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    APPARATUS AND METHOD FOR CUTTING WITH A LASER ARRAY
    62.
    发明申请
    APPARATUS AND METHOD FOR CUTTING WITH A LASER ARRAY 审中-公开
    用激光阵列切割的装置和方法

    公开(公告)号：US20140124490A1

    公开(公告)日：2014-05-08

    申请号：US14071850

    申请日：2013-11-05

    申请人： GALLUS DRUCKMASCHINEN GMBH

    发明人： DIETER BANGEL

    IPC分类号： B23K26/38

    CPC分类号： B23K26/38 ,  B23K26/0604 ,  B23K26/0846 ,  B23K26/0869 ,  B23K26/382 ,  B23K37/0235 ,  B23K2101/16 ,  B23K2103/38 ,  B23K2103/50 ,  B31B50/16 ,  B31B50/25 ,  B31D1/02 ,  B31D1/026

    摘要： An apparatus and a method are provided for cutting, cutting-out and perforating web or sheet substrates. The apparatus has a laser cutting device disposed above or below a transport plane for processing a substrate. The laser cutting device includes at least one laser array extending over the width of the substrate and having individually drivable lasers. The laser array is composed, in particular, of a plurality of individual arrays. The lasers are, in particular, constructed as vertical-cavity surface-emitting lasers. In this way, processing of the substrate at high transport speeds is made possible.

    摘要翻译： 提供了一种用于切割，切割和穿孔网状物或片状基底的装置和方法。 该设备具有设置在用于处理基板的输送平面上方或下方的激光切割装置。 激光切割装置包括至少一个激光器阵列，该激光器阵列在衬底的宽度上延伸并且具有单独驱动的激光器。 特别地，激光阵列由多个单独阵列组成。 特别地，激光器被构造为垂直腔表面发射激光器。 以这种方式，可以在高传输速度下处理基板。

    Laser drilling technique for creating nanoscale holes
    64.
    发明授权
    Laser drilling technique for creating nanoscale holes 有权
    用于创建纳米尺度孔的激光钻孔技术

    公开(公告)号：US08623496B2

    公开(公告)日：2014-01-07

    申请号：US12614237

    申请日：2009-11-06

    申请人： Robert H. Blick ,  Minrui Yu

    发明人： Robert H. Blick ,  Minrui Yu

    IPC分类号： B32B3/10

    CPC分类号： G01N27/00 ,  B23K26/066 ,  B23K26/18 ,  B23K26/382 ,  B23K26/40 ,  B23K26/55 ,  B23K2103/50 ,  Y10T428/24273 ,  Y10T428/24281 ,  Y10T428/24612

    摘要： A method of forming extremely small pores in a substrate that is used, for example, in patch clamp applications is provided that employs an energy absorbing material beyond a back side of the substrate to allow a laser to be focused adjacent the exit side of the substrate so as to generate a pore through the substrate and can also form a crater in the back side of the substrate and in which the pore may propagate from the crater in a drilling direction that can oppose a laser transmission direction.

    摘要翻译： 提供了一种在例如膜片钳应用中使用的衬底中形成极小孔的方法，该方法使用超出衬底背面的能量吸收材料，以允许激光聚焦在衬底的出射侧 从而通过基板产生孔，并且还可以在基板的背面形成凹坑，并且其中孔可以在与激光传输方向相对的钻孔方向上从火山口传播。

    SUBSTRATE CORES FOR LASER THROUGH HOLE FORMATION
    65.
    发明申请
    SUBSTRATE CORES FOR LASER THROUGH HOLE FORMATION 审中-公开
    通过孔形成激光的基底线

    公开(公告)号：US20140004361A1

    公开(公告)日：2014-01-02

    申请号：US13536709

    申请日：2012-06-28

    申请人： Nikhil Sharma ,  Chong Zhang ,  Tao Wu ,  Islam A. Salama

    发明人： Nikhil Sharma ,  Chong Zhang ,  Tao Wu ,  Islam A. Salama

    IPC分类号： B32B27/02 ,  B23K26/38

    CPC分类号： B32B27/02 ,  B23K26/382 ,  B23K26/40 ,  B23K2103/172 ,  Y10T428/31855

    摘要： Substrate cores for laser through hole formation are described. Substrate core embodiments include a plurality of reinforcement material layers and a microfiller loaded resin disposed between the plurality of reinforcement material layers. Microfiller and reinforcement materials are selected to reduce opto-thermal mismatch for a laser of a predetermined bandwidth. In embodiments, the reinforcement material may include a fibrous polymer, reducing the thermal contrast with the microfiller loaded resin, and/or include a chromophore that absorbs within the laser bandwidth. In further embodiments, the microfiller is of a material having a high melting temperature to reduce thermal contrast with the reinforcement material.

    摘要翻译： 描述了用于激光通孔形成的基板芯。 基底芯实施例包括多个增强材料层和设置在多个增强材料层之间的装载有微粒填料的树脂。 选择微型填充物和增强材料以减少预定带宽的激光器的光热失配。 在实施方案中，增强材料可以包括纤维聚合物，减少与填充微粒填料的树脂的热对比度，和/或包括在激光带宽内吸收的发色团。 在另外的实施方案中，微细粉末是具有高熔融温度以减少与增强材料的热对比度的材料。

    METHOD FOR FORMING METAL MASK AND LASER DRILLING APPARATUS FOR FORMING THE SAME
    66.
    发明申请
    METHOD FOR FORMING METAL MASK AND LASER DRILLING APPARATUS FOR FORMING THE SAME 审中-公开
    用于形成金属掩模和激光钻孔装置的方法

    公开(公告)号：US20130248503A1

    公开(公告)日：2013-09-26

    申请号：US13429697

    申请日：2012-03-26

    申请人： Sung-Hsien LEE

    发明人： Sung-Hsien LEE

    IPC分类号： B23K26/38 ,  B23K31/02 ,  B23K26/00

    CPC分类号： B23K31/02 ,  B23K26/032 ,  B23K26/0604 ,  B23K26/0876 ,  B23K26/382 ,  B23K26/40 ,  B23K37/0235 ,  B23K2103/50

    摘要： The present invention is directed to a method for forming a metal mask. The method includes mounting a metal frame to a periphery of a supporting structure of a worktable, next placing a thin metal plate in a flat manner on a top surface constructed by the metal frame and the supporting structure, next forming a prototype mask by welding the thin metal plate with the metal frame, next forming multiple mesh holes in the thin metal plate by performing a laser drilling process to the prototype mask using a laser drilling apparatus.

    摘要翻译： 本发明涉及一种形成金属掩模的方法。 该方法包括将金属框架安装到工作台的支撑结构的周边，接下来将平坦的金属板放置在由金属框架和支撑结构构成的顶表面上，接下来通过焊接形成原型掩模 金属板的金属板，然后通过使用激光钻孔设备对原型掩模进行激光钻孔处理，在薄金属板中形成多个网孔。

    Strengthened glass substrate sheets and methods for fabricating glass panels from glass substrate sheets
    67.
    发明授权
    Strengthened glass substrate sheets and methods for fabricating glass panels from glass substrate sheets 有权
    加强的玻璃基板和从玻璃基板制造玻璃板的方法

    公开(公告)号：US08539794B2

    公开(公告)日：2013-09-24

    申请号：US13018904

    申请日：2011-02-01

    申请人： Ivan A Cornejo ,  Sinue Gomez ,  Lisa Anne Moore ,  Sergio Tsuda

    发明人： Ivan A Cornejo ,  Sinue Gomez ,  Lisa Anne Moore ,  Sergio Tsuda

    IPC分类号： C03C15/00 ,  C03B33/02

    CPC分类号： B28D1/00 ,  B23K26/0624 ,  B23K26/382 ,  B23K26/40 ,  B23K2103/50 ,  C03C3/083 ,  C03C3/091 ,  C03C15/02 ,  C03C21/002 ,  G02F1/133351 ,  Y10T428/15

    摘要： Strengthened glass substrate sheets and methods of fabricating glass panels from glass substrate sheets are disclosed. In one embodiment, a method includes forming at least one series of holes through a thickness of the glass substrate sheet, wherein the at least one series of holes defines a perimeter of the glass panel to be separated from the glass substrate sheet. The method further includes strengthening the glass substrate sheet by a strengthening process, and separating the glass panel from the glass substrate sheet along the at least one series of holes. At least a portion of one or more edges of the glass panel has an associated edge compressive layer. In another embodiment, a strengthened glass substrate sheet includes at least one series of holes that defines a perimeter of one or more glass panels to be separated from the strengthened glass substrate sheet.

    摘要翻译： 公开了玻璃基板的加强玻璃基板和从玻璃基片制造玻璃面板的方法。 在一个实施例中，一种方法包括通过玻璃基板的厚度形成至少一系列孔，其中至少一系列孔限定玻璃板的与玻璃基板分离的周长。 该方法还包括通过强化工艺来加强玻璃基片，以及沿着至少一系列的孔将玻璃面板与玻璃基片分开。 玻璃面板的一个或多个边缘的至少一部分具有相关联的边缘压缩层。 在另一个实施例中，强化的玻璃基板包括至少一系列的孔，其限定要从强化玻璃基板分离的一个或多个玻璃板的周边。

    Depth and breakthrough detection for laser machining
    68.
    发明授权
    Depth and breakthrough detection for laser machining 有权
    激光加工的深度和突破检测

    公开(公告)号：US08525073B2

    公开(公告)日：2013-09-03

    申请号：US12694435

    申请日：2010-01-27

    申请人： John Patrick Quitter ,  Chester E. Yaworsky, Jr. ,  Hai-Lung Tsai

    发明人： John Patrick Quitter ,  Chester E. Yaworsky, Jr. ,  Hai-Lung Tsai

    IPC分类号： B23K26/00 ,  B23K26/36 ,  B23K26/38

    CPC分类号： B23K26/03 ,  B23K26/046 ,  B23K26/0622 ,  B23K26/382 ,  B23K26/40 ,  B23K26/705 ,  B23K2101/001 ,  B23K2103/50

    摘要： A system comprises a working laser beam, a sensing laser beam, first and second optical elements, an optical sensor, an aperture and a controller. The first optical element generates a coaxial beam from the working laser beam and the sensing laser beam. The second optical element focuses the coaxial beam onto a workpiece, such that the working laser beam machines the workpiece and the sensing laser beam reflects from the workpiece. The optical sensor senses an intensity of the reflected sensing beam. The aperture determines a focus position by translating along the reflected sensing beam, such that the reflected intensity is maximized. The controller determining a machining parameter of the working laser beam, based on the focus position.

    摘要翻译： 系统包括工作激光束，感测激光束，第一和第二光学元件，光学传感器，光圈和控制器。 第一光学元件从工作激光束和感测激光束产生同轴光束。 第二光学元件将同轴光束聚焦到工件上，使得工作激光束加工工件，并且感测激光束从工件反射。 光学传感器感测反射的感测光束的强度。 孔径通过沿反射的感测光束平移来确定聚焦位置，使得反射强度最大化。 控制器基于焦点位置确定工作激光束的加工参数。

    Glass substrate for semiconductor device component and process for producing glass substrate for semiconductor device component
    70.
    发明授权
    Glass substrate for semiconductor device component and process for producing glass substrate for semiconductor device component 有权
    用于半导体器件部件的玻璃基板和用于制造用于半导体器件部件的玻璃基板的工艺

    公开(公告)号：US08491983B2

    公开(公告)日：2013-07-23

    申请号：US13172638

    申请日：2011-06-29

    申请人： Motoshi Ono ,  Akio Koike

    发明人： Motoshi Ono ,  Akio Koike

    IPC分类号： B32B3/24 ,  B23K26/40

    CPC分类号： B23K26/382 ,  B23K26/384 ,  B23K26/40 ,  B23K2103/50 ,  C03C3/076 ,  C03C23/0025 ,  Y10T428/24273

    摘要： It is an object of the present invention to provide a glass substrate having plural through-holes which is not likely to peel from a silicon wafer, even though laminated on and jointed to a the silicon wafer and then subjected to heat treatment. The above object is accomplished by a glass substrate having an average thermal expansion coefficient of from 10×10−7 to 50×10−7/K within a range of from 50° C. to 300° C., having plural through-holes with a taper angle of from 0.1 to 20° and having a thickness of from 0.01 to 5 mm.

    摘要翻译： 本发明的目的是提供一种具有多个不易从硅晶片剥离的通孔的玻璃基板，即使层压在硅晶片上并与硅晶片接合，然后进行热处理。 上述目的是通过在50℃至300℃的范围内具有10×10-7至50×10-7 / K的平均热膨胀系数的玻璃基板实现的，具有多个通孔 锥角为0.1〜20°，厚度为0.01〜5mm。