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公开(公告)号：US10260727B2
公开(公告)日：2019-04-16
申请号：US14892071
申请日：2014-06-09
发明人： Makoto Matsuda , Makoto Agatani
IPC分类号： F21V29/70 , F21V19/00 , F21V23/06 , H01L33/64 , H01L25/075 , F21Y105/10 , F21Y115/10
摘要： A light-emitting device (100) is provided with: a light-emitting module (1) in which a light-emitting section (30) is provided on a ceramic substrate (11); a heat sink (2); a holder (4) having a ceramic plate (50) for attaching the light-emitting module (1) to the heat sink (2); and a heat-dissipating sheet (3) provided between the ceramic substrate (11) and the heat sink (2).
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公开(公告)号：US09966367B2
公开(公告)日：2018-05-08
申请号：US15587759
申请日：2017-05-05
发明人： Shinya Ishizaki , Makoto Agatani , Tomokazu Nada , Toshio Hata
IPC分类号： H01L33/00 , H01L25/075 , H01L33/48 , H01L33/54 , H01L33/56 , H01L33/38 , H01L33/62 , H01L33/50 , F21K9/238 , F21K9/232 , F21V23/00 , H01L33/52 , H01L33/60 , F21V29/74 , F21Y105/10 , F21Y115/10
CPC分类号： H01L25/0753 , F21K9/232 , F21K9/238 , F21V3/00 , F21V5/048 , F21V23/005 , F21V29/74 , F21Y2101/00 , F21Y2105/10 , F21Y2115/10 , H01L25/167 , H01L27/15 , H01L27/156 , H01L33/38 , H01L33/483 , H01L33/486 , H01L33/50 , H01L33/507 , H01L33/52 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2224/48137 , H01L2924/3011 , H01L2924/00
摘要： A light emitting device includes: a ceramic substrate; a plurality of LED chips; a printed resistor(s) connected in parallel with the plurality of LED chips; a dam resin made of a resin having a low optical transmittance; a fluorescent-material-containing resin layer; and an anode-side electrode and a cathode-side electrode, (a) which are provided on a primary surface of the ceramic substrate so as to face each other along a first direction on the primary surface and (b) which are disposed below at least one of the dam resin and the fluorescent-material-containing resin layer. With the configuration in which a plurality of LEDs, which are connected in a series-parallel connection, are provided on a substrate, it is possible to provide a light emitting device which can achieve restraining of luminance unevenness and an improvement in luminous efficiency.
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公开(公告)号：US09607970B2
公开(公告)日：2017-03-28
申请号：US14957268
申请日：2015-12-02
发明人： Makoto Agatani , Toshio Hata , Toyonori Uemura
IPC分类号： H01L29/18 , H01L25/075 , F21K99/00 , H01L27/15 , H01L33/38 , H01L33/50 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/62 , H05K1/03 , H05K1/16 , H05K1/18
CPC分类号： H01L25/0753 , F21K9/00 , H01L27/15 , H01L33/38 , H01L33/504 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/62 , H01L2224/48091 , H05K1/0306 , H05K1/167 , H05K1/181 , H05K2201/10106 , Y10T29/49764 , H01L2924/00014
摘要： The light-emitting device of the present invention includes LED chips provided on a ceramic substrate and a sealing material in which the LED chips are embedded. The sealing material contains a fluorescent substance and divided into a first fluorescent-substance-containing resin layer and a second fluorescent-substance-containing resin layer by a first resin ring and a second resin ring.
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公开(公告)号：US09425236B2
公开(公告)日：2016-08-23
申请号：US14674624
申请日：2015-03-31
发明人： Shinya Ishizaki , Makoto Agatani , Tomokazu Nada , Toshio Hata
IPC分类号： H01L33/00 , H01L27/15 , H01L33/48 , H01L33/56 , F21K99/00 , F21V3/00 , H01L25/075 , H01L25/16 , H01L33/54 , H01L33/38 , F21V29/74 , F21V5/04 , F21V23/00 , H01L33/52 , H01L33/60 , H01L33/62 , F21Y101/02 , H01L33/50
CPC分类号： H01L25/0753 , F21K9/232 , F21K9/238 , F21V3/00 , F21V5/048 , F21V23/005 , F21V29/74 , F21Y2101/00 , F21Y2105/10 , F21Y2115/10 , H01L25/167 , H01L27/15 , H01L27/156 , H01L33/38 , H01L33/483 , H01L33/486 , H01L33/50 , H01L33/507 , H01L33/52 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2224/48137 , H01L2924/3011 , H01L2924/00
摘要： A light emitting device includes: a ceramic substrate; a plurality of LED chips; a printed resistor(s) connected in parallel with the plurality of LED chips; a dam resin made of a resin having a low optical transmittance; a fluorescent-material-containing resin layer; and an anode-side electrode and a cathode-side electrode, (a) which are provided on a primary surface of the ceramic substrate so as to face each other along a first direction on the primary surface and (b) which are disposed below at least one of the dam resin and the fluorescent-material-containing resin layer. With the configuration in which a plurality of LEDs, which are connected in a series-parallel connection, are provided on a substrate, it is possible to provide a light emitting device which can achieve restraining of luminance unevenness and an improvement in luminous efficiency.
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公开(公告)号：US20130193462A1
公开(公告)日：2013-08-01
申请号：US13799373
申请日：2013-03-13
发明人： Shinya Ishizaki , Makoto Agatani , Tomokazu Nada , Toshio Hata
IPC分类号： H01L27/15
CPC分类号： H01L25/0753 , F21K9/232 , F21K9/238 , F21V3/00 , F21V5/048 , F21V23/005 , F21V29/74 , F21Y2101/00 , F21Y2105/10 , F21Y2115/10 , H01L25/167 , H01L27/15 , H01L27/156 , H01L33/38 , H01L33/483 , H01L33/486 , H01L33/50 , H01L33/507 , H01L33/52 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2224/48137 , H01L2924/3011 , H01L2924/00
摘要： A light emitting device includes: a ceramic substrate; a plurality of LED chips; a printed resistor(s) connected in parallel with the plurality of LED chips; a dam resin made of a resin having a low optical transmittance; a fluorescent-material-containing resin layer; and an anode-side electrode and a cathode-side electrode, (a) which are provided on a primary surface of the ceramic substrate so as to face each other along a first direction on the primary surface and (b) which are disposed below at least one of the dam resin and the fluorescent-material-containing resin layer. With the configuration in which a plurality of LEDs, which are connected in a series-parallel connection, are provided on a substrate, it is possible to provide a light emitting device which can achieve restraining of luminance unevenness and an improvement in luminous efficiency.
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公开(公告)号：US10224469B2
公开(公告)日：2019-03-05
申请号：US15271762
申请日：2016-09-21
发明人： Toshio Hata , Makoto Agatani , Shinya Ishizaki , Makoto Matsuda , Tomokazu Nada , Toyonori Uemura
IPC分类号： H01L33/60 , H01L23/544 , G03F9/00 , H01L25/075 , H01L33/62 , H05K1/02 , H01L33/48 , H05K3/12 , H05K3/28
摘要： A light emitting device (10) includes light emitting elements (12), conductor wirings (14), and alignment marks (18) formed on a substrate (11). The alignment marks (18) and the conductor wirings (14) are formed by printing.
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公开(公告)号：US09735133B2
公开(公告)日：2017-08-15
申请号：US15290232
申请日：2016-10-11
发明人： Makoto Agatani , Toshio Hata , Tomokazu Nada , Shinya Ishizaki
IPC分类号： H01L33/62 , H01L25/075 , F21K9/00 , H05K1/11 , F21V23/06 , H01L33/54 , H01L33/48 , H01L33/52 , F21Y101/00 , F21Y105/10 , F21K9/232 , F21Y115/10
CPC分类号： H01L25/0753 , F21K9/00 , F21K9/232 , F21V23/06 , F21Y2101/00 , F21Y2105/10 , F21Y2115/10 , H01L33/483 , H01L33/52 , H01L33/54 , H01L33/62 , H01L2224/48091 , H01L2224/48137 , H01L2924/01327 , H01L2933/0066 , H05K1/11 , H05K2201/0391 , H05K2201/094 , H05K2201/0979 , H05K2201/10106 , H01L2924/00014 , H01L2924/00
摘要： A light-emitting device capable of ensuring an electric connection between a light-emitting element and an electrode without generating any problem in practical use, by both connecting methods with a solder and a connector, and a lighting device provided with the light-emitting device are provided. The light-emitting device according to the present invention has a plurality of LED chips, and a soldering electrode land and a connector connecting electrode land electrically connected to the chips, on a ceramic substrate. The soldering electrode land is formed of a first conductive material having a function to prevent diffusion to a solder, and the connector connecting electrode land is formed of a second conductive material having a function to prevent oxidation.
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公开(公告)号：US09577153B2
公开(公告)日：2017-02-21
申请号：US14376578
申请日：2013-02-19
发明人： Makoto Agatani , Makoto Matsuda
IPC分类号： H01L33/40 , H01L33/62 , H01L25/075
CPC分类号： H01L33/40 , H01L25/0753 , H01L33/62 , H01L2924/0002 , H01L2933/0016 , H01L2924/00
摘要： A light emission device includes: an insulating substrate; a light emitting section including a plurality of LED chips mounted on the insulating substrate; and land electrodes for supplying power to the LED chips. At least a surface of each of the land electrodes is made of a conductive material which is harder than Au and Ag and which has sulfurization resistance to such an extent that secures conduction of each land electrode when a current in a working current range is applied on the land electrode.
摘要翻译： 发光装置包括：绝缘基板; 发光部，其包括安装在所述绝缘基板上的多个LED芯片; 以及用于向LED芯片供电的焊盘电极。 每个焊盘电极的至少一个表面由比Au和Ag硬的导电材料制成，并且具有耐硫化性，在施加工作电流范围内的电流时确保每个焊盘电极的导通的程度 土地电极。
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公开(公告)号：US09478716B2
公开(公告)日：2016-10-25
申请号：US14638672
申请日：2015-03-04
发明人： Masahiro Konishi , Makoto Agatani , Toshio Hata
IPC分类号： H01L33/50 , F21K99/00 , H01L33/62 , H01L33/36 , F21V23/00 , H01L33/38 , H01L25/075 , H01L33/32 , H01L33/56 , H01L33/60 , H01L33/64 , F21Y101/02 , H01L23/00 , F21Y105/00
CPC分类号： H01L33/502 , F21K9/00 , F21K9/20 , F21K9/232 , F21V23/002 , F21Y2101/00 , F21Y2105/10 , F21Y2115/10 , H01L24/45 , H01L25/0753 , H01L33/32 , H01L33/36 , H01L33/38 , H01L33/56 , H01L33/60 , H01L33/62 , H01L33/641 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45169 , H01L2224/48091 , H01L2224/48465 , H01L2224/73265 , H01L2924/01015 , H01L2924/01047 , H01L2924/01068 , H01L2924/01087 , H01L2924/09701 , H01L2924/12041 , H01L2924/181 , H01L2924/3011 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： By using a light emitting device including an insulating substrate and a light emitting unit formed on the insulating substrate, the light emitting unit including: a plurality of linear wiring patterns disposed on the insulating substrate in parallel with one another, a plurality of light emitting elements that are mounted between the wiring patterns while being electrically connected to the wiring patterns, and a sealing member for sealing the light emitting elements, as well as a method for manufacturing thereof, it becomes possible to provide a light emitting device that achieves sufficient electrical insulation and has simple manufacturing processes so that it can be manufactured at a low cost, and a method for manufacturing the same.
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公开(公告)号：US09231023B2
公开(公告)日：2016-01-05
申请号：US14663696
申请日：2015-03-20
发明人： Makoto Agatani , Toshio Hata , Toyonori Uemura
IPC分类号： H01L29/18 , H01L27/15 , F21K99/00 , H01L25/075 , H01L33/38 , H01L33/50 , H05K1/03 , H05K1/16 , H05K1/18
CPC分类号： H01L25/0753 , F21K9/00 , H01L27/15 , H01L33/38 , H01L33/504 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/62 , H01L2224/48091 , H05K1/0306 , H05K1/167 , H05K1/181 , H05K2201/10106 , Y10T29/49764 , H01L2924/00014
摘要： The light-emitting device of the present invention includes LED chips provided on a ceramic substrate and a sealing material in which the LED chips are embedded. The sealing material contains a fluorescent substance and divided into a first fluorescent-substance-containing resin layer and a second fluorescent-substance-containing resin layer by a first resin ring and a second resin ring.
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