公开(公告)号：US07012323B2

公开(公告)日：2006-03-14

申请号：US10452333

申请日：2003-06-02

Applicant: Michael Warner ,  Belgacem Haba ,  Masud Beroz

Inventor： Michael Warner ,  Belgacem Haba ,  Masud Beroz

IPC: H01L23/48

CPC classification number: G06F21/10 ,  G06F2221/2129 ,  H01F17/0033 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/4334 ,  H01L23/49531 ,  H01L23/49575 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/49861 ,  H01L23/5387 ,  H01L23/552 ,  H01L23/645 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/50 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/16 ,  H01L2223/6611 ,  H01L2224/05569 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05599 ,  H01L2224/12105 ,  H01L2224/16145 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/45099 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/4911 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/85207 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06568 ,  H01L2225/06572 ,  H01L2225/06579 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01061 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H03H9/0542 ,  H03H9/0547 ,  H03H9/1064 ,  H03H2009/0019 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

Abstract: Inductors are provided in chip assemblies such as in packaged semiconductor chips. The inductors may be incorporated in a chip carrier which forms part of the package, and may include, for example, spiral or serpentine inductors formed from traces on the chip carrier. The chip carrier may include a flap bearing the inductive element, and this flap may be bent to tilt the inductive element out of the plane of the chip carrier to reduce electromagnetic interaction between the inductive element and surrounding electrical components. Other inductors include solenoids formed in part by leads on the chip carrier as, for example, by displacing leads out of the plane of the chip carrier to form loops in vertically-extensive planes transverse to the plane of the chip carrier. Additional features provide trimming of the inductor to a desired inductance value during by breaking or connecting leads during assembly.

Abstract translation: 电感器设置在诸如封装半导体芯片的芯片组件中。 电感器可以结合在构成封装的一部分的芯片载体中，并且可以包括例如由芯片载体上的迹线形成的螺旋或蛇形电感器。 芯片载体可以包括承载感应元件的翼片，并且该翼片可以被弯曲以将感应元件倾斜到芯片载体的平面之外，以减小电感元件和周围的电气部件之间的电磁相互作用。 其他电感器包括由芯片载体上的引线部分地形成的螺线管，例如通过将引线移出芯片载体的平面而在横向于芯片载体的平面的垂直方向的平面中形成环。 附加特征提供了在组装期间通过断开或连接引线将电感器修整到期望的电感值。

公开(公告)号：US20060013680A1

公开(公告)日：2006-01-19

申请号：US11183635

申请日：2005-07-18

Applicant: Belgacem Haba ,  David Tuckerman ,  Glenn Urbish ,  Masud Beroz ,  Ilyas Mohammed

Inventor： Belgacem Haba ,  David Tuckerman ,  Glenn Urbish ,  Masud Beroz ,  Ilyas Mohammed

IPC: B65G49/07

CPC classification number: H01L21/67144 ,  B23K26/066 ,  B23K26/0846 ,  B23K26/10 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50 ,  H01L24/97 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/10158 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: An array of chips spaced apart from one another by chip spacing distances, as, for example, an array of chips on a wafer dicing tape is juxtaposed with an array of chip receiving elements spaced apart from one another by receiving element spacing distances different from the chip spacing distances, as, for example, an array of substrates or fixtures spaced apart from one another at distances substantially larger than the chip spacing distances. The juxtaposing step is performed so that a set of chips including less than all of the chips in the array of chips is aligned with a set of the chip receiving elements. This set of chips is transferred to the set of chip receiving elements while the arrays are aligned with one another. The cycle may be repeated using the same or different array of chips, and using the same or different array of chip receiving elements. Numerous small chips can be transferred to large chip receiving elements without handling individual chips, and without the use of equipment such as pick-and-place equipment commonly used for such handling.

Abstract translation: 通过芯片间隔距离彼此间隔开的芯片阵列，例如晶片切割带上的芯片阵列，与芯片接收元件阵列并列，通过接收元件间隔距离不同的芯片接收元件 芯片间隔距离，例如基板或固定装置的阵列，其距离基本上大于芯片间距距离彼此间隔开。 执行并置步骤，使得包括小于芯片阵列中的所有芯片的芯片组与一组芯片接收元件对准。 当阵列彼此对准时，这组芯片被传送到芯片接收元件组。 可以使用相同或不同的芯片阵列，并使用相同或不同的芯片接收元件阵列重复该周期。 许多小芯片可以转移到大的芯片接收元件而不处理单个芯片，并且不使用诸如通常用于这种处理的拾取和放置设备的设备。

公开(公告)号：US06940158B2

公开(公告)日：2005-09-06

申请号：US10448515

申请日：2003-05-30

Applicant: Belgacem Haba ,  Masud Beroz

Inventor： Belgacem Haba ,  Masud Beroz

IPC: H01L23/538 ,  H01L23/02 ,  H01L23/48 ,  H01L23/52

CPC classification number: H01L23/5387 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2224/0401

Abstract: A stacked microelectronic assembly comprises a flexible sheet having an obverse surface and a reverse surface and including at least a first panel and a second panel. The second panel and the first panel are adjacent to each other, the second panel including terminals on the reverse surface for mounting to an external circuit. The first panel includes a non-overmolded microelectronic element mounted thereon. The microelectronic element having a rear face and a front face surface, wherein the front face surface confronts the obverse surface of the first panel. During manufacture the flexible sheet is folded to create a stacked microelectronic assembly such that the rear face of the first microelectronic assembly confronts and substantially contacts the obverse surface of the second panel. This results in the second panel being kept substantially flat during subsequent mounting to the external circuit.

Abstract translation: 堆叠的微电子组件包括具有正面和反面并且至少包括第一面板和第二面板的柔性片。 第二面板和第一面板彼此相邻，第二面板包括用于安装到外部电路的反面上的端子。 第一面板包括安装在其上的非包覆成型的微电子元件。 微电子元件具有后表面和正面表面，其中前表面面对第一面板的正面。 在制造期间，将柔性片材折叠以产生堆叠的微电子组件，使得第一微电子组件的后表面面对并基本上接触第二面板的正面。 这导致在后续安装到外部电路期间第二面板保持基本平坦。

公开(公告)号：US20050155223A1

公开(公告)日：2005-07-21

申请号：US11043354

申请日：2005-01-26

Applicant: Joseph Fjelstad ,  Masud Beroz ,  John Smith ,  Belgacem Haba

Inventor： Joseph Fjelstad ,  Masud Beroz ,  John Smith ,  Belgacem Haba

IPC: H01L21/44 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01R43/02 ,  H05K3/34

CPC classification number: H01L24/29 ,  H01L23/49811 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/50 ,  H01L24/73 ,  H01L24/78 ,  H01L24/83 ,  H01L24/85 ,  H01L24/86 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/49431 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/78 ,  H01L2224/83138 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/8393 ,  H01L2224/85186 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85399 ,  H01L2224/8593 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06558 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10161 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49169 ,  Y10T29/49179 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: A method of making a microelectronic assembly includes juxtaposing a first element having conductive leads thereon with a second element having contacts thereon, and wire bonding the conductive leads on the first element to the contacts on the second element so that elongated bonding wires extend between the conductive leads and the contacts. After the wire bonding step, the first and second elements are moved through a preselected displacement relative to one another so as to deform the bonding wires.

Abstract translation: 制造微电子组件的方法包括：在其上具有导电引线的第一元件与其上具有触点的第二元件并置，并将第一元件上的导电引线接合到第二元件上的触点，使得细长的接合线在导电 领导和联系人。 在引线接合步骤之后，第一和第二元件相对于彼此移动通过预选位移，以使接合线变形。

公开(公告)号：US06758984B2

公开(公告)日：2004-07-06

申请号：US09945775

申请日：2001-09-04

Applicant: Belgacem Haba ,  Irina Poukhova ,  Masud Beroz

Inventor： Belgacem Haba ,  Irina Poukhova ,  Masud Beroz

IPC: C23F100

CPC classification number: H01L21/4828 ,  C25D7/12 ,  H05K3/062 ,  H05K3/108 ,  H05K3/4092 ,  H05K2203/0597 ,  H05K2203/095 ,  H05K2203/105 ,  H05K2203/1184

Abstract: A metal is provided on a polymeric component and the component is subjected to a removal process such as plasma or liquid etching in the presence of an electric field. The etchant selectively attacks the polymer at the boundary between the metal and the polymer, thereby forming gaps alongside the metal. A cover metal may be plated onto the metal in the gaps. The cover metal protects the principal metal during subsequent etching procedures.

Abstract translation: 在聚合物组分上提供金属，并且在存在电场的情况下对组分进行诸如等离子体或液体蚀刻的去除处理。 蚀刻剂在金属和聚合物之间的边界选择性地攻击聚合物，从而在金属旁边形成间隙。 覆盖金属可以镀在间隙中的金属上。 覆盖金属在随后的蚀刻过程中保护主要金属。

公开(公告)号：US06543131B1

公开(公告)日：2003-04-08

申请号：US09523514

申请日：2000-03-10

Applicant: Masud Beroz ,  Belgacem Haba

Inventor： Masud Beroz ,  Belgacem Haba

IPC: H01R4300

CPC classification number: H01L24/75 ,  H01L21/283 ,  H01L21/2885 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3128 ,  H01L24/11 ,  H01L24/12 ,  H01L24/14 ,  H01L24/16 ,  H01L24/72 ,  H01L24/81 ,  H01L2224/13099 ,  H01L2224/14051 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75315 ,  H01L2224/7598 ,  H01L2224/81209 ,  H01L2224/81801 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01021 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49149 ,  Y10T29/49169 ,  Y10T29/49224 ,  Y10T29/53178 ,  H01L2924/00

Abstract: A method of making microelectronic assemblies includes temporarily securing one or more microelectronic elements in place on one or more components using one or more temporary securements extending between the microelectronic elements and components and adhering to the elements and components. Conductive features of the elements are connected to conductive features of the components and the temporary securements are released.

Abstract translation: 制造微电子组件的方法包括使用在微电子元件和部件之间延伸并附着到元件和部件上的一个或多个临时固定件将一个或多个微电子元件临时固定在一个或多个部件上的适当位置。 元件的导电特征连接到组件的导电特征，释放临时固定。

公开(公告)号：US06541845B2

公开(公告)日：2003-04-01

申请号：US09777781

申请日：2001-02-06

Applicant: Masud Beroz ,  Thomas H. DiStefano ,  Anthony B. Faraci ,  Joseph Fjelstad ,  Belgacem Haba

Inventor： Masud Beroz ,  Thomas H. DiStefano ,  Anthony B. Faraci ,  Joseph Fjelstad ,  Belgacem Haba

IPC: H01L2144

CPC classification number: H05K3/4092 ,  H01L23/49811 ,  H01L23/4985 ,  H01L23/5387 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

Abstract: A connection component for a microelectronic device such as a semiconductor chip incorporates a support layer and conductive structures extending across a surface of the support layer. The conductive structures have anchors connecting them to the support layer, and releasable or unanchored portions.

Abstract translation: 用于诸如半导体芯片的微电子器件的连接部件包括支撑层和延伸穿过支撑层的表面的导电结构。 导电结构具有将它们连接到支撑层，以及可释放或未锚定部分的锚固件。

公开(公告)号：US07999397B2

公开(公告)日：2011-08-16

申请号：US12789683

申请日：2010-05-28

Applicant: Belgacem Haba ,  Masud Beroz ,  Teck-Gyu Kang ,  Yoichi Kubota ,  Sridhar Krishnan ,  John B. Riley, III ,  Ilyas Mohammed

Inventor： Belgacem Haba ,  Masud Beroz ,  Teck-Gyu Kang ,  Yoichi Kubota ,  Sridhar Krishnan ,  John B. Riley, III ,  Ilyas Mohammed

IPC: H01L23/52 ,  H01L23/48 ,  H01L29/40

CPC classification number: H01L23/49811 ,  H01L23/3128 ,  H01L23/3677 ,  H01L23/4985 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A microelectronic package includes a microelectronic element having faces and contacts, the microelectronic element having an outer perimeter, and a substrate overlying and spaced from a first face of the microelectronic element, whereby an outer region of the substrate extends beyond the outer perimeter of the microelectronic element. The microelectronic package includes a plurality of etched conductive posts exposed at a surface of the substrate and being electrically interconnected with the microelectronic element, whereby at least one of the etched conductive posts is disposed in the outer region of the substrate. The package includes an encapsulating mold material in contact with the microelectronic element and overlying the outer region of the substrate, the encapsulating mold material extending outside of the etched conductive posts for defining an outermost edge of the microelectronic package.

Abstract translation: 微电子封装包括具有面和触点的微电子元件，微电子元件具有外周边，以及覆盖并与微电子元件的第一面间隔开的衬底，由此衬底的外部区域延伸超出微电子器件的外周边 元件。 微电子封装包括多个蚀刻的导电柱，暴露在衬底的表面并与微电子元件电互连，由此至少一个蚀刻的导电柱设置在衬底的外部区域中。 封装包括与微电子元件接触并覆盖衬底的外部区域的封装模具材料，该封装模具材料延伸到蚀刻的导电柱的外部，用于限定微电子封装的最外边缘。

公开(公告)号：US20110042810A1

公开(公告)日：2011-02-24

申请号：US12938094

申请日：2010-11-02

Applicant: Belgacem Haba ,  Craig S. Mitchell ,  Masud Beroz

Inventor： Belgacem Haba ,  Craig S. Mitchell ,  Masud Beroz

IPC: H01L23/498 ,  H01L23/522

CPC classification number: H01L24/81 ,  H01L21/56 ,  H01L21/78 ,  H01L23/49575 ,  H01L23/49833 ,  H01L24/48 ,  H01L24/97 ,  H01L25/105 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1029 ,  H01L2225/1041 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/15311 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A plurality of microelectronic assemblies are made by severing an in-process unit including an upper substrate and lower substrate with microelectronic elements disposed between the substrates. In a further embodiment, a lead frame is joined to a substrate so that the leads project from this substrate. Lead frame is joined to a further substrate with one or more microelectronic elements disposed between the substrates.

Abstract translation: 多个微电子组件是通过用设置在基板之间的微电子元件切断包括上基板和下基板的在线单元制成的。 在另一个实施例中，引线框架连接到基板，使得引线从该基板突出。 引线框架连接到具有设置在基板之间的一个或多个微电子元件的另一基板。

公开(公告)号：US07768117B2

公开(公告)日：2010-08-03

申请号：US11809214

申请日：2007-05-30

Applicant: Belgacem Haba ,  Richard Dewitt Crisp ,  Masud Beroz

Inventor： Belgacem Haba ,  Richard Dewitt Crisp ,  Masud Beroz

IPC: H01L23/48 ,  H01L23/02

CPC classification number: H01L25/0657 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2223/6627 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/1903 ,  H01L2924/3011 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A microelectronic unit has a structure including a microelectronic element such as a semiconductor chip with a first contact disposed remote from the periphery of the structure. The unit further includes first and second redistribution conductive pads disposed near a periphery of the structure and a conductive path incorporating first and second conductors extending toward the first contact, these conductors being connected to one another adjacent the first contact. The conductive path is connected to the first contact, and can provide signal routing from the periphery of the unit to the contact without the need for long stubs. A package may include a plurality of such units, which may be stacked on one another with the redistribution conductive pads of the various units connected to one another.

Abstract translation: 微电子单元具有包括诸如半导体芯片的微电子元件的结构，其具有远离结构的周边设置的第一触点。 该单元还包括设置在结构的周边附近的第一和第二再分布导电焊盘以及包括朝向第一触点延伸的第一和第二导体的导电路径，这些导体彼此相邻地邻近第一接触。 导电路径连接到第一触点，并且可以提供从单元的外围到触点的信号路由，而不需要长存根。 封装可以包括多个这样的单元，其可以彼此堆叠，并且各个单元的再分配导电焊盘彼此连接。