Printed circuit board and semiconductor module including the same

    公开(公告)号:US11758652B2

    公开(公告)日:2023-09-12

    申请号:US17360417

    申请日:2021-06-28

    CPC classification number: H05K1/111 H05K1/181 H05K2201/09745

    Abstract: A printed circuit board (PCB) includes: an insulation substrate; a first pad on the insulation substrate; and a second pad on the insulation substrate and spaced apart from the first pad, wherein the second pad has a size substantially the same as a size of the first pad, wherein the first pad includes a first recess configured to receive a first electrode of a passive element, wherein the second pad includes a second recess receiving a second electrode of the passive element, wherein the first recess has a depth substantially the same as a thickness of the first pad, wherein the second recess has a depth substantially the same as a thickness of the second pad, wherein each of the first recess and the second recess exposes an upper surface of the insulation substrate.

    Module board and memory module including the same

    公开(公告)号:US11477880B2

    公开(公告)日:2022-10-18

    申请号:US17337850

    申请日:2021-06-03

    Abstract: A module board and a memory module are provided. The module board includes a first branch line for connecting a clock signal terminal disposed on at least one surface to a first branch point; a first signal line for connecting the first branch point to a first module clock signal terminal; a second signal line for connecting the first module clock signal terminal to the kth module clock signal terminal and a first termination resistance terminal; a third signal line for connecting the first branch point to a (k+1)th module clock signal terminal; and a fourth signal line for connecting the (k+1)th module clock signal terminal to a 2kth module clock signal terminal and the second termination resistance terminal, wherein a length of the third signal line is greater than a sum of a length of the first signal line and a length of the second signal line.

    COMMUNICATION APPARATUS, METHOD, AND SYSTEM FOR USING MULTIMEDIA SERVICE
    30.
    发明申请
    COMMUNICATION APPARATUS, METHOD, AND SYSTEM FOR USING MULTIMEDIA SERVICE 审中-公开
    通信设备,使用多媒体服务的方法和系统

    公开(公告)号:US20150207847A1

    公开(公告)日:2015-07-23

    申请号:US14600429

    申请日:2015-01-20

    Abstract: An apparatus and a method to support visible and audible communications using various multimedia services are provided. A method to provide communications using a multimedia service in a server of a communication system is provided. The method includes receiving a voice call connection request for a second device from a first device. The method also includes providing the first device with visual multimedia information generated in advance, over a web network in relation to the second device. The method further includes connecting a voice call between the first device and the second device.

    Abstract translation: 提供了一种使用各种多媒体服务来支持可视和可听通信的装置和方法。 提供一种在通信系统的服务器中提供使用多媒体服务的通信的方法。 该方法包括从第一设备接收第二设备的语音呼叫连接请求。 该方法还包括向第一设备提供相对于第二设备通过web网络预先生成的视觉多媒体信息。 该方法还包括在第一设备和第二设备之间连接语音呼叫。

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