摘要:
A powder rapid prototyping method includes steps of forming a thin layer 35a of a powder material, irradiating a heating energy beam to a specific region of the thin layer 35a of the powder material to thereby form a preliminary heating layer 35c whose temperature is elevated, and irradiating the heating energy beam to an inside region of the preliminary heating layer 35c whose temperature is elevated to melt and then solidify the thin layer 35a of the powder material to thereby form a solidified layer, wherein the respective steps are repeatedly implemented to fabricate a rapid prototyping model 51, 52.
摘要:
Embodiments of the present invention are directed to nitride-based, red-emitting phosphors in red, green, and blue (RGB) lighting systems, which in turn may be used in backlighting displays and warm white-light applications. In particular embodiments, the red-emitting phosphor is based on CaAlSiN3 type compounds activated with divalent europium. In one embodiment, the nitride-based, red emitting compound contains a solid solution of calcium and strontium compounds (Ca,Sr)AlSiN3:Eu2+, wherein the impurity oxygen content is less than about 2 percent by weight. In another embodiment, the (Ca,Sr)AlSiN3:Eu2+ compounds further contains a halogen in an amount ranging from about zero to about 2 atomic percent, where the halogen may be fluorine (F), chlorine (Cl), or any combination thereof. In one embodiment at least half of the halogen is distributed on 2-fold coordinated nitrogen (N2) sites relative to 3-fold coordinated nitrogen (N3) sites.
摘要:
A method for producing transparent ceramic objects having an RIT>10% in the wave length range of 300 nm to 4000 nm and a wall thickness of 2 mm. Said method consists of the following steps: producing a slip by dispersing a ceramic powder, the particle size of which is d50
摘要:
The invention pertains to hardware such as cutting tools with improved performance, wear-resistance and durability made from sintered polycrystalline aluminum nitride based ceramic composites containing secondary or dispersed phases for enhanced toughness. The articles of this invention provide good hardness, toughness, chemical inertness, thermal stability, lubricity, wear-resistance, and the ability to operate in the presence of liquid coolants, yielding good surface finish and long lifetime. The cutting tools of this invention are applicable to a wide range of industrial, biomedical, commercial and other applications.
摘要:
The invention relates to a white emitting light source with an improved luminescent material of the formula (AEN2/3)*b (MN)*c (SiN4/3)*d1 CeO3/2*d2 EuO*x SiO2*y AlO3/2 wherein AE is an alkaline earth metal chosen of the group of Ca, Mg, Sr and Ba or mixtures thereof and M is a trivalent element chosen of the group of Al, B, Ga, Sc with d1>10*d2. In combination with a UV to blue light generating device this material leads to an improved light quality and stability, especially an improved temperature stability for a wide range of applications.
摘要:
A plasma-resistant member according to the present invention includes a base member formed of a silicon nitride sintered body, an aluminum nitride sintered body, an alumina sintered body, or a silicon carbide sintered body; and a thin film formed on a surface of the base member and composed of an yttrium compound or a spinel, wherein the thin film has, in a surface of the thin film, a plurality of projections for supporting a wafer, and a ratio a2/a1 of a film thickness a2 of portions of the thin film that include the projections to a film thickness a1 of portions of the thin film that do not include the projections satisfies 1
摘要:
The present invention provides an aluminum nitride substrate and an aluminum nitride circuit board having excellent insulation characteristics and heat dissipation properties and having high strength, a semiconductor apparatus, and a method for manufacturing an aluminum nitride substrate.An aluminum nitride substrate according to the present invention is an aluminum nitride substrate having aluminum nitride as a main component and comprising a polycrystal containing a plurality of aluminum nitride grains, and complex oxide grains being present at grain boundaries of the aluminum nitride grains and including a rare earth element and aluminum, wherein the aluminum nitride grains have a maximum grain size of 10 μm or less, the complex oxide grains have a maximum grain size smaller than the maximum grain size of the aluminum nitride grains, the number of the complex oxide grains having a grain size of 1 μm or more being present in a field of view of 100 μm×100 μm of a surface of the aluminum nitride substrate observed is 40 or more, the aluminum nitride substrate has a bending strength of 400 MPa or more in an unpolished state after firing, and the aluminum nitride substrate has a volume resistivity of 1012 Ωm or more.
摘要:
An easily-administered technology which demonstrates the intrinsic thermal conductivity improvement effect by addition of non-oxide system compound crystal phase (filler particles) and makes it possible to sufficiently raise the thermal conductivity of a glass-ceramics composite material is provided. In the glass phase which constitutes a glass-ceramics composite material, the quantity of aluminum oxide (Al2O3) component is increased under a condition where at least either of zinc oxide (ZnO) component or magnesium oxide (MgO) component exists in a predetermined quantity or more. Thereby, the unintended reaction between a non-oxide system compound crystal phase and a glass phase can be suppressed, and the intrinsic thermal conductivity improvement effect by addition of non-oxide system compound crystal phase (filler particles) can be demonstrated.
摘要:
Disclosed are methods and materials useful in the preparation of semiconductor devices. In particular embodiments, disclosed are methods for engineering polycrystalline aluminum nitride substrates that are thermally matched to further materials that can be combined therewith. For example, the polycrystalline aluminum nitride substrates can be engineered to have a coefficient of thermal expansion (CTE) that is closely matched to the CTE of a semiconductor material and/or to a material that can be used as a growth substrate for a semiconductor material. The invention also encompasses devices incorporating such thermally engineered substrates and semiconductor materials grown using such thermally engineered substrates. The thermally engineered substrates are advantageous for overcoming problems caused by damage arising from CTE mismatch between component layers in semiconductor preparation methods and materials.
摘要:
A method for making a treated super-hard structure, the method including providing a super-hard structure comprising super-hard material selected from polycrystalline cubic boron nitride (PCBN) material or thermally stable polycrystalline diamond (PCD) material; subjecting the super-hard structure to heat treatment at a treatment temperature of greater than 700 degrees centigrade at a treatment pressure at which the super-hard material is not thermodynamically stable, for a treatment period of at least about 5 minutes to produce the treated super-hard structure.