发明授权
- 专利标题： Lead frame, method of manufacturing the same, and method of manufacturing a semiconductor device using the same
- 专利标题（中）： 引线框架及其制造方法以及使用其制造半导体器件的方法
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申请号： US10279032申请日： 2002-10-24
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公开(公告)号： US06875630B2公开(公告)日： 2005-04-05
- 发明人: Tetsuichiro Kasahara , Hideto Tanaka
- 申请人： Tetsuichiro Kasahara , Hideto Tanaka
- 申请人地址： JP Nagano
- 专利权人： Shinko Electric Industries Co., Ltd.
- 当前专利权人： Shinko Electric Industries Co., Ltd.
- 当前专利权人地址： JP Nagano
- 代理机构： Armstrong, Kratz, Quintos, Hanson & Brooks, LLP
- 优先权： JP2001-328528 20011026
- 主分类号： H01L21/56
- IPC分类号： H01L21/56 ; H01L21/48 ; H01L21/60 ; H01L21/68 ; H01L23/495 ; H01L23/50 ; H01L21/44 ; H01L21/50
摘要：
In a method of manufacturing a lead frame for use in a leadless package such as a quad flat non-leaded package (QFN), a base frame is first formed which includes a region for resin-molding a plurality of semiconductor elements to be mounted on one surface of the base frame, the region being partitioned into land shapes, and in which a die-pad portion and lead portions around the die-pad portion are defined severally for the individual semiconductor elements to be mounted in each of the partitioned regions for resin-molding. Next, an adhesive tape is attached to the other surface of the base frame, and subsequently a cut portion is provided at a portion corresponding to a region between two adjacent partitioned regions for resin-molding, of the adhesive tape.
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