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公开(公告)号：US09960332B2
公开(公告)日：2018-05-01
申请号：US15240684
申请日：2016-08-18
发明人： Masahiro Konishi , Masaki Kondo , Takaaki Horio , Takanobu Matsuo , Toshio Hata , Kiyohisa Ohta
IPC分类号： H01L33/00 , H01L33/62 , H01L23/00 , H01L25/075 , H01L33/60 , H01L33/56 , H01L33/50 , H01L33/64 , H01L33/46 , F21Y101/00 , F21K9/23 , F21Y115/10
CPC分类号： H01L33/62 , F21K9/23 , F21Y2101/00 , F21Y2115/10 , H01L24/97 , H01L25/0753 , H01L33/46 , H01L33/50 , H01L33/56 , H01L33/60 , H01L33/641 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/49113 , H01L2224/73265 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/0102 , H01L2924/01024 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01047 , H01L2924/01056 , H01L2924/01058 , H01L2924/01063 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/12041 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/19107 , H01L2933/0066 , H01L2224/85 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A light-emitting apparatus of the present invention has (i) a semiconductor device which emits light toward a higher position than a substrate and (ii) a plurality of external connection terminals, and includes: a light-reflecting layer, provided on the substrate, which reflects the light emitted by the semiconductor device; and a covering layer which covers at least the light-reflecting layer and which transmits the light reflected by the light-reflecting layer. Further, the semiconductor device is provided on the covering layer, and is electrically connected to the external connection terminals via connecting portions, and the semiconductor device and the connecting portions are sealed with a sealing resin so as to be covered. Therefore, the light-emitting apparatus has increased efficiency with which light is taken out, and can prevent a reflecting layer from being altered, deteriorating, and decreasing in reflectance.
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公开(公告)号：US20160013387A1
公开(公告)日：2016-01-14
申请号：US14866060
申请日：2015-09-25
发明人： Masahiro KONISHI , Masaki Kondo , Takaaki Horio , Takanobu Matsuo , Toshio Hata , Kiyohisa Ohta
CPC分类号： H01L33/62 , F21K9/23 , F21Y2101/00 , F21Y2115/10 , H01L24/97 , H01L25/0753 , H01L33/46 , H01L33/50 , H01L33/56 , H01L33/60 , H01L33/641 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/49113 , H01L2224/73265 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/0102 , H01L2924/01024 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01047 , H01L2924/01056 , H01L2924/01058 , H01L2924/01063 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/12041 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/19107 , H01L2933/0066 , H01L2224/85 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A light-emitting apparatus of the present invention has (i) a semiconductor device which emits light toward a higher position than a substrate and (ii) a plurality of external connection terminals, and includes: a light-reflecting layer, provided on the substrate, which reflects the light emitted by the semiconductor device; and a covering layer which covers at least the light-reflecting layer and which transmits the light reflected by the light-reflecting layer. Further, the semiconductor device is provided on the covering layer, and is electrically connected to the external connection terminals via connecting portions, and the semiconductor device and the connecting portions are sealed with a sealing resin so as to be covered. Therefore, the light-emitting apparatus has increased efficiency with which light is taken out, and can prevent a reflecting layer from being altered, deteriorating, and decreasing in reflectance.
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公开(公告)号：US09461224B2
公开(公告)日：2016-10-04
申请号：US14866060
申请日：2015-09-25
发明人： Masahiro Konishi , Masaki Kondo , Takaaki Horio , Takanobu Matsuo , Toshio Hata , Kiyohisa Ohta
IPC分类号： H01L33/00 , H01L33/62 , H01L23/00 , H01L33/60 , H01L33/56 , H01L33/50 , F21Y101/02 , H01L25/075 , H01L33/46 , F21K99/00
CPC分类号： H01L33/62 , F21K9/23 , F21Y2101/00 , F21Y2115/10 , H01L24/97 , H01L25/0753 , H01L33/46 , H01L33/50 , H01L33/56 , H01L33/60 , H01L33/641 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/49113 , H01L2224/73265 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/0102 , H01L2924/01024 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01047 , H01L2924/01056 , H01L2924/01058 , H01L2924/01063 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/12041 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/19107 , H01L2933/0066 , H01L2224/85 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A light-emitting apparatus of the present invention has (i) a semiconductor device which emits light toward a higher position than a substrate and (ii) a plurality of external connection terminals, and includes: a light-reflecting layer, provided on the substrate, which reflects the light emitted by the semiconductor device; and a covering layer which covers at least the light-reflecting layer and which transmits the light reflected by the light-reflecting layer. Further, the semiconductor device is provided on the covering layer, and is electrically connected to the external connection terminals via connecting portions, and the semiconductor device and the connecting portions are sealed with a sealing resin so as to be covered. Therefore, the light-emitting apparatus has increased efficiency with which light is taken out, and can prevent a reflecting layer from being altered, deteriorating, and decreasing in reflectance.
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公开(公告)号：US08835970B2
公开(公告)日：2014-09-16
申请号：US14105638
申请日：2013-12-13
发明人： Masahiro Konishi , Masaki Kondo , Takaaki Horio , Takanobu Matsuo , Toshio Hata , Kiyohisa Ohta
CPC分类号： H01L33/62 , F21K9/23 , F21Y2101/00 , F21Y2115/10 , H01L24/97 , H01L25/0753 , H01L33/46 , H01L33/50 , H01L33/56 , H01L33/60 , H01L33/641 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/49113 , H01L2224/73265 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/0102 , H01L2924/01024 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01047 , H01L2924/01056 , H01L2924/01058 , H01L2924/01063 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/12041 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/19107 , H01L2933/0066 , H01L2224/85 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A light-emitting apparatus of the present invention has (i) a semiconductor device which emits light toward a higher position than a substrate and (ii) a plurality of external connection terminals, and includes: a light-reflecting layer, provided on the substrate, which reflects the light emitted by the semiconductor device; and a covering layer which covers at least the light-reflecting layer and which transmits the light reflected by the light-reflecting layer. Further, the semiconductor device is provided on the covering layer, and is electrically connected to the external connection terminals via connecting portions, and the semiconductor device and the connecting portions are sealed with a sealing resin so as to be covered. Therefore, the light-emitting apparatus has increased efficiency with which light is taken out, and can prevent a reflecting layer from being altered, deteriorating, and decreasing in reflectance.
摘要翻译： 本发明的发光装置具有：（i）朝向比基板更高的位置发光的半导体器件，和（ii）多个外部连接端子，并且包括：设置在基板上的光反射层 ，其反映由半导体器件发射的光; 以及至少覆盖所述光反射层并透射由所述光反射层反射的光的覆盖层。 此外，半导体器件设置在覆盖层上，并且经由连接部分电连接到外部连接端子，半导体器件和连接部分用密封树脂密封以被覆盖。 因此，发光装置具有提高光线的效率，能够防止反射层的变化，劣化，反射率的降低。
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公开(公告)号：US11145618B2
公开(公告)日：2021-10-12
申请号：US16294167
申请日：2019-03-06
IPC分类号： H01L21/67 , H01L21/687 , H01L21/677 , H01L21/683 , H01L23/00
摘要： Bonding equipment includes a laminar flow source, a chip handling portion, a cleaning portion for cleaning a chip, a bonding portion for bonding the chip and a substrate, and a transfer mechanism for transferring the chip from the chip handling portion to the bonding portion. Among these, at least the bonding portion and the cleaning portion are disposed in a laminar flow by the laminar flow source.
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公开(公告)号：US09178125B2
公开(公告)日：2015-11-03
申请号：US14467836
申请日：2014-08-25
发明人： Masahiro Konishi , Masaki Kondo , Takaaki Horio , Takanobu Matsuo , Toshio Hata , Kiyohisa Ohta
IPC分类号： H01L33/00 , H01L33/60 , H01L23/00 , H01L33/56 , F21Y101/02 , H01L25/075 , H01L33/46 , F21K99/00
CPC分类号： H01L33/62 , F21K9/23 , F21Y2101/00 , F21Y2115/10 , H01L24/97 , H01L25/0753 , H01L33/46 , H01L33/50 , H01L33/56 , H01L33/60 , H01L33/641 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/49113 , H01L2224/73265 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/0102 , H01L2924/01024 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01047 , H01L2924/01056 , H01L2924/01058 , H01L2924/01063 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/12041 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/19107 , H01L2933/0066 , H01L2224/85 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A light-emitting apparatus of the present invention has (i) a semiconductor device which emits light toward a higher position than a substrate and (ii) a plurality of external connection terminals, and includes: a light-reflecting layer, provided on the substrate, which reflects the light emitted by the semiconductor device; and a covering layer which covers at least the light-reflecting layer and which transmits the light reflected by the light-reflecting layer. Further, the semiconductor device is provided on the covering layer, and is electrically connected to the external connection terminals via connecting portions, and the semiconductor device and the connecting portions are sealed with a sealing resin so as to be covered. Therefore, the light-emitting apparatus has increased efficiency with which light is taken out, and can prevent a reflecting layer from being altered, deteriorating, and decreasing in reflectance.
摘要翻译： 本发明的发光装置具有：（i）朝向比基板高的位置发光的半导体装置，（ii）多个外部连接端子，具有：设置在基板上的光反射层 ，其反映由半导体器件发射的光; 以及至少覆盖所述光反射层并透射由所述光反射层反射的光的覆盖层。 此外，半导体器件设置在覆盖层上，并且经由连接部分电连接到外部连接端子，半导体器件和连接部分用密封树脂密封以被覆盖。 因此，发光装置具有提高光线的效率，能够防止反射层的变化，劣化，反射率的降低。
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