公开(公告)号：US09202748B2

公开(公告)日：2015-12-01

申请号：US14039793

申请日：2013-09-27

申请人： SKYWORKS SOLUTIONS, INC.

发明人： Anthony James LoBianco ,  Hoang Mong Nguyen

IPC分类号： H01L23/552 ,  H01L21/768 ,  H01L23/00 ,  H01L21/56 ,  H01L23/538

CPC分类号： H01L23/552 ,  H01L21/56 ,  H01L21/561 ,  H01L21/76838 ,  H01L23/49838 ,  H01L23/538 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L25/16 ,  H01L2223/6611 ,  H01L2223/6677 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48105 ,  H01L2224/48175 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/141 ,  H01L2924/15192 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  H05K1/0216 ,  H05K1/0218 ,  H05K1/185 ,  H05K9/00 ,  H05K9/0088 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A radio frequency (RF) module comprises an electrical reference, or ground, plane to which one or more RF devices disposed on the module are electrically coupled, and may be disposed beneath the RF devices. The reference plane may be segmented as to form one or more segments of the reference plane that are at least partially electrically isolated from surrounding segments or devices. A module may have a plurality of devices disposed thereon, wherein separate, at least partially isolated reference planes, correspond to different devices of the module. The reference plane may be etched or cut to achieve such segmentation.

摘要翻译： 射频（RF）模块包括电参考或接地平面，一个或多个设置在该模块上的RF器件电耦合到该平面，并且可以设置在RF器件的下方。 参考平面可以被分段成形成至少部分地与周围段或装置电隔离的参考平面的一个或多个段。 模块可以具有设置在其上的多个设备，其中分离的至少部分隔离的参考平面对应于模块的不同设备。 可以蚀刻或切割参考平面以实现这种分割。

公开(公告)号：US20150326183A1

公开(公告)日：2015-11-12

申请号：US14686666

申请日：2015-04-14

申请人： SKYWORKS SOLUTIONS, INC.

发明人： Howard E. Chen ,  Yifan Guo ,  Dinhphuoc Vu Hoang ,  Mehran Janani ,  Tin Myint Ko ,  Philip John Lehtola ,  Anthony James LoBianco ,  Hardik Bhupendra Modi ,  Hoang Mong Nguyen ,  Matthew Thomas Ozalas ,  Sandra Louise Petty-Weeks ,  Matthew Sean Read ,  Jens Albrecht Riege ,  David Steven Ripley ,  Hongxiao Shao ,  Hong Shen ,  Weimin Sun ,  Hsiang-Chih Sun ,  Patrick Lawrence Welch ,  Peter J. Zampardi, JR. ,  Guohao Zhang

IPC分类号： H03F1/02 ,  H03F3/21 ,  H03F3/19

CPC分类号： H03F1/0205 ,  H01L21/485 ,  H01L21/4853 ,  H01L21/4864 ,  H01L21/565 ,  H01L21/76898 ,  H01L21/78 ,  H01L21/8249 ,  H01L21/8252 ,  H01L22/14 ,  H01L23/3114 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49844 ,  H01L23/49861 ,  H01L23/49866 ,  H01L23/49894 ,  H01L23/50 ,  H01L23/522 ,  H01L23/552 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L24/97 ,  H01L27/0605 ,  H01L27/0623 ,  H01L27/092 ,  H01L29/0684 ,  H01L29/0821 ,  H01L29/0826 ,  H01L29/1004 ,  H01L29/20 ,  H01L29/205 ,  H01L29/36 ,  H01L29/66242 ,  H01L29/66863 ,  H01L29/737 ,  H01L29/7371 ,  H01L29/812 ,  H01L29/8605 ,  H01L2223/6611 ,  H01L2223/6616 ,  H01L2223/6644 ,  H01L2223/665 ,  H01L2223/6655 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05554 ,  H01L2224/05644 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48177 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48611 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/48664 ,  H01L2224/48811 ,  H01L2224/48816 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48855 ,  H01L2224/48864 ,  H01L2224/4903 ,  H01L2224/49111 ,  H01L2224/49176 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85411 ,  H01L2224/85416 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2924/00011 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12033 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13051 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/1421 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/3025 ,  H03F1/565 ,  H03F3/187 ,  H03F3/19 ,  H03F3/195 ,  H03F3/21 ,  H03F3/213 ,  H03F3/245 ,  H03F3/347 ,  H03F3/45 ,  H03F3/60 ,  H03F2200/387 ,  H03F2200/451 ,  H03F2200/48 ,  H03F2200/555 ,  H01L2924/00 ,  H01L2924/00014

摘要： One aspect of this disclosure is a power amplifier module that includes a power amplifier die including a power amplifier configured to amplify a radio frequency (RF) signal, the power amplifier including a heterojunction bipolar transistor (HBT) and a p-type field effect transistor (PFET), the PFET including a semiconductor segment that includes substantially the same material as a layer of a collector of the HBT, the semiconductor segment corresponding to a channel of the PFET; a load line electrically connected to an output of the power amplifier and configured to provide impedance matching at a fundamental frequency of the RF signal; and a harmonic termination circuit electrically connected to the output of the power amplifier and configured to terminate at a phase corresponding to a harmonic frequency of the RF signal. Other embodiments of the module are provided along with related methods and components thereof.

摘要翻译： 本公开的一个方面是功率放大器模块，其包括功率放大器管芯，功率放大器管芯包括被配置为放大射频（RF）信号的功率放大器，功率放大器包括异质结双极晶体管（HBT）和p型场效应晶体管 （PFET），所述PFET包括半导体段，所述半导体段包括与所述HBT的集电极基本相同的材料，所述半导体段对应于所述PFET的沟道; 电连接到所述功率放大器的输出并被配置为在所述RF信号的基频处提供阻抗匹配的负载线; 以及谐波终端电路，其电连接到所述功率放大器的输出并且被配置为在与所述RF信号的谐波频率相对应的相位处终止。 模块的其他实施例与其相关方法和组件一起提供。

公开(公告)号：US20140175622A1

公开(公告)日：2014-06-26

申请号：US14039791

申请日：2013-09-27

申请人： Skyworks Solutions, Inc.

发明人： Howard E. Chen ,  Matthew Sean Read ,  Anthony James LoBianco ,  Hoang Mong Nguyen ,  Guohao Zhang ,  Dinhphuoc Vu Hoang

IPC分类号： H01L23/552 ,  H01L21/56

CPC分类号： H01L23/552 ,  H01L21/56 ,  H01L21/561 ,  H01L21/76838 ,  H01L23/49838 ,  H01L23/538 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L25/16 ,  H01L2223/6611 ,  H01L2223/6677 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48105 ,  H01L2224/48175 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/141 ,  H01L2924/15192 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  H05K1/0216 ,  H05K1/0218 ,  H05K1/185 ,  H05K9/00 ,  H05K9/0088 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A radio frequency (RF) module comprises a conductive top layer configured to improve RF interference-shielding functionality with respect to one or more RF devices disposed on the module. The conductive top layer may be segmented as to form one or more segments of the top layer that are at least partially electrically isolated from surrounding segments or devices. A module may have a plurality of devices disposed thereon, wherein separate, at least partially isolated, top conductive layers correspond to different devices of the module. The top layer may be etched or cut to achieve such segmentation.

摘要翻译： 射频（RF）模块包括被配置为相对于设置在模块上的一个或多个RF设备来改善RF干扰屏蔽功能的导电顶层。 导电顶层可以被分段成形成至少部分地与周围段或设备电隔离的顶层的一个或多个段。 模块可以具有设置在其上的多个装置，其中分离的，至少部分隔离的顶部导电层对应于模块的不同装置。 可以蚀刻或切割顶层以实现这种分割。

公开(公告)号：US20140016277A1

公开(公告)日：2014-01-16

申请号：US13939066

申请日：2013-07-10

申请人： Skyworks Solutions, Inc.

发明人： Howard E. Chen ,  Matthew Sean Read ,  Hoang Mong Nguyen ,  Anthony James LoBianco ,  Guohao Zhang ,  Dinhphuoc Vu Hoang

IPC分类号： H05K1/18 ,  G06F17/50

CPC分类号： G06F17/5072 ,  H01L21/561 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/552 ,  H01L23/585 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2223/6611 ,  H01L2223/6616 ,  H01L2223/6644 ,  H01L2223/6677 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/1531 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K1/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Aspects of the present disclosure relate to determining a layout of a racetrack that forms part of an RF isolation structure of a packaged module and the resulting RF isolation structures. Locations of where the racetrack can be adjusted (for example, narrowed) and/or removed without significantly degrading the EMI performance of the RF isolation structure can be identified. In certain embodiments, a portion of the racetrack can be removed to create a break and/or a portion of the racetrack can be narrowed in a selected area.

摘要翻译： 本公开的方面涉及确定构成封装模块的RF隔离结构的一部分的跑道的布局以及所得到的RF隔离结构。 可以识别可以调整（例如，变窄）和/或移除赛道的位置，而不会显着降低RF隔离结构的EMI性能。 在某些实施例中，可以移除跑道的一部分以产生断路，和/或可以在选定的区域中使跑道的一部分变窄。

公开(公告)号：US20240363509A1

公开(公告)日：2024-10-31

申请号：US18645076

申请日：2024-04-24

申请人： Skyworks Solutions, Inc.

发明人： Yi Liu ,  Ki Wook Lee ,  Chien Jen Wang ,  Shaul Branchevsky ,  Anthony James LoBianco ,  Reza Kasnavi

IPC分类号： H01L23/498 ,  H01L23/31

CPC分类号： H01L23/49811 ,  H01L23/3121 ,  H01L23/49838

摘要： A molded package module has a substrate, and multiple interconnect members attached to a bottom side of the substrate. A mold surrounds and extends between the interconnect members. The interconnect members can be electrically and thermally conductive and include a first post portion adjacent the substrate and a second portion adjacent the first post portion so that the first post portion is interposed between the second portion and the substrate. The second portion includes a solderable material. The molded package module can be mounted via a solderable surface at a distal end of the second portion to a motherboard.

公开(公告)号：US11682649B2

公开(公告)日：2023-06-20

申请号：US17240661

申请日：2021-04-26

申请人： Skyworks Solutions, Inc.

发明人： Gregory Edward Babcock ,  Lori Ann DeOrio ,  Darren Roger Frenette ,  George Khoury ,  Anthony James LoBianco ,  Hoang Mong Nguyen ,  Leslie Paul Wallis

IPC分类号： H01L23/552 ,  H01L23/00 ,  H01L23/66 ,  H04B1/40 ,  H01L25/18 ,  H01L23/498 ,  H01L23/13

CPC分类号： H01L24/73 ,  H01L23/552 ,  H01L23/66 ,  H01L24/48 ,  H01L25/18 ,  H04B1/40 ,  H01L23/13 ,  H01L23/49805 ,  H01L2223/6677 ,  H01L2224/48227 ,  H01L2224/73257 ,  H01L2924/00014 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/45099

摘要： Packaged modules for use in wireless devices are disclosed. A substrate supports integrated circuit die including at least a portion of a baseband system and a front end system, an oscillator assembly, and an antenna. The oscillator assembly includes an enclosure to enclose the oscillator and conductive pillars formed at least partially within a side of the enclosure to conduct signals between the top and bottom surfaces of the oscillator assembly. Components can be vertically integrated to save space and reduce trace length. Vertical integration provides an overhang volume that can include discrete components. Radio frequency shielding and ground planes within the substrate shield the front end system and antenna from radio frequency interference. Stacked filter assemblies include passive surface mount devices to filter radio frequency signals.

公开(公告)号：US20230115846A1

公开(公告)日：2023-04-13

申请号：US17504911

申请日：2021-10-19

申请人： Skyworks Solutions, Inc.

发明人： Hoang Mong Nguyen ,  Anthony James LoBianco ,  Howard E. Chen ,  Ki Wook Lee ,  Yi Liu

IPC分类号： H01L23/498 ,  H01L21/56 ,  H01L21/48 ,  H01L23/31 ,  H01L25/10 ,  H01L25/00

摘要： An electronic package is provided. The electronic package comprises a substrate having a first side and a second side, the substrate configured to receive one or more electronic components; a first electronic component mounted to the first side of the substrate; a first mold structure extending over at least part of the first side of the substrate; a group of through-mold connections provided on the first side of the substrate, the through-mold connections substantially formed of non-reflowable electrically conductive material; the first mold structure substantially encapsulating the group of through-mold connections; the group of through-mold connections exposed through the first mold structure. An electronic device comprising such an electronic package is also provided. A method of manufacturing such an electronic package is also provided.

公开(公告)号：US20210217714A1

公开(公告)日：2021-07-15

申请号：US17216302

申请日：2021-03-29

申请人： SKYWORKS SOLUTIONS, INC.

发明人： Yasser Khairat Soliman ,  Hoang Mong Nguyen ,  Anthony James LoBianco ,  Gregory Edward Babcock ,  Darren Roger Frenette ,  George Khoury ,  René Rodríguez ,  Leslie Paul Wallis

IPC分类号： H01L23/66 ,  H03F3/24 ,  H03F1/32 ,  H01L23/552 ,  H04B1/40 ,  H03F3/195 ,  H03F1/22 ,  H03F1/34 ,  H03F1/56 ,  H04B1/04 ,  H05B47/19 ,  F21V23/00

摘要： Front end systems and related devices, integrated circuits, modules, and methods are disclosed. One such packaged module includes a multi-mode power amplifier circuit in an interior of a radio frequency shielding structure and an antenna external to the radio frequency shielding structure. The multi-mode power amplifier circuit includes a stacked output stage including a transistor stack of two or more transistors. The multi-mode power amplifier circuit also includes a bias circuit configured to control a bias of at least one transistor of the transistor stack based on a mode of the multi-mode power amplifier circuit. The radio frequency shielding structure can extend above a package substrate. The antenna can be on the package substrate. Other embodiments of front end systems are disclosed, along with related devices, integrated circuits, modules, methods, and components thereof.

公开(公告)号：US10579766B2

公开(公告)日：2020-03-03

申请号：US16267914

申请日：2019-02-05

申请人： Skyworks Solutions, Inc.

发明人： Howard E. Chen ,  Matthew Sean Read ,  Hoang Mong Nguyen ,  Anthony James LoBianco ,  Guohao Zhang ,  Dinhphuoc Vu Hoang

IPC分类号： H01L21/44 ,  H01L21/56 ,  H01L23/31 ,  H01L23/66 ,  H01L23/552 ,  G06F17/50 ,  H05K1/18 ,  H01L23/00 ,  H01L23/498 ,  H01L23/58

摘要： Aspects of the present disclosure relate to a packaged module with a radio frequency isolation structure that includes a racetrack, a conductive layer, and a conductive feature in an electrical path between the racetrack and the conductive layer. The racetrack can be disposed in a substrate and configured at a ground potential. The racetrack can include a break.

公开(公告)号：US20190171785A1

公开(公告)日：2019-06-06

申请号：US16267914

申请日：2019-02-05

申请人： Skyworks Solutions, Inc.

发明人： Howard E. Chen ,  Matthew Sean Read ,  Hoang Mong Nguyen ,  Anthony James LoBianco ,  Guohao Zhang ,  Dinhphuoc Vu Hoang

IPC分类号： G06F17/50 ,  H01L23/66 ,  H01L23/58 ,  H01L21/56 ,  H01L23/00 ,  H01L23/498 ,  H01L23/552 ,  H05K1/18

摘要： Aspects of the present disclosure relate to a packaged module with a radio frequency isolation structure that includes a racetrack, a conductive layer, and a conductive feature in an electrical path between the racetrack and the conductive layer. The racetrack can be disposed in a substrate and configured at a ground potential. The racetrack can include a break.