公开(公告)号：US5354611A

公开(公告)日：1994-10-11

申请号：US71345

申请日：1993-05-28

Applicant: David J. Arthur ,  Gwo S. Swei ,  Phong X. Nguyen

Inventor： David J. Arthur ,  Gwo S. Swei ,  Phong X. Nguyen

IPC: C08K7/28 ,  C08K9/04 ,  H05K1/03 ,  B32B18/00

CPC classification number: H05K1/0373 ,  C08K7/28 ,  C08K9/04 ,  H05K1/034 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0254 ,  Y10T428/252 ,  Y10T428/259 ,  Y10T428/2982 ,  Y10T428/2995 ,  Y10T428/2996 ,  Y10T428/3154 ,  Y10T428/31544

Abstract: A composite material is disclosed. The material comprises a polymeric matrix and from about 20 volume percent to about 70 volume percent inorganic particles distributed throughout the matrix. Suitable inorganic particles include hollow inorganic microspheres and porous inorganic particles. The inorganic particles are coated with a surface coating. The composite material of the present invention exhibits a dielectric constant of less than about 2.5 and a thermal coefficient of expansion of less than about 70 ppm/.degree.C.

Abstract translation: 公开了一种复合材料。 该材料包括聚合物基质和分布在整个基质中的约20体积％至约70体积％的无机颗粒。 合适的无机颗粒包括中空无机微球和多孔无机颗粒。 无机颗粒用表面涂层涂覆。 本发明的复合材料的介电常数小于约2.5，热膨胀系数小于约70ppm /℃。

公开(公告)号：US5338567A

公开(公告)日：1994-08-16

申请号：US979481

申请日：1992-11-20

Applicant: Thomas S. Kohm

Inventor： Thomas S. Kohm

IPC: C23C18/16 ,  C23C18/20 ,  H05K1/03 ,  H05K3/18 ,  H05K3/42 ,  C23C26/00

CPC classification number: H05K1/0373 ,  C23C18/206 ,  C23C18/30 ,  H05K3/181 ,  H05K2201/0209 ,  H05K2201/0236 ,  H05K2201/0239 ,  H05K2201/0245

Abstract: This invention concerns a method of manufacturing printed wiring boards by electrolessly plating copper on a precatalyzed base material which contains a polymeric resin, woven glass cloth reinforcement and a noble metal catalyst on clay support to precatalyze the base material for electrolessly depositing copper. The improvement comprises providing in the polymeric resin, a phenolic resin component and a silicate filler. The silicate filler is present in an amount between 30 and 100 part per hundred parts of the polymeric resin, and in an amount sufficient to provide a take time for the initiation of electroless copper deposition at least two times faster than a comparable precatalyzed base material without the silicate filler and phenolic resin.

Abstract translation: 本发明涉及一种制造印刷线路板的方法，该方法是通过在含有聚合物树脂，织物玻璃织物增强物和贵金属催化剂的预催化基材上无电镀铜来预先沉积用于无电沉积铜的基底材料的铜。 该改进包括在聚合物树脂中提供酚醛树脂组分和硅酸盐填料。 硅酸盐填料以每100份聚合树脂30-100份的量存在，并且其用量足以提供无电沉积铜的起始时间至少比可比较的预分解基材快两倍，而没有 硅酸盐填料和酚醛树脂。

公开(公告)号：US5312576A

公开(公告)日：1994-05-17

申请号：US704983

申请日：1991-05-24

Applicant: Gwo S. Swei ,  David J. Arthur

Inventor： Gwo S. Swei ,  David J. Arthur

IPC: B29C41/28 ,  B29D7/01 ,  C08J3/00 ,  C08J3/215 ,  C08J9/26 ,  H05K1/03 ,  H05K1/05 ,  H05K3/38 ,  B29C39/00 ,  B32B27/00

CPC classification number: C08J9/26 ,  B29C41/28 ,  B29D7/01 ,  C08J3/005 ,  C08J3/215 ,  H05K1/034 ,  H05K1/0373 ,  B29K2027/18 ,  B29K2105/04 ,  B29K2105/16 ,  B29K2995/0006 ,  C08J2327/12 ,  H05K1/056 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0215 ,  H05K2201/0239 ,  H05K3/386 ,  Y02P20/582

Abstract: A method for making a particulate filled polymeric matrix composite film includes mixing a polymeric matrix material with a dispersion of particulate filler in a carrier liquid to form a casting composition and adjusting the viscosity of the casting composition to retard separation of the particulate filler from the composition. A layer of the viscosity-adjusted casting composition is cast on a substrate and the layer is consolidated to form the particulate filled polymer matrix composite film. Films made by the method include very thin, e.g. less than 1.0 mil, fluoropolymeric matrix films highly filled with very small diameter, preferably spherical, particles for use as, e.g. dielectric substrate materials in laminar electrical circuits.

Abstract translation: 制备颗粒填充的聚合物基质复合膜的方法包括将聚合物基体材料与颗粒填料的分散体混合在载体液体中以形成流延组合物并调节流延组合物的粘度以阻止颗粒填料与组合物的分离 。 将粘度调节的浇铸组合物的一层浇铸在基材上，并将该层固结以形成填充颗粒的聚合物基质复合膜。 通过该方法制成的膜包括非常薄的，例如 小于1.0密耳，高度填充有非常小直径的氟聚合物基质膜，优选为球形颗粒，用作例如。 层状电路中的电介质基片材料。

公开(公告)号：US5100722A

公开(公告)日：1992-03-31

申请号：US436488

申请日：1989-11-14

Applicant: Michio Nakamura ,  Hajime Takeuchi ,  Masahide Takahashi ,  Yasuki Matsuo ,  Hiromitu Kimura ,  Takumi Itani

Inventor： Michio Nakamura ,  Hajime Takeuchi ,  Masahide Takahashi ,  Yasuki Matsuo ,  Hiromitu Kimura ,  Takumi Itani

IPC: B32B17/04 ,  B32B27/04 ,  C08J5/08 ,  H05K1/03

CPC classification number: B32B17/04 ,  B32B27/04 ,  C08J5/08 ,  H05K1/0366 ,  C08J2327/12 ,  H05K2201/015 ,  H05K2201/0239 ,  Y10T428/3154 ,  Y10T428/31544 ,  Y10T442/3423 ,  Y10T442/3431 ,  Y10T442/475 ,  Y10T442/656

Abstract: A fiber-reinforced resin composite material suitable for printed circuit boards, etc., in which an inorganic fiber material is treated on its surface with a fluorosilane coupling agent and then impregnated with a fluororesin material.

Abstract translation: 一种适用于印刷电路板等的纤维增强树脂复合材料，其中无机纤维材料在其表面上用氟硅烷偶联剂处理，然后用氟树脂材料浸渍。

公开(公告)号：US4997702A

公开(公告)日：1991-03-05

申请号：US475454

申请日：1990-02-06

Applicant: Samuel Gazit ,  Gary W. Adams

Inventor： Samuel Gazit ,  Gary W. Adams

IPC: B32B27/20 ,  H05K1/00 ,  H05K1/03

CPC classification number: H05K1/0373 ,  B32B27/20 ,  H05K1/0366 ,  H05K1/0393 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0251 ,  H05K2201/0254 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2201/057 ,  H05K2201/068 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T442/2713

Abstract: A printed circuit board composed of an epoxy impregnated nonwoven web substrate laminated to electrically conductive sheets is presented. The printed circuit board is flexible in the sense that it can be bent to any desired multiplanar shape and will retain that shape after installation as required by electronic interconnection systems. The printed circuit board also has improved thermal properties achieved through the addition of up to 70% by weight of low coefficient of thermal expansion (CTE) particulate fillers and/or the use of thermally stable reinforcement fibers in the non-woven web.

Abstract translation: 提出了一种印刷电路板，其由层压在导电片上的环氧树脂浸渍非织造网基材组成。 印刷电路板的灵活性在于它可以弯曲成任何所需的多平面形状，并且在电气互连系统所要求的安装之后将保持该形状。 印刷电路板还具有通过添加高达70重量％的低热膨胀系数（CTE）颗粒填料和/或在无纺布网中使用热稳定的增强纤维而获得的改进的热性能。

公开(公告)号：US4923678A

公开(公告)日：1990-05-08

申请号：US309857

申请日：1989-02-14

Applicant: George M. Benedikt ,  Linwood P. Tenney

Inventor： George M. Benedikt ,  Linwood P. Tenney

IPC: B32B15/14 ,  C08J5/24 ,  H05K1/00 ,  H05K1/03 ,  H05K3/38

CPC classification number: H05K3/389 ,  B32B15/14 ,  C08J5/24 ,  H05K1/0353 ,  H05K1/0366 ,  H05K3/4676 ,  C08J2365/00 ,  H05K1/032 ,  H05K2201/0158 ,  H05K2201/0239 ,  H05K2201/0355 ,  H05K2203/0723 ,  Y10S428/901 ,  Y10T156/10 ,  Y10T428/12229 ,  Y10T428/12493 ,  Y10T428/24917 ,  Y10T428/26 ,  Y10T428/31504 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31786 ,  Y10T442/2418 ,  Y10T442/2459

Abstract: This invention provides improved prepregs for producing laminates and improved laminates using such prepregs. Processes for producing the prepregs and the laminates are also provided. Processes for producing the prepreg include the steps of providing a dipping solution or suspension comprising a polynorbornene polymer, a polyolefin polymer derived from C.sub.2 -C.sub.4 monomers, and a solvent followed by impregnating a non-cellulosic cloth with the solution. The solvent is removed from the cloth to form the prepreg. Printed circuit boards are also provided by a process which includes the steps of providing such a prepreg and pretreating the surface of a conductive film with a solution of a silane compound, effective to increase the bond strength between the copper foil and the prepreg, followed by laminating the prepreg to the conductive film.

Abstract translation: 本发明提供用于生产层压板的改进的预浸料和使用这种预浸料的改进的层压板。 还提供了制备预浸料和层压材料的方法。 用于生产预浸料的方法包括以下步骤：提供包含聚降冰片烯聚合物，衍生自C 2 -C 4单体的聚烯烃聚合物和溶剂，然后用该溶液浸渍非纤维素布的浸渍溶液或悬浮液。 将溶剂从布上除去以形成预浸料。 印刷电路板还通过一种方法提供，该方法包括以下步骤：提供这种预浸料，并用硅烷化合物溶液预处理导电膜的表面，有效地增加铜箔和预浸料之间的粘结强度， 将预浸料层压到导电膜上。

公开(公告)号：US4865910A

公开(公告)日：1989-09-12

申请号：US275226

申请日：1988-11-22

Applicant: Hirokazu Inoguchi ,  Shoichi Watanabe

Inventor： Hirokazu Inoguchi ,  Shoichi Watanabe

IPC: C03C25/10 ,  C03C25/40 ,  C07F7/18 ,  C08J5/08 ,  D06M13/02 ,  D06M13/50 ,  D06M13/51 ,  D06M13/513 ,  D06M13/517 ,  D06M101/00 ,  H05K1/03

CPC classification number: C08J5/08 ,  C03C25/40 ,  C07F7/1836 ,  H05K1/0366 ,  C08J2327/12 ,  H05K1/0373 ,  H05K2201/015 ,  H05K2201/0239 ,  Y10T428/2962 ,  Y10T428/2993 ,  Y10T428/31544 ,  Y10T428/31612 ,  Y10T428/31663 ,  Y10T442/2049 ,  Y10T442/2738

Abstract: Here is disclosed a glass fiber product for use in the reinforcement of fluororesin which is improved in the adhesiveness to fluororesin. Thus, a glass fiber product for use in the reinforcement of fluororesin pre-treated with perfluoroalkylsilane represented by the following formula:CF.sub.3 --CH.sub.2 --Ch.sub.2 --SiX.sub.3(X is a hydrolyzable group such as alkoxy groups having 1 to 4 carbon atoms) retains an excellent electrical insulation resistance.

Abstract translation: 这里公开了用于增强氟树脂的玻璃纤维产品，其提高了与氟树脂的粘附性。 因此，用于增强用下述通式表示的全氟烷基硅烷预处理的氟树脂的玻璃纤维产品：CF 3 -CH 2 -CH 2 -SiX 3（X是可水解基团，例如具有1至4个碳原子的烷氧基）保留了 优良的电绝缘电阻。

公开(公告)号：US4208005A

公开(公告)日：1980-06-17

申请号：US10026

申请日：1979-02-06

Applicant: Kazuo Nate ,  Kyoko Kotsuka ,  Tokio Isogai

Inventor： Kazuo Nate ,  Kyoko Kotsuka ,  Tokio Isogai

IPC: H05K3/34 ,  C08F290/14 ,  C09J4/00 ,  H01G2/06 ,  H05K1/02 ,  H05K3/30

CPC classification number: H01G2/065 ,  C08F290/14 ,  H05K3/30 ,  H05K3/305 ,  H05K1/0203 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49133 ,  Y10T29/49144

Abstract: One or more parts having terminals can be mounted on a circuit board by coating an ultraviolet-curing and thermosetting resin composition comprising an ultraviolet-curing resin, an addition polymerizable monomer, a photosensitizer and a heat polymerization initiator, on the circuit board by screen printing with a prescribed pattern, mounting the parts on the printed resin composition, curing the resin composition by simultaneous irradiation of ultraviolet light and heat rays so as to bond the parts to the circuit board, and soldering the parts onto the circuit board.

Abstract translation: 具有端子的一个或多个部件可以通过丝网印刷在电路板上涂覆包含紫外线固化树脂，加成聚合单体，光敏剂和热聚合引发剂的紫外线固化和热固性树脂组合物而安装在电路板上 以规定的图案，将部件安装在印刷的树脂组合物上，通过同时照射紫外线和热射线使树脂组合物固化，以将部件粘合到电路板上，并将部件焊接到电路板上。

公开(公告)号：US10005927B2

公开(公告)日：2018-06-26

申请号：US15258073

申请日：2016-09-07

Applicant: The Boeing Company

Inventor： Peter Babilo ,  Randall Jay Moss

IPC: C09J11/06 ,  C08K3/38 ,  C09J163/00 ,  H05K1/02 ,  H05K3/30 ,  B32B37/12 ,  B32B37/18 ,  C09K5/14 ,  C09J5/06 ,  C09J9/00 ,  B29C65/48 ,  C07F7/18 ,  C08K9/06 ,  B29K63/00 ,  B29K509/04 ,  B29L31/34

CPC classification number: C09J11/06 ,  B29C65/4855 ,  B29K2063/00 ,  B29K2509/04 ,  B29L2031/3406 ,  B32B37/1284 ,  B32B37/18 ,  B32B2037/1253 ,  B32B2457/00 ,  C07F7/1804 ,  C08K3/38 ,  C08K9/06 ,  C08K2003/382 ,  C09J5/06 ,  C09J9/00 ,  C09J163/00 ,  C09J2203/326 ,  C09J2463/00 ,  C09K5/14 ,  H05K1/0203 ,  H05K1/0209 ,  H05K3/305 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2203/12 ,  Y02P70/613 ,  C09J183/00

Abstract: Provided are methods of forming thermally conductive flexible bonds for use in electronic boards of unmanned spacecrafts and other types of aircraft. Also provided are methods of preparing adhesive materials to form these bonds including methods of preparing treated filler particles. In some aspects, an adhesive material includes filler particles having organofunctional groups, such as boron nitride particles treated in silane. These particles may be combined with a urethane modified epoxy to form the adhesive material. The weight ratio of the particles in the adhesive material may be about 40-60%. The adhesive material may be thermally cured using a temperature of less than 110° C. to prevent damage to bonded electronic components. The cured adhesive may have a thermal conductivity of at least about 2 W/m K measured in vacuum and may have a glass transition temperature if less than −40° C.

公开(公告)号：US09315673B2

公开(公告)日：2016-04-19

申请号：US13386201

申请日：2010-07-09

Applicant: Takahiro Matsumoto ,  Hirotaka Tsuruya ,  Hajime Ban ,  Reiki Akita

Inventor： Takahiro Matsumoto ,  Hirotaka Tsuruya ,  Hajime Ban ,  Reiki Akita

IPC: C08K5/56 ,  H01B1/04 ,  B82Y30/00 ,  C09C1/56 ,  C01B31/02 ,  C08K7/04 ,  C08K9/04 ,  H01B3/00 ,  H05K1/03

CPC classification number: C09C1/56 ,  B82Y30/00 ,  C01B32/05 ,  C01P2004/03 ,  C01P2004/16 ,  C01P2004/32 ,  C01P2004/64 ,  C01P2006/40 ,  C08K7/04 ,  C08K9/04 ,  H01B3/004 ,  H05K1/0373 ,  H05K2201/0239 ,  H05K2201/0323 ,  Y10T428/2982

Abstract: Provided are an insulated ultrafine powder obtained by adding liquid metal alkoxide to a methanol-containing organic solvent in which a conductive ultrafine powder comprising a carbon material is dispersed and further adding water thereto and a method for producing the same. Also, provided are an insulated ultrafine powder obtained by adding liquid metal alkoxide to a methanol-containing organic solvent in which a conductive ultrafine powder comprising a carbon material is dispersed, further adding a coupling agent having an alkoxide group and then adding water thereto and a method for producing the same. Further, provided is a high dielectric constant resin composite material obtained by blending the insulated ultrafine powder of the present invention with a resin in a volume ratio (insulated ultrafine powder/resin) falling in a range of 5/95 to 50/50.

Abstract translation: 提供一种通过将液体金属醇盐加入到其中分散有包含碳材料的导电超细粉末并进一步加入水的含甲醇的有机溶剂中获得的绝缘超微粉及其制备方法。 此外，提供了通过将液体金属醇盐添加到其中分散有包含碳材料的导电性超微粉末的含甲醇的有机溶剂中而进一步添加具有醇盐基团的偶联剂然后向其中加入水而获得的绝缘超细粉末， 其制造方法 此外，提供了通过将本发明的绝缘超细粉末与体积比（绝缘超细粉末/树脂）的树脂混合在5/95至50/50的范围内而获得的高介电常数树脂复合材料。