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31.发明申请公开(公告)号：US20180166403A1
公开(公告)日：2018-06-14
申请号：US15889852
申请日：2018-02-06
IPC分类号： H01L23/64 , H01L21/768 , H01L21/50 , H01L49/02 , H01L21/441 , H01L23/495
CPC分类号： H01L23/642 , H01L21/441 , H01L21/50 , H01L21/561 , H01L21/768 , H01L23/3128 , H01L23/48 , H01L23/49537 , H01L23/49551 , H01L23/49575 , H01L23/49805 , H01L23/49822 , H01L23/5385 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/97 , H01L25/105 , H01L28/40 , H01L2224/2919 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49109 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/181 , H01L2224/45099 , H01L2924/00012 , H01L2924/07802 , H01L2924/00
摘要： A packaged semiconductor device includes an insulating material forming a side surface of the packaged semiconductor device. An integrated-circuit chip is embedded in the insulating material and includes a communication circuit. A wiring system is embedded in the insulating material and electrically couples the integrated-circuit chip with a plurality of package contact elements. A first communication pad is formed in the side surface and is operatively coupled to the communication circuit to enable signal exchange through the first communication pad.
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公开(公告)号：US09997438B2
公开(公告)日：2018-06-12
申请号：US15631579
申请日：2017-06-23
发明人： Fabio Marchisi
CPC分类号： H01L23/49537 , H01L21/4821 , H01L21/56 , H01L21/76885 , H01L23/3107 , H01L23/3114 , H01L23/49503 , H01L23/4952 , H01L23/49541 , H01L23/49548 , H01L23/49558 , H01L23/49582 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/45144 , H01L2224/48247 , H01L2224/48465 , H01L2224/49109 , H01L2224/49111 , H01L2224/49112 , H01L2224/49431 , H01L2224/49433 , H01L2924/00014 , H01L2224/05599 , H01L2924/00
摘要： An electronic component, in one embodiment, includes a semiconductor die, a die pad supporting the semiconductor die, and a plurality of leads that include a first set of metal lines and a second set of metal lines. The first set of metal lines cross over the second set of metal lines at crossings. The first set of metal lines is separated by a molding compound from the second set of metal line at the crossings. The first set of metal lines is in a same first plane parallel to the semiconductor die. Each of the second set of metal lines include a first portion oriented along the first set of metal lines and disposed in the first plane, and a second portion offset from the first portion. A plurality of electrical connections couple the semiconductor die to the plurality of leads.
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公开(公告)号：US09991229B2
公开(公告)日：2018-06-05
申请号：US14820282
申请日：2015-08-06
发明人： Yoshihiko Shimanuki
IPC分类号： H01R9/00 , H01L25/065 , H01L23/00 , H01L23/498 , H01L23/31
CPC分类号： H01L24/85 , H01L21/561 , H01L21/6835 , H01L23/3128 , H01L23/544 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/78 , H01L24/97 , H01L25/0657 , H01L2221/68331 , H01L2223/5442 , H01L2223/54486 , H01L2224/05554 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/45147 , H01L2224/4809 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/48228 , H01L2224/48465 , H01L2224/48471 , H01L2224/48475 , H01L2224/48479 , H01L2224/48499 , H01L2224/48599 , H01L2224/4911 , H01L2224/49171 , H01L2224/49429 , H01L2224/73265 , H01L2224/78301 , H01L2224/78302 , H01L2224/85001 , H01L2224/85009 , H01L2224/85051 , H01L2224/8518 , H01L2224/85186 , H01L2224/85205 , H01L2224/85986 , H01L2224/92 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2924/00011 , H01L2924/00014 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/01079 , H01L2224/85 , H01L2224/83 , H01L2924/01013 , H01L2224/92247 , H01L2924/00 , H01L2924/00012 , H01L2924/01006 , H01L2224/4554 , H01L2224/85399 , H01L2224/05599
摘要： A semiconductor device including a package substrate having, at the periphery of the main surface thereof, bonding leads disposed in a row, a semiconductor chip mounted inside of the row of the bonding leads on the main surface of the package substrate, wires for connecting pads of the semiconductor chip and the bonding leads of the substrate, a sealing body for resin sealing the semiconductor chip and the wires, and solder bumps disposed on the back surface of the package substrate. The top of a loop of each of the wires is disposed outside the wire connecting portion so that the wire connection between the bonding leads and the pads of the semiconductor chip has a stable loop shape to prevent wire connection failure.
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公开(公告)号：US09991221B2
公开(公告)日：2018-06-05
申请号：US15782182
申请日：2017-10-12
发明人： Jun Yamada , Takafumi Betsui
IPC分类号： H05K7/10 , H05K7/12 , H01L23/00 , H01L25/065 , H01L23/538 , H01L23/498 , H01L23/48 , H01L23/14 , H01L23/31 , H05K3/32
CPC分类号： H01L24/33 , H01L23/145 , H01L23/31 , H01L23/3128 , H01L23/481 , H01L23/49822 , H01L23/49827 , H01L23/49894 , H01L23/5383 , H01L23/5384 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/065 , H01L2224/0401 , H01L2224/04042 , H01L2224/05009 , H01L2224/05022 , H01L2224/05027 , H01L2224/05124 , H01L2224/05554 , H01L2224/05567 , H01L2224/05568 , H01L2224/0557 , H01L2224/05572 , H01L2224/05573 , H01L2224/05611 , H01L2224/05624 , H01L2224/13009 , H01L2224/13147 , H01L2224/1329 , H01L2224/133 , H01L2224/13564 , H01L2224/13565 , H01L2224/13578 , H01L2224/13611 , H01L2224/13686 , H01L2224/16146 , H01L2224/16237 , H01L2224/16238 , H01L2224/2929 , H01L2224/293 , H01L2224/32145 , H01L2224/32225 , H01L2224/335 , H01L2224/33515 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45164 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/49 , H01L2224/73203 , H01L2224/73204 , H01L2224/73207 , H01L2224/73215 , H01L2224/73257 , H01L2224/73265 , H01L2924/13091 , H01L2924/15333 , H01L2924/15788 , H01L2924/1579 , H01L2924/181 , H05K3/323 , H01L2924/00 , H01L2924/00014 , H01L2924/00012 , H01L2924/04941
摘要： A semiconductor integrated circuit chip, in which multi-core processors are integrated, is usually mounted over an organic wiring board by FC bonding to form a BGA package by being integrated with the substrate. In such a structure, power consumption is increased, and hence the power supplied only from a peripheral portion of the chip is insufficient, so that a power supply pad is also provided in the chip central portion. However, because of an increase in the wiring associated with the integration of a plurality of CPU cores, etc., there occurs a portion between the peripheral portion and the central portion of the chip, where a power supply pad cannot be arranged. According to the outline of the present application, in a semiconductor integrated circuit device such as a BGA, etc., in which a semiconductor chip is mounted over an interposer, such as a multilayer organic wiring board, in a face-up manner, a first group of metal through electrodes, which are provided in the semiconductor chip to supply a power supply potential to a core circuit, etc., and a first metal land over the interposer are interconnected by a first conductive adhesive member film.
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公开(公告)号：US20180151467A1
公开(公告)日：2018-05-31
申请号：US15361403
申请日：2016-11-26
IPC分类号： H01L23/367 , H01L23/31 , H01L23/522 , H01L23/528 , H01L23/373 , H01L23/00 , H01L21/56 , H01L21/48 , H01L21/02
CPC分类号： H01L21/02354 , H01L21/02288 , H01L21/56 , H01L23/3121 , H01L23/34 , H01L23/3677 , H01L23/373 , H01L23/3737 , H01L23/4334 , H01L23/5226 , H01L23/5283 , H01L24/13 , H01L24/16 , H01L24/48 , H01L24/73 , H01L2224/0401 , H01L2224/04042 , H01L2224/131 , H01L2224/16227 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2924/10253 , H01L2924/1033 , H01L2924/14 , H01L2924/15313 , H01L2924/014 , H01L2924/00014 , H01L2224/32245 , H01L2924/00012 , H01L2924/00
摘要： A packaged electronic device includes an integrated circuit and an electrically non-conductive encapsulation material in contact with the integrated circuit. A thermal conduit extends from an exterior of the package, through the encapsulation material, to the integrated circuit. The thermal conduit has a thermal conductivity higher than the encapsulation material contacting the thermal conduit. The thermal conduit includes a cohered nanoparticle film. The cohered nanoparticle film is formed by a method which includes an additive process.
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公开(公告)号：US20180127267A1
公开(公告)日：2018-05-10
申请号：US15864787
申请日：2018-01-08
发明人： Bernhard Winkler , Rainer Leuschner , Horst Theuss
CPC分类号： B81B7/0058 , B81B2201/025 , B81B2201/0264 , B81B2207/012 , B81B2207/015 , B81C2203/0154 , G01L9/0054 , G01L15/00 , G01L19/141 , G01L19/148 , H01L29/84 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48465 , H01L2924/1461 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： Embodiments relate to sensor and sensing devices, systems and methods. In an embodiment, a micro-electromechanical system (MEMS) device comprises at least one sensor element; a framing element disposed around the at least one sensor element; at least one port defined by the framing element, the at least one port configured to expose at least a portion of the at least one sensor element to an ambient environment; and a thin layer disposed in the at least one port.
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公开(公告)号：US09966517B2
公开(公告)日：2018-05-08
申请号：US14965083
申请日：2015-12-10
发明人： Kazunori Oda , Akira Sakamoto , Yoshinori Murata , Kenzaburo Kawai , Koichi Suzuki , Megumi Oishi
IPC分类号： H01L33/00 , H01L33/62 , H01L23/495 , H01L33/52 , H01L21/48 , H01L21/56 , H01L21/683 , H01L33/48 , H01L33/60 , H01L23/31 , H01L33/56 , H01L23/498 , H01L23/00
CPC分类号： H01L21/6835 , H01L23/3121 , H01L23/49582 , H01L23/49861 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/81 , H01L24/83 , H01L24/85 , H01L24/97 , H01L33/486 , H01L33/60 , H01L33/62 , H01L2224/131 , H01L2224/13144 , H01L2224/16225 , H01L2224/16245 , H01L2224/29101 , H01L2224/2919 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48245 , H01L2224/48247 , H01L2224/48465 , H01L2224/48599 , H01L2224/48639 , H01L2224/48644 , H01L2224/48669 , H01L2224/73265 , H01L2224/83 , H01L2224/85439 , H01L2224/85444 , H01L2224/85469 , H01L2224/92247 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01072 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/078 , H01L2924/10329 , H01L2924/12041 , H01L2924/15747 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2224/85 , H01L2224/81 , H01L2924/00 , H01L2924/3512 , H01L2924/00012
摘要： An LED leadframe or LED substrate includes a main body portion having a mounting surface for mounting an LED element thereover. A reflection metal layer serving as a reflection layer for reflecting light from the LED element is disposed over the mounting surface of the main body portion. The reflection metal layer comprises an alloy of platinum and silver or an alloy of gold and silver. The reflection metal layer efficiently reflects light emitted from the LED element and suppresses corrosion due to the presence of a gas, thereby capable of maintaining reflection characteristics of light from the LED element.
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公开(公告)号：US09966504B2
公开(公告)日：2018-05-08
申请号：US15651492
申请日：2017-07-17
发明人： Masahiro Konishi , Makoto Agatani , Toshio Hata
IPC分类号： H01L33/50 , F21K99/00 , H01L33/62 , H01L33/36 , F21V23/00 , H01L33/38 , H01L33/32 , F21K9/20 , H01L25/075 , H01L33/56 , H01L33/60 , F21K9/00 , H01L33/64 , F21Y115/10 , F21Y105/10 , F21K9/232 , H01L23/00 , F21Y101/00
CPC分类号： H01L33/502 , F21K9/00 , F21K9/20 , F21K9/232 , F21V23/002 , F21Y2101/00 , F21Y2105/10 , F21Y2115/10 , H01L24/45 , H01L25/0753 , H01L33/32 , H01L33/36 , H01L33/38 , H01L33/56 , H01L33/60 , H01L33/62 , H01L33/641 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45169 , H01L2224/48091 , H01L2224/48465 , H01L2224/73265 , H01L2924/01015 , H01L2924/01047 , H01L2924/01068 , H01L2924/01087 , H01L2924/09701 , H01L2924/12041 , H01L2924/181 , H01L2924/3011 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： By using a light emitting device including an insulating substrate and a light emitting unit formed on the insulating substrate, the light emitting unit including: a plurality of linear wiring patterns disposed on the insulating substrate in parallel with one another, a plurality of light emitting elements that are mounted between the wiring patterns while being electrically connected to the wiring patterns, and a sealing member for sealing the light emitting elements, as well as a method for manufacturing thereof, it becomes possible to provide a light emitting device that achieves sufficient electrical insulation and has simple manufacturing processes so that it can be manufactured at a low cost, and a method for manufacturing the same.
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公开(公告)号：US09966329B2
公开(公告)日：2018-05-08
申请号：US15660294
申请日：2017-07-26
发明人： Fukumi Shimizu , Haruhiko Harada
CPC分类号： H01L23/49568 , H01L21/4842 , H01L21/561 , H01L21/565 , H01L21/67115 , H01L21/67126 , H01L21/67253 , H01L22/12 , H01L23/49503 , H01L23/49537 , H01L23/49541 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/92 , H01L24/97 , H01L2224/05554 , H01L2224/32245 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2224/92247 , H01L2924/15747 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： Reliability of a semiconductor device is improved. A method for manufacturing the semiconductor device includes the steps of: providing a lead frame having a semiconductor chip mounted thereon; providing a heat radiating frame having a heat radiating plate; and resin sealing the semiconductor chip and the heat radiating plate with the lead frame and the heat radiating frame in a stacked state. The method further includes the steps of: separating a frame body of the heat radiating frame from the lead frame having a sealing body; and applying an inspection to detect resin-unfilled regions to the lead frame having the sealing body. Since the frame body of the heat radiating frame shielding an inspection region is removed before the inspection, it becomes possible to perform the inspection using transmitted light.
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公开(公告)号：US09960055B1
公开(公告)日：2018-05-01
申请号：US15857138
申请日：2017-12-28
发明人： Haruhiko Harada
IPC分类号： H01L21/56 , H01L23/00 , B29C45/02 , B29C45/40 , B29C45/14 , H01L23/31 , H01L23/29 , B29K105/00
CPC分类号： H01L21/565 , B29C45/02 , B29C45/14655 , B29C45/4005 , B29K2105/255 , H01L21/561 , H01L23/295 , H01L23/3128 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/85 , H01L24/92 , H01L24/97 , H01L2224/04042 , H01L2224/32225 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/83 , H01L2224/85203 , H01L2224/85205 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/15184 , H01L2924/15311 , H01L2924/181 , H01L2924/00012 , H01L2224/85 , H01L2924/00
摘要： In a mold die, a tip-end surface of each push-up pin provided on the rear surface side of a lower die cavity block and a part of the rear surface of the lower die cavity block with which the tip-end surface of each push-up pin is contacted are inclined in such a manner that a distance to a top surface of the lower die cavity block becomes longer towards the pot side where mold resin is supplied. When the lower die cavity block is returned to the initial position, the lower die cavity block is lifted while being slightly moved towards the pot block side. No gap is formed between a side surface of the pot block and a side surface of the lower die cavity block.
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