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公开(公告)号：US07152311B2
公开(公告)日：2006-12-26
申请号：US10032886
申请日：2001-12-26
IPC分类号： B23P19/04
CPC分类号： H01L24/86 , B29C2043/5825 , H01L21/67144 , H01L2224/7965 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , H01L2924/30105 , Y10S269/909 , Y10T29/53265 , Y10T29/53435 , Y10T428/23 , Y10T428/239 , H01L2924/00
摘要： A flexible sheet used in manufacture of microelectronic components is held on a frame formed from a rigid material so that the frame maintains the sheet under tension during processing and thereby stabilizes the dimensions of the sheet. The frame may be formed from a rigid, light-transmissive material such as a glass, and the bond between the frame and sheet may be made or released by light transmitted through the frame. Preferred features of the framed sheet minimize entrapment of processing liquids such as etch solutions, thereby minimizing carryover of processing solutions between steps. The frame may have contact openings which permit engagement of a metallic layer on the sheet by an electrode carrying electroplating or etching current without disturbing the main portion of the sheet where features are to be formed or treated.
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公开(公告)号：US06338982B1
公开(公告)日：2002-01-15
申请号：US09688397
申请日：2000-10-16
IPC分类号： H01L2102
CPC分类号： H01L24/86 , B29C2043/5825 , H01L21/67144 , H01L2224/7965 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , H01L2924/30105 , Y10S269/909 , Y10T29/53265 , Y10T29/53435 , Y10T428/23 , Y10T428/239 , H01L2924/00
摘要： A flexible sheet used in manufacture of microelectronic components is held on a frame formed from a rigid material so that the frame maintains the sheet under tension during processing and thereby stabilizes the dimensions of the sheet. The frame may be formed from a rigid, light-transmissive material such as a glass, and the bond between the frame and sheet may be made or released by light transmitted through the frame. Preferred features of the framed sheet minimize entrapment of processing liquids such as etch solutions, thereby minimizing carryover of processing solutions between steps. The frame may have contact openings which permit engagement of a metallic layer on the sheet by an electrode carrying electroplating or etching current without disturbing the main portion of the sheet where features are to be formed or treated.
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公开(公告)号：US06217972B1
公开(公告)日：2001-04-17
申请号：US09173797
申请日：1998-10-16
IPC分类号： B32B104
CPC分类号： H01L24/86 , B29C2043/5825 , H01L21/67144 , H01L2224/7965 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , H01L2924/30105 , Y10S269/909 , Y10T29/53265 , Y10T29/53435 , Y10T428/23 , Y10T428/239 , H01L2924/00
摘要： A flexible sheet used in manufacture of microelectronic components is held on a frame formed from a rigid material so that the frame maintains the sheet under tension during processing and thereby stabilizes the dimensions of the sheet. The frame may be formed from a rigid, light-transmissive material such as a glass, and the bond between the frame and sheet may be made or released by light transmitted through the frame. Preferred features of the framed sheet minimize entrapment of processing liquids such as etch solutions, thereby minimizing carryover of processing solutions between steps. The frame may have contact openings which permit engagement of a metallic layer on the sheet by an electrode carrying electroplating or etching current without disturbing the main portion of the sheet where features are to be formed or treated.
摘要翻译： 用于制造微电子部件的柔性片被保持在由刚性材料形成的框架上，使得框架在处理期间将片材保持在张力下，从而稳定片材的尺寸。 框架可以由诸如玻璃的刚性透光材料形成，并且框架和片材之间的结合可以由透射通过框架的光制成或释放。 框架板的优选特征使得诸如蚀刻溶液的处理液体的捕获最小化，从而最小化步骤之间的处理溶液的携带。 框架可以具有接触开口，其允许通过携带电镀或蚀刻电流的电极在片材上接合金属层，而不会干扰要形成或处理特征的片材的主要部分。
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公开(公告)号：US06541852B2
公开(公告)日：2003-04-01
申请号：US09781374
申请日：2001-02-12
申请人： Masud Beroz , Thomas H. DiStefano , John W. Smith
发明人： Masud Beroz , Thomas H. DiStefano , John W. Smith
IPC分类号： H01L2100
CPC分类号： H01L23/544 , H01L21/563 , H01L21/6836 , H01L2221/68327 , H01L2223/54426 , H01L2223/54453 , H01L2224/50 , H01L2224/86 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , H01L2924/30105 , H01L2924/00 , H01L2924/00012
摘要： A microelectronic component is fabricated by bonding a flexible sheet in tension on a rigid frame so that the sheet spans an aperture in the frame, and performing one or more operations on features on the flexible sheet which will be incorporated into the finished component. The frame maintains dimensional stability of the sheet and aids in regsitration of the sheet with external elements such as processing tools or other parts which are to be assembled with the sheet. Desirably, the frame has a coefficient of thermal expansion different from that of the sheet so that when the sheet is brought from the bonding temperature to the temperature used in processing, differential thermal expansion or contraction will cause increased tension in the sheet.
摘要翻译： 通过将刚性框架上的张力柔性片粘合在刚性框架上来制造微电子部件，使得片材跨越框架中的孔，并对将被并入成品部件的柔性片材上的特征进行一个或多个操作。 该框架保持片材的尺寸稳定性，并有助于片材的外部元件（例如加工工具或与片材组装的其它部件）的注册。 理想地，框架具有与片材不同的热膨胀系数，使得当片材从接合温度提高到加工中使用的温度时，差分热膨胀或收缩将导致片材的张力增加。
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公开(公告)号：US06228685B1
公开(公告)日：2001-05-08
申请号：US09174074
申请日：1998-10-16
申请人： Masud Beroz , Thomas H. DiStefano , John W. Smith
发明人： Masud Beroz , Thomas H. DiStefano , John W. Smith
IPC分类号： H01L4400
CPC分类号： H01L23/544 , H01L21/4839 , H01L21/563 , H01L21/6836 , H01L23/22 , H01L23/49811 , H01L23/49816 , H01L23/49827 , H01L23/4985 , H01L23/642 , H01L24/50 , H01L24/72 , H01L24/86 , H01L2221/68327 , H01L2223/54426 , H01L2223/54453 , H01L2224/16 , H01L2224/73253 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/14 , H01L2924/15174 , H01L2924/15311 , H01L2924/16152 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/3025 , H05K1/118 , H05K3/361 , H05K3/4084 , H05K2201/0133 , H05K2201/0394 , H05K2201/0397 , H05K2201/09081 , H05K2201/091 , H05K2203/063
摘要： A microelectronic component is fabricated by bonding a flexible sheet in tension on a rigid frame so that the sheet spans an aperture in the frame, and performing one or more operations on features on the flexible sheet which will be incorporated into the finished component. The fame maintains dimensional stability of the sheet and aids in regsitration of the sheet with external elements such as processing tools or other parts which are to be assembled with the sheet. Desirably, the frame has a coefficient of thermal expansion different from that of the sheet so that when the sheet is brought from the bonding temperature to the temperature used in processing, differential thermal expansion or contraction will cause increased tension in the sheet.
摘要翻译： 通过将刚性框架上的张力柔性片粘合在刚性框架上来制造微电子部件，使得片材跨越框架中的孔，并对将被并入成品部件的柔性片材上的特征进行一个或多个操作。 名气维持片材的尺寸稳定性，并有助于片材的外部元件如加工工具或与片材组装的其他部件的注册。 理想地，框架具有与片材不同的热膨胀系数，使得当片材从接合温度提高到加工中使用的温度时，差分热膨胀或收缩将导致片材的张力增加。
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6.发明授权公开(公告)号：US06261863B1
公开(公告)日：2001-07-17
申请号：US09471973
申请日：1999-12-23
IPC分类号： H01L2144
CPC分类号： H05K3/4092 , H01L23/49811 , H01L23/4985 , H01L23/5387 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： A connection component for a microelectronic device such as a semiconductor chip incorporates a support layer and conductive structures extending across a surface of the support layer. The conductive structures have anchors connecting them to the support layer, and releasable or unanchored portions. A method of making a connection component includes removing material from the conductive structures or the support layer or both to form the anchors.
摘要翻译： 用于诸如半导体芯片的微电子器件的连接部件包括支撑层和延伸穿过支撑层的表面的导电结构。 导电结构具有将它们连接到支撑层，以及可释放或未锚定部分的锚固件。 制造连接部件的方法包括从导电结构或支撑层或两者移除材料以形成锚固件。
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公开(公告)号：US06215191B1
公开(公告)日：2001-04-10
申请号：US09281460
申请日：1999-03-30
IPC分类号： H01L2348
CPC分类号： H01L21/4821 , H01L23/49579 , H01L24/50 , H01L2924/12042 , H01L2924/351 , H01L2924/00
摘要： A method of treating a lead in a chip package. A conductive lead is positioned such that it extends across a gap in a dielectric substrate and is secured at either end to a first surface of the substrate. Directed energy is then applied to a desired portion of the surface of the lead within the gap. As a result of the application of energy, a surface layer of the lead is recrystallized thereby creating a fine grain, dense surface layer of lead material. Surface contaminates may be vaporized and contaminants at the grain boundaries of the recrystallized surface layers may be driven away from the grain boundaries such that a treated lead is more ductile and has better resistance to thermal cycling after the lead has been attached to a chip contact.
摘要翻译： 一种处理芯片封装中的引线的方法。 导电引线定位成使得其延伸穿过电介质基板中的间隙，并且在任一端固定到基板的第一表面。 然后将定向能量施加到间隙内的引线表面的期望部分。 作为施加能量的结果，铅的表面层被再结晶，从而形成细晶粒，致密的铅材料表面层。 表面污染物可能被蒸发，并且再结晶表面层的晶界处的污染物可能被驱离离开晶界，使得处理的引线更具延展性，并且在引线已经附着到芯片接触之后具有更好的耐热循环性。
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8.发明授权公开(公告)号：US06541845B2
公开(公告)日：2003-04-01
申请号：US09777781
申请日：2001-02-06
IPC分类号： H01L2144
CPC分类号： H05K3/4092 , H01L23/49811 , H01L23/4985 , H01L23/5387 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： A connection component for a microelectronic device such as a semiconductor chip incorporates a support layer and conductive structures extending across a surface of the support layer. The conductive structures have anchors connecting them to the support layer, and releasable or unanchored portions.
摘要翻译： 用于诸如半导体芯片的微电子器件的连接部件包括支撑层和延伸穿过支撑层的表面的导电结构。 导电结构具有将它们连接到支撑层，以及可释放或未锚定部分的锚固件。
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公开(公告)号：US06938338B2
公开(公告)日：2005-09-06
申请号：US10417746
申请日：2003-04-17
IPC分类号： B23K1/19 , G01R1/04 , G01R1/067 , G01R1/073 , G01R3/00 , G01R31/28 , H01L21/48 , H01L23/48 , H01L23/498 , H01R4/02 , H01R12/00 , H01R12/52 , H01R12/57 , H01R12/70 , H01R12/71 , H01R13/24 , H01R43/16 , H05K1/11 , H05K3/32 , H05K3/34 , H05K3/40 , H05K7/08 , H05K7/10
CPC分类号： H05K7/1084 , G01R1/0466 , G01R1/06711 , G01R1/06727 , G01R1/06733 , G01R1/06744 , G01R1/07357 , G01R3/00 , H01L21/4853 , H01L23/49816 , H01L23/49827 , H01L24/81 , H01L2224/16237 , H01L2224/45144 , H01L2224/8114 , H01L2224/81385 , H01L2224/81899 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/12042 , H01L2924/14 , H01L2924/30107 , H01R12/7076 , H01R13/2485 , H05K1/118 , H05K3/326 , H05K3/3431 , H05K3/3436 , H05K3/4092 , H05K7/1069 , H05K2201/0382 , H05K2201/0397 , H05K2201/1059 , H05K2201/10734 , Y02P70/613 , Y10T29/49117 , Y10T29/49126 , Y10T29/49155 , Y10T29/49156 , Y10T29/49204 , Y10T29/4921 , Y10T29/49222 , Y10T29/49224 , H01L2924/00
摘要： Microelectronic contacts, such as flexible, tab-like, cantilever contacts, are provided with asperities disposed in a regular pattern. Each asperity has a sharp feature at its tip remote from the surface of the contact. As mating microelectronic elements are engaged with the contacts, a wiping action causes the sharp features of the asperities to scrape the mating element, so as to provide effective electrical interconnection and, optionally, effective metallurgical bonding between the contact and the mating element upon activation of a bonding material.
摘要翻译： 诸如柔性的，片状的悬臂触点之类的微电子触点具有以规则图案设置的凹凸。 每个粗糙部分的尖端具有远离接触表面的尖端特征。 当配合的微电子元件与触点接合时，擦拭动作导致粗糙的尖锐特征刮擦配合元件，以便在触发和配合元件激活时提供有效的电互连以及可选的有效的冶金结合 接合材料。
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公开(公告)号：US06635553B1
公开(公告)日：2003-10-21
申请号：US09721048
申请日：2000-11-22
申请人： Thomas H. DiStefano , John W. Smith
发明人： Thomas H. DiStefano , John W. Smith
IPC分类号： H01L2130
CPC分类号： H01L23/4985 , H01L21/4839 , H01L23/22 , H01L23/49811 , H01L23/49816 , H01L23/49827 , H01L23/642 , H01L24/72 , H01L2224/16 , H01L2224/45124 , H01L2224/73253 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01066 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/07802 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15174 , H01L2924/15311 , H01L2924/16152 , H01L2924/19041 , H01L2924/19043 , H01L2924/3025 , H01L2924/351 , H05K1/118 , H05K3/361 , H05K3/4084 , H05K2201/0133 , H05K2201/0394 , H05K2201/0397 , H05K2201/09081 , H05K2201/091 , H05K2203/063 , Y10T29/49126 , Y10T29/49144 , Y10T29/49158 , H01L2924/00 , H01L2224/48
摘要： A microelectronic connection component includes a support such as a dielectric sheet having elongated leads extending along a surface. The leads have terminal ends permanently connected to the support and tip ends releasably connected to the support. The support is juxtaposed with a further element such as a semiconductor chip or wafer, and tip ends of the leads are bonded to contacts on the wafer using a bonding tool advanced through holes in the support. After bonding, the support and the further element are moved away from one another so as to deform the leads.
摘要翻译： 微电子连接部件包括诸如具有沿着表面延伸的细长引线的电介质片的支撑件。 引线具有永久地连接到支撑件的端部端部和可释放地连接到支撑件的尖端端部。 支撑件与诸如半导体芯片或晶片的另外的元件并置，并且引线的尖端使用通过支撑件中的孔前进的焊接工具结合到晶片上的触点。 在粘合之后，支撑件和另外的元件彼此远离，以使引线变形。
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