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公开(公告)号：US20050101055A1
公开(公告)日：2005-05-12
申请号：US11020036
申请日：2004-12-23
CPC分类号： H01L21/561 , H01L21/4839 , H01L21/568 , H01L23/49572 , H01L24/48 , H01L24/97 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48247 , H01L2224/85001 , H01L2224/85399 , H01L2224/97 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/181 , H01L2924/18165 , H01L2224/85 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： In a method of manufacturing a lead frame for use in a leadless package such as a quad flat non-leaded package (QFN), a base frame is first formed which includes a region for resin-molding a plurality of semiconductor elements to be mounted on one surface of the base frame, the region being partitioned into land shapes, and in which a die-pad portion and lead portions around the die-pad portion are defined severally for the individual semiconductor elements to be mounted in each of the partitioned regions for resin-molding. Next, an adhesive tape is attached to the other surface of the base frame, and subsequently a cut portion is provided at a portion corresponding to a region between two adjacent partitioned regions for resin-molding, of the adhesive tape.
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2.发明授权Lead frame, method of manufacturing the same, and method of manufacturing a semiconductor device using the same 失效引线框架及其制造方法以及使用其制造半导体器件的方法公开(公告)号：US06875630B2
公开(公告)日：2005-04-05
申请号：US10279032
申请日：2002-10-24
IPC分类号： H01L21/56 , H01L21/48 , H01L21/60 , H01L21/68 , H01L23/495 , H01L23/50 , H01L21/44 , H01L21/50
CPC分类号： H01L21/561 , H01L21/4839 , H01L21/568 , H01L23/49572 , H01L24/48 , H01L24/97 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48247 , H01L2224/85001 , H01L2224/85399 , H01L2224/97 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/181 , H01L2924/18165 , H01L2224/85 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： In a method of manufacturing a lead frame for use in a leadless package such as a quad flat non-leaded package (QFN), a base frame is first formed which includes a region for resin-molding a plurality of semiconductor elements to be mounted on one surface of the base frame, the region being partitioned into land shapes, and in which a die-pad portion and lead portions around the die-pad portion are defined severally for the individual semiconductor elements to be mounted in each of the partitioned regions for resin-molding. Next, an adhesive tape is attached to the other surface of the base frame, and subsequently a cut portion is provided at a portion corresponding to a region between two adjacent partitioned regions for resin-molding, of the adhesive tape.
摘要翻译： 在制造用于诸如四边形扁平非引线封装（QFN）的无引线封装的引线框架的方法中，首先形成基架，其包括用于树脂成型多个待安装的半导体元件的区域 基部框架的一个表面，该区域被划分为平台形状，并且其中模具焊盘部分和芯片焊盘部分周围的引线部分被分别限定为将各个半导体元件安装在每个分隔区域中 树脂成型。 接下来，将粘合带安装在基架的另一个表面上，随后在对应于两个相邻的用于树脂成型的分隔区之间的区域的部分设置切割部分。
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3.发明授权Lead frame, method of manufacturing the same, and method of manufacturing a semiconductor device using the same 失效引线框架及其制造方法以及使用其制造半导体器件的方法公开(公告)号：US07259044B2
公开(公告)日：2007-08-21
申请号：US11020036
申请日：2004-12-23
IPC分类号： H01L21/44
CPC分类号： H01L21/561 , H01L21/4839 , H01L21/568 , H01L23/49572 , H01L24/48 , H01L24/97 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48247 , H01L2224/85001 , H01L2224/85399 , H01L2224/97 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/181 , H01L2924/18165 , H01L2224/85 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： In a method of manufacturing a lead frame for use in a leadless package such as a quad flat non-leaded package (QFN), a base frame is first formed which includes a region for resin-molding a plurality of semiconductor elements to be mounted on one surface of the base frame, the region being partitioned into land shapes, and in which a die-pad portion and lead portions around the die-pad portion are defined severally for the individual semiconductor elements to be mounted in each of the partitioned regions for resin-molding. Next, an adhesive tape is attached to the other surface of the base frame, and subsequently a cut portion is provided at a portion corresponding to a region between two adjacent partitioned regions for resin-molding, of the adhesive tape.
摘要翻译： 在制造用于诸如四边形扁平非引线封装（QFN）的无引线封装的引线框架的方法中，首先形成基架，其包括用于树脂成型多个待安装的半导体元件的区域 基部框架的一个表面，该区域被划分为平台形状，并且其中模具焊盘部分和芯片焊盘部分周围的引线部分被分别限定为将各个半导体元件安装在每个分隔区域中 树脂成型。 接下来，将粘合带安装在基架的另一个表面上，随后在对应于两个相邻的用于树脂成型的分隔区之间的区域的部分设置切割部分。
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公开(公告)号：US06630370B2
公开(公告)日：2003-10-07
申请号：US09407303
申请日：1999-09-29
IPC分类号： H01L2328
CPC分类号： G06K19/07779 , G06K19/07749 , G06K19/07783 , H01L2224/48091 , H01L2224/48472 , H05K1/0393 , H05K1/165 , H05K3/0052 , H05K3/202 , H05K3/281 , H05K2201/10424 , H01L2924/00014 , H01L2924/00
摘要： A process for manufacturing an IC card includes a step of forming a plane coil by etching or punching a thin metal plate so that the plane coil consists of a conductor line wound as several loops in substantially the same plane and has respective terminals. A semiconductor element having electrodes is mounted on the plane coil. An adhesive agent or tape is attached to a predetermined area of the plane coil so that adjacent conductor lines in the loops are kept a predetermined gap therebetween. The plane coil is disposed between a pair of films to cover the plane coil therebetween, one of the films being provided with adhesive layer on a surface facing to the other film to seal the plane coil with the semiconductor element by attaching the pair of films with respect to each other by means of the adhesive layer.
摘要翻译： IC卡的制造方法包括通过蚀刻或冲压薄金属板来形成平面线圈的步骤，使得平面线圈由在大体上相同的平面上缠绕成几个环的导体线组成并且具有各自的端子。 具有电极的半导体元件安装在平面线圈上。 粘合剂或胶带附着到平面线圈的预定区域，使得环中的相邻导体线保持在其间的预定间隙。 平面线圈设置在一对薄膜之间以覆盖它们之间的平面线圈，其中一个膜在面向另一个薄膜的表面上设置有粘合剂层，以通过将该对薄膜与 通过粘合剂层彼此相对。
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公开(公告)号：US06797543B2
公开(公告)日：2004-09-28
申请号：US10610526
申请日：2003-07-02
IPC分类号： H01L2328
CPC分类号： G06K19/07779 , G06K19/07749 , G06K19/07783 , H01L2224/48091 , H01L2224/48472 , H05K1/0393 , H05K1/165 , H05K3/0052 , H05K3/202 , H05K3/281 , H05K2201/10424 , H01L2924/00014 , H01L2924/00
摘要： A process for manufacturing an IC card includes a step of forming a plane coil by etching or punching a thin metal plate so that the plane coil consists of a conductor line wound as several loops in substantially the same plane and has respective terminals. A semiconductor element having electrodes is mounted on the plane coil. An adhesive agent or tape is attached to a predetermined area of the plane coil so that adjacent conductor lines in the loops are kept a predetermined gap therebetween. The plane coil is disposed between a pair of films to cover the plane coil therebetween, one of the films being provided with adhesive layer on a surface facing to the other film to seal the plane coil with the semiconductor element by attaching the pair of films with respect to each other by means of the adhesive layer.
摘要翻译： IC卡的制造方法包括通过蚀刻或冲压薄金属板来形成平面线圈的步骤，使得平面线圈由在大体上相同的平面上缠绕成几个环的导体线组成并且具有各自的端子。 具有电极的半导体元件安装在平面线圈上。 粘合剂或胶带附着到平面线圈的预定区域，使得环中的相邻导体线保持在其间的预定间隙。 平面线圈设置在一对薄膜之间以覆盖它们之间的平面线圈，其中一个膜在面向另一个薄膜的表面上设置有粘合剂层，以通过将该对薄膜与 通过粘合剂层彼此相对。
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公开(公告)号：US07237319B2
公开(公告)日：2007-07-03
申请号：US10833268
申请日：2004-04-28
CPC分类号： H01F41/041 , H01Q1/38 , H01Q9/27 , Y10T29/4902 , Y10T29/49073 , Y10T29/49124 , Y10T29/4913 , Y10T29/49135 , Y10T29/49156
摘要： First, a sheet member which is being unwound and conveyed from a winding body, and in which a conductive film is stuck on a support sheet, is stamped in such a shape that a coil portion, a frame portion defined around the coil portion, and a joining portion connecting the coil portion to the frame portion are left unstamped. Next, a protective sheet which is made sticky, is stuck onto a surface of the stamped structure where the conductive film is stuck, and then the support sheet is peeled off. Next, an insulative support sheet which is being unwound and conveyed from a winding body, is stuck onto a surface of the structure with the protective sheet stuck thereon where the stamped conductive film is stuck, and then the protective sheet is peeled off.
摘要翻译： 首先，将从卷绕体展开和传送的片状部件，其中导电膜粘贴在支撑片上的片状部件被冲压成线圈部分，围绕线圈部分限定的框架部分和 将线圈部分连接到框架部分的接合部分保持不粘。 接着，将粘贴的保护片粘贴在印有导电膜的冲压结构的表面上，然后剥离支撑片。 接下来，将从卷绕体退绕并输送的绝缘支撑片粘贴到结构体的表面上，其上贴有压印导电膜的保护片，然后将保护片剥离。
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公开(公告)号：US06631847B1
公开(公告)日：2003-10-14
申请号：US09573503
申请日：2000-05-18
IPC分类号： G06K1900
CPC分类号： G06K19/07749 , H01L2224/48091 , H01L2224/48472 , H01L2224/49175 , H01L2924/00014
摘要： There is provided an IC card having a plane coil in which a short circuit is seldom caused by the deformation generated by an external force given to the plane coil in the traverse direction. An IC card 10 comprises a rectangular plane coil 14 formed by punching or etching a thin metallic sheet in which a conductor line 12 is wound a plurality of times on substantially the same plane, wherein terminals at both ends of the plane coil 14 and electrode terminals of a semiconductor element 16 are electrically connected with each other, and a bent portion 20 composed of a curved portion in which the conductor 12 on each winding composing a linear portion of the plane coil 14 is curved at the substantially same position in the same direction is formed in the conductor on each winding of the plane coil 14.
摘要翻译： 提供了具有平面线圈的IC卡，其中由于在横向方向上施加给平面线圈的外力产生的变形很少导致短路。 IC卡
10 包括通过冲压或蚀刻薄金属片形成的矩形平面线圈 14 ，其中导线 在平面线圈 14 的两端的端子和基本相同的平面上缠绕多个 半导体元件 16 的电极端子彼此电连接，并且由弯曲部分组成的弯曲部分 20 其中构成平面线圈 14 的直线部分的每个绕组上的导体 12 在基本相同的位置处弯曲 在平面线圈 14的每个绕组上的导体中形成相同的方向。
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