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1.发明授权公开(公告)号：US10359181B2
公开(公告)日：2019-07-23
申请号：US15533080
申请日：2015-10-20
发明人： Masahiro Konishi , Shin Itoh , Hiroshi Yamashita , Ippei Yamaguchi , Hiroyuki Nokubo , Yoshiaki Itakura
IPC分类号： F21V21/002 , H01L33/60 , H01L33/62 , F21V7/10 , F21V23/06 , H01L33/64 , F21V29/74 , F21Y105/10 , F21Y115/10
摘要： An electrode pattern (13) formed on a ceramics layer (2) in a substrate for a light emitting device (circuit board (320)) of the present invention includes a first metal layer (5), a second metal layer (7), and an electrode terminal unit (10), and the thickness of a part at which the electrode terminal unit (10) is not formed in the electrode pattern (13) is at least equal to or greater than 35 μm. Accordingly, it is possible to suppress heat resistance to be low.
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公开(公告)号：US09966504B2
公开(公告)日：2018-05-08
申请号：US15651492
申请日：2017-07-17
发明人： Masahiro Konishi , Makoto Agatani , Toshio Hata
IPC分类号： H01L33/50 , F21K99/00 , H01L33/62 , H01L33/36 , F21V23/00 , H01L33/38 , H01L33/32 , F21K9/20 , H01L25/075 , H01L33/56 , H01L33/60 , F21K9/00 , H01L33/64 , F21Y115/10 , F21Y105/10 , F21K9/232 , H01L23/00 , F21Y101/00
CPC分类号： H01L33/502 , F21K9/00 , F21K9/20 , F21K9/232 , F21V23/002 , F21Y2101/00 , F21Y2105/10 , F21Y2115/10 , H01L24/45 , H01L25/0753 , H01L33/32 , H01L33/36 , H01L33/38 , H01L33/56 , H01L33/60 , H01L33/62 , H01L33/641 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45169 , H01L2224/48091 , H01L2224/48465 , H01L2224/73265 , H01L2924/01015 , H01L2924/01047 , H01L2924/01068 , H01L2924/01087 , H01L2924/09701 , H01L2924/12041 , H01L2924/181 , H01L2924/3011 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： By using a light emitting device including an insulating substrate and a light emitting unit formed on the insulating substrate, the light emitting unit including: a plurality of linear wiring patterns disposed on the insulating substrate in parallel with one another, a plurality of light emitting elements that are mounted between the wiring patterns while being electrically connected to the wiring patterns, and a sealing member for sealing the light emitting elements, as well as a method for manufacturing thereof, it becomes possible to provide a light emitting device that achieves sufficient electrical insulation and has simple manufacturing processes so that it can be manufactured at a low cost, and a method for manufacturing the same.
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3.发明申请LIGHT-EMITTING APPARATUS AND STRUCTURE FOR ATTACHING LIGHT-EMITTING APPARATUS TO HEAT SINK 审中-公开用于连接发光装置的发光装置和结构公开(公告)号：US20150276198A1
公开(公告)日：2015-10-01
申请号：US14434428
申请日：2013-10-10
发明人： Toshio Hata , Makoto Agatani , Tomokazu Nada , Yuhsuke Fujita , Ippei Yamaguchi , Masahiro Konishi
CPC分类号： F21V29/70 , F21V23/005 , F21Y2115/10 , H01L25/0753 , H01L33/54 , H01L33/62 , H01L33/64 , H01L33/644 , H01L2224/48091 , H01L2224/48137 , H05K1/0209 , H05K3/0061 , H05K2201/066 , H05K2201/10106 , H01L2924/00014
摘要： A light-emitting apparatus has a substrate (72) having a generally disc shape, a light-emitting part (76) having a plurality of LED chips (73) mounted on one main surface of the substrate (72), the plurality of LED chips (73) being sealed with a resin (74), and a heat-sink attachment part having a heat-sink attachment male thread (80) formed on a side surface of the substrate (72). When the attachment area of the substrate (72) to the heat sink is kept the same, the light-emitting part (76) may be enlarged, and when the light-emitting unit (76) is kept the same, the attachment area of the substrate (72) may be reduced.
摘要翻译： 一种发光装置，具有大致盘状的基板（72），具有安装在基板（72）的一个主面上的多个LED芯片（73）的发光部（76），多个LED 芯片（73）用树脂（74）密封，散热器安装部分具有形成在基板（72）的侧表面上的散热附件外螺纹（80）。 当基板（72）到散热器的安装区域保持相同时，可以扩大发光部分（76），并且当发光单元（76）保持相同时，安装面积 可以减小衬底（72）。
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公开(公告)号：US10167566B2
公开(公告)日：2019-01-01
申请号：US14912195
申请日：2014-07-25
发明人： Masahiro Konishi , Shin Itoh
摘要： A substrate (5) in which a surface of an aluminum base (10) other than a surface on which an insulating thin film layer (17) is formed is covered with a protective layer (19) which is an aluminum anodic oxide film.
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公开(公告)号：US09960332B2
公开(公告)日：2018-05-01
申请号：US15240684
申请日：2016-08-18
发明人： Masahiro Konishi , Masaki Kondo , Takaaki Horio , Takanobu Matsuo , Toshio Hata , Kiyohisa Ohta
IPC分类号： H01L33/00 , H01L33/62 , H01L23/00 , H01L25/075 , H01L33/60 , H01L33/56 , H01L33/50 , H01L33/64 , H01L33/46 , F21Y101/00 , F21K9/23 , F21Y115/10
CPC分类号： H01L33/62 , F21K9/23 , F21Y2101/00 , F21Y2115/10 , H01L24/97 , H01L25/0753 , H01L33/46 , H01L33/50 , H01L33/56 , H01L33/60 , H01L33/641 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/49113 , H01L2224/73265 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/0102 , H01L2924/01024 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01047 , H01L2924/01056 , H01L2924/01058 , H01L2924/01063 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/12041 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/19107 , H01L2933/0066 , H01L2224/85 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A light-emitting apparatus of the present invention has (i) a semiconductor device which emits light toward a higher position than a substrate and (ii) a plurality of external connection terminals, and includes: a light-reflecting layer, provided on the substrate, which reflects the light emitted by the semiconductor device; and a covering layer which covers at least the light-reflecting layer and which transmits the light reflected by the light-reflecting layer. Further, the semiconductor device is provided on the covering layer, and is electrically connected to the external connection terminals via connecting portions, and the semiconductor device and the connecting portions are sealed with a sealing resin so as to be covered. Therefore, the light-emitting apparatus has increased efficiency with which light is taken out, and can prevent a reflecting layer from being altered, deteriorating, and decreasing in reflectance.
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公开(公告)号：US09404035B2
公开(公告)日：2016-08-02
申请号：US14431036
申请日：2013-04-12
发明人： Masahiro Konishi
IPC分类号： H01L21/00 , C09K11/77 , C08J3/20 , C08J3/24 , H01L23/00 , H01L33/56 , C09D183/04 , H01L33/00 , H01L33/50
CPC分类号： H01L33/502 , B29C47/0004 , B29C47/025 , B29C47/026 , B29C47/30 , B29C47/402 , C08J3/18 , C08J3/20 , C08J3/203 , C08J3/24 , C08J3/244 , C08J2383/04 , C09D5/22 , C09D183/04 , C09K11/02 , C09K11/77 , H01L24/97 , H01L33/005 , H01L33/50 , H01L33/56 , H01L2224/45144 , H01L2224/48091 , H01L2224/48465 , H01L2224/73265 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2924/00014 , H01L2924/00
摘要： A fluorescent material-containing sealing resin (20) production method of the present invention includes: a kneading step of kneading a powder mixture (24), which has been obtained by mixing a powder of silicone resins (21) and a powder of fluorescent materials (22) together, while melting the powder mixture (24) by heat, so that a kneaded mixture (25) is obtained; and an extruding step of extruding the kneaded mixture (25) in a form of a cord from an output port (37b) of a twin screw extruder (37).
摘要翻译： 本发明的含荧光材料的密封树脂（20）的制造方法包括：将通过混合有机硅树脂（21）的粉末和荧光体粉末得到的粉末混合物（24）混炼的捏合步骤 （22），同时通过加热熔化粉末混合物（24），从而获得捏合的混合物（25）; 以及从双螺杆挤出机（37）的输出口（37b）挤出捏合混合物（25）成为帘线形式的挤出步骤。
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公开(公告)号：US09859484B2
公开(公告)日：2018-01-02
申请号：US14436513
申请日：2013-09-25
CPC分类号： H01L33/647 , H01L25/0753 , H01L33/486 , H01L33/54 , H01L33/60 , H01L33/62 , H01L33/641 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2924/00014 , H01L2924/00
摘要： A ceramic insulating film (150) having a heat conducting property and a light reflecting property is formed on a front surface of a substrate (100), and a light emitting element (110) is provided on the ceramic insulating film. This makes it possible to improve a heat dissipation characteristic and a light utilization efficiency of a light emitting apparatus (10) having the light emitting element (101) provided on the substrate (110).
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公开(公告)号：US09806244B2
公开(公告)日：2017-10-31
申请号：US15101969
申请日：2014-12-04
发明人： Masahiro Konishi , Shin Itoh , Hiroyuki Nokubo , Yoshiaki Itakura
IPC分类号： H01L33/00 , H01L33/62 , H01L33/60 , H01L33/64 , H05K1/02 , H05K1/05 , H01L21/48 , H01L33/54 , H01L25/075 , H05K3/28
CPC分类号： H01L33/62 , H01L21/4846 , H01L25/0753 , H01L33/54 , H01L33/60 , H01L33/641 , H01L2224/16225 , H05K1/0274 , H05K1/053 , H05K3/285 , H05K2201/10106 , H05K2201/2054
摘要： Provided is a substrate for a light emitting device having high reflectivity, high heat radiating properties, dielectric strength voltage properties, long-term reliability including heat resistance and light resistance, and excellent mass productivity. A substrate (20) for a light emitting device includes: a first insulating layer (11) having thermal conductivity which is formed on a surface of one side of a metal base (2); a wiring pattern (3) which is formed on the first insulating layer (11); and a second insulating layer (12) having light reflectivity which is formed on the first insulating layer (11) and on some parts of the wiring pattern (3), so that some parts of the wiring pattern (3) are exposed, in which the first insulating layer (11) is a layer of ceramic formed by thermal spraying.
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公开(公告)号：US09577159B2
公开(公告)日：2017-02-21
申请号：US15180172
申请日：2016-06-13
发明人： Masahiro Konishi
IPC分类号： H01L21/56 , H01L33/50 , C08J3/20 , C08J3/24 , H01L23/00 , H01L33/56 , C09D183/04 , C09K11/77 , H01L33/00 , B29C47/02 , B29C47/30 , C08J3/18 , B29C47/00 , B29C47/40 , C09K11/02 , C09D5/22
CPC分类号： H01L33/502 , B29C47/0004 , B29C47/025 , B29C47/026 , B29C47/30 , B29C47/402 , C08J3/18 , C08J3/20 , C08J3/203 , C08J3/24 , C08J3/244 , C08J2383/04 , C09D5/22 , C09D183/04 , C09K11/02 , C09K11/77 , H01L24/97 , H01L33/005 , H01L33/50 , H01L33/56 , H01L2224/45144 , H01L2224/48091 , H01L2224/48465 , H01L2224/73265 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2924/00014 , H01L2924/00
摘要： A fluorescent material-containing sealing resin (20) production method of the present invention includes: a kneading step of kneading a powder mixture (24), which has been obtained by mixing a powder of silicone resins (21) and a powder of fluorescent materials (22) together, while melting the powder mixture (24) by heat, so that a kneaded mixture (25) is obtained; and an extruding step of extruding the kneaded mixture (25) in a form of a cord from an output port (37b) of a twin screw extruder (37).
摘要翻译： 本发明的含荧光材料的密封树脂（20）的制造方法包括：将通过混合有机硅树脂（21）的粉末和荧光体粉末得到的粉末混合物（24）混炼的捏合步骤 （22），同时通过加热熔化粉末混合物（24），从而获得捏合的混合物（25）; 以及从双螺杆挤出机（37）的输出口（37b）挤出捏合混合物（25）成为帘线形式的挤出步骤。
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公开(公告)号：US09484502B2
公开(公告)日：2016-11-01
申请号：US14245974
申请日：2014-04-04
发明人： Masahiro Konishi , Makoto Agatani , Toshio Hata
IPC分类号： H01L33/50 , F21K99/00 , H01L33/62 , H01L33/36 , F21V23/00 , H01L33/38 , H01L25/075 , H01L33/32 , H01L33/56 , H01L33/60 , H01L33/64 , F21Y101/02 , H01L23/00 , F21Y105/00
CPC分类号： H01L33/502 , F21K9/00 , F21K9/20 , F21K9/232 , F21V23/002 , F21Y2101/00 , F21Y2105/10 , F21Y2115/10 , H01L24/45 , H01L25/0753 , H01L33/32 , H01L33/36 , H01L33/38 , H01L33/56 , H01L33/60 , H01L33/62 , H01L33/641 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45169 , H01L2224/48091 , H01L2224/48465 , H01L2224/73265 , H01L2924/01015 , H01L2924/01047 , H01L2924/01068 , H01L2924/01087 , H01L2924/09701 , H01L2924/12041 , H01L2924/181 , H01L2924/3011 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： By using a light emitting device including an insulating substrate and a light emitting unit formed on the insulating substrate, the light emitting unit including: a plurality of linear wiring patterns disposed on the insulating substrate in parallel with one another, a plurality of light emitting elements that are mounted between the wiring patterns while being electrically connected to the wiring patterns, and a sealing member for sealing the light emitting elements, as well as a method for manufacturing thereof, it becomes possible to provide a light emitting device that achieves sufficient electrical insulation and has simple manufacturing processes so that it can be manufactured at a low cost, and a method for manufacturing the same.
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