether the position of the next code is within the range, and output, in response to a determination that the position of the next code is within the range, a symbol associated with the deterministically decoded code and another symbol associated with a speculatively decoded code at the position of the next code.

公开(公告)号：US20180196208A1

公开(公告)日：2018-07-12

申请号：US15914415

申请日：2018-03-07

Applicant: CONTINENTAL AUTOMOTIVE GMBH

Inventor： Detlev Bagung ,  Thomas Riepl

IPC: G02B6/42 ,  H05K3/00 ,  H05K3/30 ,  H05K1/03 ,  H05K1/18 ,  H05K1/02 ,  H05K3/28 ,  B60R16/023

CPC classification number: G02B6/4281 ,  B60R16/023 ,  G02B6/4274 ,  H05K1/0278 ,  H05K1/028 ,  H05K1/0393 ,  H05K1/148 ,  H05K1/181 ,  H05K3/0014 ,  H05K3/284 ,  H05K3/303 ,  H05K2201/10121 ,  H05K2201/10189

Abstract: A method for producing a lateral connection of an electro-optical interface is specified. In the method, a printed circuit board having a non-curved center plane is provided. An electro-optical component and an electrical component are arranged and oriented with respect to one another in a connection region. A first section of the printed circuit board is deformed in such a way that the center plane encloses an angle with the non-deformed layer in the region of the first section. An electro-optical interface and a control device are also specified.

公开(公告)号：US10014609B2

公开(公告)日：2018-07-03

申请号：US15802830

申请日：2017-11-03

Applicant: Molex, LLC

Inventor： Koji Chikano ,  Makiko Ikeda ,  Kazushige Asakawa

IPC: H01R12/00 ,  H01R12/73 ,  H01R12/71 ,  H01R13/436 ,  H01R12/70 ,  H01R12/72 ,  H01R13/26 ,  H01R12/52 ,  H05K3/36 ,  H01R13/422

CPC classification number: H01R12/716 ,  H01R12/52 ,  H01R12/707 ,  H01R12/724 ,  H01R13/26 ,  H01R13/41 ,  H01R13/4223 ,  H01R13/4361 ,  H01R13/5219 ,  H05K3/368 ,  H05K2201/10189

Abstract: A connector is provided that has a terminal, a housing for retaining the terminal, and a reinforcing bracket retained in the housing. The housing includes a fitting concave portion that fits with a counterpart connector and a bottom plate portion that faces a surface of a substrate. The terminal includes a contact portion that makes contact with a counterpart terminal of the counterpart connector inside the fitting concave portion and a substrate connecting portion exposed from a lower surface of the bottom plate portion and connected to a connecting pad on the surface of the substrate. The reinforcing bracket includes a main body portion retained in the housing inside the fitting concave portion and a leg portion exposed from the lower surface of the bottom plate portion and connected to the connecting pad on the surface of the substrate.

公开(公告)号：US20180178016A1

公开(公告)日：2018-06-28

申请号：US15844683

申请日：2017-12-18

Applicant: Greatbatch Ltd.

Inventor： Dominick J. Frustaci ,  Keith W. Seitz ,  Thomas Marzano ,  Robert A. Stevenson ,  Christine A. Frysz ,  Richard L. Brendel ,  Jason Woods

IPC: A61N1/375 ,  H01G4/35 ,  H01R13/7195 ,  H01G2/22 ,  H05K1/02 ,  A61N1/05 ,  H01G2/10 ,  A61N1/08 ,  H01G4/40

CPC classification number: A61N1/3754 ,  A61N1/05 ,  A61N1/08 ,  H01G2/103 ,  H01G2/22 ,  H01G4/35 ,  H01G4/40 ,  H01R13/7195 ,  H01R2201/12 ,  H05K1/0231 ,  H05K2201/10015 ,  H05K2201/10189 ,  H05K2201/10303

Abstract: A hermetically sealed feedthrough subassembly attachable to an active implantable medical device includes a first conductive leadwire extending from a first end to a second end, the first conductive leadwire first end disposed past a device side of an insulator body. A feedthrough filter capacitor is disposed on the device side. A second conductive leadwire is disposed on the device side having a second conductive leadwire first end at least partially disposed within a first passageway of the feedthrough filter capacitor and having a second conductive leadwire second end disposed past the feedthrough filter capacitor configured to be connectable to AIMD internal electronics. The second conductive leadwire first end is at, near or adjacent to the first conductive leadwire first end. A first electrically conductive material forms a three-way electrical connection electrically connecting the second conductive leadwire first end, the first conductive leadwire first end and a capacitor internal metallization.

公开(公告)号：US20180177058A1

公开(公告)日：2018-06-21

申请号：US15736749

申请日：2016-06-06

Applicant: Robert Bosch GmbH

Inventor： Uwe Liskow

IPC: H05K3/28 ,  H05K1/18 ,  H05K5/06 ,  H05K1/11 ,  H05K3/32 ,  H05K5/00

CPC classification number: H05K3/284 ,  H05K1/111 ,  H05K1/181 ,  H05K3/301 ,  H05K3/328 ,  H05K5/0082 ,  H05K5/065 ,  H05K2201/10151 ,  H05K2201/10189 ,  H05K2201/105 ,  H05K2201/10522 ,  H05K2201/10606 ,  H05K2201/2072 ,  H05K2203/1316 ,  H05K2203/1327

Abstract: An electronic module includes a circuit board, a first component, and a socket element with a first surface and a second surface opposite the first surface. The first surface lies on a surface of the circuit board and is fixed to the circuit board. A second component is secured to the socket element and is electrically connected to the circuit board via the socket element. A protective compound is arranged on the surface of the circuit board and encapsulates the first component. The socket element is partly embedded into the protective compound such that lateral flanks of the socket element are covered by the protective compound, and the second surface of the socket element protrudes out of the protective compound. Connection elements of the socket element and connections of the second component are connected via a welding connection. Second components are attachable to the circuit board in a reliable manner.