公开(公告)号：US20140227832A1

公开(公告)日：2014-08-14

申请号：US14257017

申请日：2014-04-21

申请人： United Test and Assembly Center Ltd.

发明人： Chuen Khiang WANG ,  Nathapong SUTHIWONGSUNTHORN ,  Kriangsak SAE LE ,  Antonio Jr B DIMAANO ,  Catherine Bee Liang NG ,  Richard Te GAN ,  Kian Teng ENG

IPC分类号： H01L21/48 ,  H01L21/56

CPC分类号： H01L23/49861 ,  H01L21/2885 ,  H01L21/4825 ,  H01L21/4828 ,  H01L21/4832 ,  H01L21/4839 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/56 ,  H01L21/561 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/36 ,  H01L23/481 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49534 ,  H01L23/49537 ,  H01L23/49541 ,  H01L23/49575 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/06558 ,  H01L2225/1023 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A device is disclosed. The device includes a carrier substrate having first and second major surfaces. The first surface includes a die region and contact pads and the second surface includes package contacts. The carrier substrate includes a patterned lead frame which defines a line level with conductive traces and a via level with via contacts. The patterned lead frame provides interconnections between the contact pads and package contacts. The carrier substrate further includes a dielectric layer isolating the conductive traces and via contacts. The device includes a die mounted on the die region of the first surface.

摘要翻译： 公开了一种设备。 该装置包括具有第一和第二主表面的载体衬底。 第一表面包括管芯区域和接触焊盘，第二表面包括封装接触。 载体衬底包括图案化引线框架，其将导电迹线和具有通孔触点的通孔级限定在线路电平。 图案化引线框架提供接触焊盘和封装触点之间的互连。 载体衬底还包括隔离导电迹线和通孔触点的电介质层。 该装置包括安装在第一表面的管芯区域上的管芯。

公开(公告)号：US08037597B2

公开(公告)日：2011-10-18

申请号：US12062573

申请日：2008-04-04

申请人： Makoto Tsunekawa

发明人： Makoto Tsunekawa

IPC分类号： H01K3/00

CPC分类号： H05K3/0008 ,  H01L21/4839 ,  H01L23/49565 ,  H01L23/49582 ,  H01L23/544 ,  H01L24/80 ,  H01L2223/5442 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K1/0269 ,  H05K3/0091 ,  H05K3/0097 ,  H05K3/1216 ,  H05K3/28 ,  H05K2201/09918 ,  H05K2201/10681 ,  H05K2203/1545 ,  H05K2203/166 ,  Y10T29/49121 ,  Y10T29/49124 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/4916

摘要： Positioning marks are formed on both sides of each printing block on a tape carrier for TAB. A long-sized circuit board is transported by a roll-to-roll system in screen printing. When an optical sensor detects a positioning mark, transportation of the long-sized circuit board is stopped. Thereafter, the screen printing of a solder resist is performed to the printing block of the long-sized circuit board by a screen printing device.

摘要翻译： 定位标记形成在用于TAB的带载体上的每个印刷块的两侧。 一个长尺寸的电路板通过卷对卷系统进行丝网印刷传输。 当光学传感器检测到定位标记时，停止长尺寸电路板的输送。 此后，通过丝网印刷装置对长尺寸电路板的印刷块进行阻焊剂的丝网印刷。

公开(公告)号：US20090026592A1

公开(公告)日：2009-01-29

申请号：US11861094

申请日：2007-09-25

申请人： Chua Swee Kwang ,  Chia Yong Poo

发明人： Chua Swee Kwang ,  Chia Yong Poo

IPC分类号： H01L23/495 ,  H01L21/00

CPC分类号： H01L23/49575 ,  H01L21/4821 ,  H01L21/4825 ,  H01L21/4839 ,  H01L23/047 ,  H01L23/3114 ,  H01L23/49503 ,  H01L23/4951 ,  H01L24/32 ,  H01L24/48 ,  H01L29/0657 ,  H01L2224/05599 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10155 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/207 ,  H01L2924/00012 ,  H01L2224/85399

摘要： Semiconductor dies with recesses, associated leadframes, and associated systems and methods are disclosed. A semiconductor system in accordance with one embodiment includes a semiconductor die having a first surface and a second surface facing opposite from the first surface, with the first surface having a die recess. The system can further include a support paddle carrying the semiconductor die, with at least part of the support paddle being received in the die recess. In particular embodiments, the support paddle can form a portion of a leadframe. In other particular embodiments, the support paddle can include a paddle surface that faces toward the semiconductor die and has an opening extending through the paddle surface and through the support paddle.

摘要翻译： 公开了具有凹槽，相关联的引线框架以及相关系统和方法的半导体模具。 根据一个实施例的半导体系统包括具有第一表面和与第一表面相对的第二表面的半导体管芯，其中第一表面具有管芯凹部。 该系统还可以包括承载半导体管芯的支撑板，其中至少一部分支撑板被容纳在模具凹槽中。 在特定实施例中，支撑桨可以形成引线框架的一部分。 在其它具体实施例中，支撑桨可以包括面向半导体管芯的桨表面，并具有延伸通过桨表面并穿过支撑桨的开口。

公开(公告)号：US20070172992A1

公开(公告)日：2007-07-26

申请号：US11717399

申请日：2007-03-12

申请人： Ford Grigg

发明人： Ford Grigg

IPC分类号： H01L21/00

CPC分类号： G03F7/70416 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y80/00 ,  H01L21/4839 ,  H01L21/67132 ,  H01L23/3128 ,  H01L23/49833 ,  H01L23/4985 ,  H01L24/48 ,  H01L24/50 ,  H01L24/86 ,  H01L2224/05624 ,  H01L2224/45144 ,  H01L2224/4824 ,  H01L2224/85424 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  H05K1/0393 ,  H05K3/0023 ,  H05K3/0097 ,  H05K2201/09909 ,  H05K2201/2009 ,  H05K2203/1545 ,  Y02P80/30 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： Methods for fabricating stiffeners for flexible substrates, including, but not limited to, tapes, films, or other connective structures, which are configured to be secured to other semiconductor device components, are fabricated under control of a program. The stiffeners may be formed by selectively depositing or consolidating unconsolidated material. They may include a plurality of mutually adhered regions. The stiffeners may be configured to prevent torsional flexion or bending of the connective structure to which they are to be secured, to reinforce sprocket or indexing holes in connective structures or to include apertures through which intermediate conductive elements or other structures secured to the connective structure may be exposed or protrude.

公开(公告)号：US07183638B2

公开(公告)日：2007-02-27

申请号：US11027291

申请日：2004-12-30

申请人： Pete D. Vogt

发明人： Pete D. Vogt

IPC分类号： H01L23/02

CPC分类号： H01L23/3114 ,  H01L21/4839 ,  H01L23/36 ,  H01L23/3735 ,  H01L23/49816 ,  H01L23/4985 ,  H01L25/105 ,  H01L2225/06513 ,  H01L2225/06579 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/0002 ,  H01L2924/00

摘要： An embedded heat spreader includes a semiconductor die, an elastomer layer attached to the die, a tape lead attached to the elastomer, a portion of the tape lead exposed through the elastomer to connect with the die, a polymer resin attached to the tape lead, and a thermally conductive substrate attached to the polymer resin such that the thermally conductive substrate can spread heat from the semiconductor die.

摘要翻译： 嵌入式散热器包括半导体管芯，连接在管芯上的弹性体层，附着在弹性体上的带状引线，通过弹性体暴露的带状引线的一部分与模具连接，附着在带状引线上的聚合物树脂， 以及附着在聚合物树脂上的导热基板，使得导热基板能够从半导体管芯散热。

公开(公告)号：US20050101055A1

公开(公告)日：2005-05-12

申请号：US11020036

申请日：2004-12-23

申请人： Tetsuichiro Kasahara ,  Hideto Tanaka

发明人： Tetsuichiro Kasahara ,  Hideto Tanaka

IPC分类号： H01L21/56 ,  H01L21/48 ,  H01L21/60 ,  H01L21/68 ,  H01L23/495 ,  H01L23/50 ,  H01L21/44

CPC分类号： H01L21/561 ,  H01L21/4839 ,  H01L21/568 ,  H01L23/49572 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/85001 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： In a method of manufacturing a lead frame for use in a leadless package such as a quad flat non-leaded package (QFN), a base frame is first formed which includes a region for resin-molding a plurality of semiconductor elements to be mounted on one surface of the base frame, the region being partitioned into land shapes, and in which a die-pad portion and lead portions around the die-pad portion are defined severally for the individual semiconductor elements to be mounted in each of the partitioned regions for resin-molding. Next, an adhesive tape is attached to the other surface of the base frame, and subsequently a cut portion is provided at a portion corresponding to a region between two adjacent partitioned regions for resin-molding, of the adhesive tape.

公开(公告)号：US06875630B2

公开(公告)日：2005-04-05

申请号：US10279032

申请日：2002-10-24

申请人： Tetsuichiro Kasahara ,  Hideto Tanaka

发明人： Tetsuichiro Kasahara ,  Hideto Tanaka

IPC分类号： H01L21/56 ,  H01L21/48 ,  H01L21/60 ,  H01L21/68 ,  H01L23/495 ,  H01L23/50 ,  H01L21/44 ,  H01L21/50

CPC分类号： H01L21/561 ,  H01L21/4839 ,  H01L21/568 ,  H01L23/49572 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/85001 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： In a method of manufacturing a lead frame for use in a leadless package such as a quad flat non-leaded package (QFN), a base frame is first formed which includes a region for resin-molding a plurality of semiconductor elements to be mounted on one surface of the base frame, the region being partitioned into land shapes, and in which a die-pad portion and lead portions around the die-pad portion are defined severally for the individual semiconductor elements to be mounted in each of the partitioned regions for resin-molding. Next, an adhesive tape is attached to the other surface of the base frame, and subsequently a cut portion is provided at a portion corresponding to a region between two adjacent partitioned regions for resin-molding, of the adhesive tape.

摘要翻译： 在制造用于诸如四边形扁平非引线封装（QFN）的无引线封装的引线框架的方法中，首先形成基架，其包括用于树脂成型多个待安装的半导体元件的区域 基部框架的一个表面，该区域被划分为平台形状，并且其中模具焊盘部分和芯片焊盘部分周围的引线部分被分别限定为将各个半导体元件安装在每个分隔区域中 树脂成型。 接下来，将粘合带安装在基架的另一个表面上，随后在对应于两个相邻的用于树脂成型的分隔区之间的区域的部分设置切割部分。

公开(公告)号：US20020017716A1

公开(公告)日：2002-02-14

申请号：US09893753

申请日：2001-06-29

发明人： Tatsuya Ohtaka ,  Sachio Suzuki

IPC分类号： H01L023/52 ,  H01L023/495 ,  H01L023/48

CPC分类号： H01L23/49822 ,  H01L21/4839 ,  H01L21/4857 ,  H01L23/4985 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15321 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A TAB tape with a stiffener is prepared by bonding a one-metal TAB tape 20 having a structure wherein a circuit pattern 21 is formed on either surface of a first tape base material, a part thereof is covered with an insulating film 2, and a via hole 12 is defined on a connecting regional section 25 for via, to a tape 30 for second metal prepared by providing a metallic foil layer 14 on either surface of a second tape base material 15 through an adhesive layer 15; the connecting regional section 25 for via on the upper edge of a via hole is electrically connected with a part of the metallic foil layer 14 on the bottom of the hole by means of conducting means (4, 16, and 18), and at the same time, an exposed portion 32 of the metallic foil layer 14, which has not been covered with the one-metal TAB tape 20, is connected to an electrode 71 of a ground line in the semiconductor 7 by means of a bonding wire 83 to lead a ground potential. Thus, an inexpensive TAB tape with a stiffener having equivalent electrical characteristics to that in the case where a conventional two-metal and one-base material TAB tape is used, and a TBGA semiconductor device using such TAB tape with a stiffener is obtained.

摘要翻译： 通过将具有其中在第一带基材的任一表面上形成电路图案21，其一部分被绝缘膜2覆盖的结构的单金属TAB带20粘结在一起，制成具有加强件的TAB带， 将通孔12限定在用于通孔的连接区域部分25上，以通过在第二带基材15的任一表面上通过粘合剂层15提供金属箔层14而制成的第二金属带30; 在通孔的上边缘上的通孔的连接区域部分25通过导电装置（4,16和18）与孔的底部上的金属箔层14的一部分电连接，并且在 同时，未被一金属TAB带20覆盖的金属箔层14的露出部32通过接合线83与半导体7中的接地线的电极71连接， 引发地面潜力。 因此，获得具有与使用常规的两金属和单基材料TAB带的情况相同的电特性的加强件的便宜的TAB带，以及使用这种具有加强件的TAB带的TBGA半导体器件。

公开(公告)号：US06307260B1

公开(公告)日：2001-10-23

申请号：US09395105

申请日：1999-09-14

申请人： John W. Smith ,  Joseph Fjelstad

发明人： John W. Smith ,  Joseph Fjelstad

IPC分类号： H01L2348

CPC分类号： H01L23/22 ,  H01L21/4839 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L23/642 ,  H01L24/13 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15174 ,  H01L2924/351 ,  H05K1/118 ,  H05K3/361 ,  H05K3/4084 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2203/063 ,  H01L2924/00

摘要： A structure including a conductive, preferably metallic conductive layer is provided with leads on a bottom surface. The leads have fixed ends permanently attached to the structure and free ends detachable from the structure. The structure is engaged with a microelectronic element such as a semiconductor chip or wafer, the free ends of the leads are bonded to the microelectronic element, and the leads are bent by moving the structure relative to the microelectronic element. Portions of the conductive layer are removed, leaving residual portions of the conductive layer as separate electrical terminals connected to at least some of the leads. The conductive layer mechanically stabilizes the structure before bonding, and facilitates precise registration of the leads with the microelectronic element. After the conductive layer is converted to separate terminals, it does not impair free movement of the terminals relative to the microelectronic element.

摘要翻译： 包括导电优选金属导电层的结构在底表面上设置有引线。 引线具有永久地附接到结构的固定端部和从结构可拆卸的自由端。 该结构与诸如半导体芯片或晶片的微电子元件接合，引线的自由端接合到微电子元件，并且通过相对于微电子元件移动结构而使引线弯曲。 导电层的一部分被去除，导致导电层的剩余部分作为分开的电端子连接到至少一些引线。 导电层在结合之前机械稳定结构，并且有助于引线与微电子元件的精确对准。 在将导电层转换成单独的端子之后，它不会损害端子相对于微电子元件的自由移动。

公开(公告)号：US06228685B1

公开(公告)日：2001-05-08

申请号：US09174074

申请日：1998-10-16

申请人： Masud Beroz ,  Thomas H. DiStefano ,  John W. Smith

发明人： Masud Beroz ,  Thomas H. DiStefano ,  John W. Smith

IPC分类号： H01L4400

CPC分类号： H01L23/544 ,  H01L21/4839 ,  H01L21/563 ,  H01L21/6836 ,  H01L23/22 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L23/642 ,  H01L24/50 ,  H01L24/72 ,  H01L24/86 ,  H01L2221/68327 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3025 ,  H05K1/118 ,  H05K3/361 ,  H05K3/4084 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063

摘要： A microelectronic component is fabricated by bonding a flexible sheet in tension on a rigid frame so that the sheet spans an aperture in the frame, and performing one or more operations on features on the flexible sheet which will be incorporated into the finished component. The fame maintains dimensional stability of the sheet and aids in regsitration of the sheet with external elements such as processing tools or other parts which are to be assembled with the sheet. Desirably, the frame has a coefficient of thermal expansion different from that of the sheet so that when the sheet is brought from the bonding temperature to the temperature used in processing, differential thermal expansion or contraction will cause increased tension in the sheet.

摘要翻译： 通过将刚性框架上的张力柔性片粘合在刚性框架上来制造微电子部件，使得片材跨越框架中的孔，并对将被并入成品部件的柔性片材上的特征进行一个或多个操作。 名气维持片材的尺寸稳定性，并有助于片材的外部元件如加工工具或与片材组装的其他部件的注册。 理想地，框架具有与片材不同的热膨胀系数，使得当片材从接合温度提高到加工中使用的温度时，差分热膨胀或收缩将导致片材的张力增加。