发明授权
- 专利标题： Embedded heat spreader
- 专利标题（中）： 嵌入式散热器
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申请号： US11027291申请日： 2004-12-30
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公开(公告)号： US07183638B2公开(公告)日： 2007-02-27
- 发明人: Pete D. Vogt
- 申请人： Pete D. Vogt
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Marger Johnson & McCollom, P.C.
- 主分类号： H01L23/02
- IPC分类号： H01L23/02
摘要：
An embedded heat spreader includes a semiconductor die, an elastomer layer attached to the die, a tape lead attached to the elastomer, a portion of the tape lead exposed through the elastomer to connect with the die, a polymer resin attached to the tape lead, and a thermally conductive substrate attached to the polymer resin such that the thermally conductive substrate can spread heat from the semiconductor die.
公开/授权文献
- US20060145320A1 Embedded heat spreader 公开/授权日：2006-07-06
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