THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICES AND ELECTRONIC SYSTEMS INCLUDING THE SAME

    公开(公告)号:US20230422523A1

    公开(公告)日:2023-12-28

    申请号:US18180366

    申请日:2023-03-08

    CPC classification number: H10B80/00 H10B43/27

    Abstract: A three-dimensional semiconductor memory device includes a first substrate, a peripheral circuit structure on the first substrate, and a cell array structure on the peripheral circuit structure. The cell array structure includes a stacked structure including gate electrodes extending in a first direction, a source structure on the stacked structure, and a second substrate in contact with the source structure. The source structure includes a first source conductive pattern between the second substrate and the stacked structure and a second source conductive pattern on the first source conductive pattern. The second source conductive pattern includes a first source part between the first source conductive pattern and the second substrate, a source connection part passing through the second substrate and extending in the first direction, and a second source part on the second substrate and connected to the first source part through the source connection part.

    CLOCK GENERATOR FOR REDUCING POWER AND SYSTEM ON CHIP INCLUDING THE SAME

    公开(公告)号:US20220147096A1

    公开(公告)日:2022-05-12

    申请号:US17470535

    申请日:2021-09-09

    Abstract: A system on chip includes: a functional circuit configured to perform a processing operation by receiving a supply voltage; a droop detection circuit configured to monitor the supply voltage and generate a detection signal indicating whether a droop of the supply voltage has occurred; a clock generation circuit configured to output a first clock signal having a first frequency; and a clock modulation circuit configured to receive the detection signal and the first clock signal, and provide a system clock signal to the functional circuit.

    Image display device and method of operating the same

    公开(公告)号:US11183148B2

    公开(公告)日:2021-11-23

    申请号:US16662290

    申请日:2019-10-24

    Abstract: Provided are an image display device and a method of operating the same. The image display device includes a backlight unit configured to emit light towards a display panel. The image display device includes an illuminance sensor configured to obtain illuminance information associated with an area that is external to the image display device. The image display device includes a memory configured to store one or more instructions, and a processor configured to execute the one or more instructions stored in the memory to identify a plurality of backlight control patterns, select a backlight control pattern based on the illuminance information, identify brightness information of a current frame, and adjust the brightness of the backlight unit based on the selected backlight control pattern and the brightness information of the current frame.

    Semiconductor manufacturing apparatus and operating method thereof

    公开(公告)号:US11979973B2

    公开(公告)日:2024-05-07

    申请号:US17163945

    申请日:2021-02-01

    CPC classification number: H05G2/008 H01L21/268 G03F7/70033

    Abstract: Disclosed are semiconductor manufacturing apparatuses and operating methods thereof. The semiconductor manufacturing apparatus includes an oscillation unit that includes a first seed laser, a second seed laser, and a seed module, wherein the first seed laser oscillates a first pulse, and wherein the second seed laser oscillates a second pulse, and an extreme ultraviolet generation unit configured to use the first and second pulses to generate extreme ultraviolet light. The seed module includes a plurality of mirrors configured to allow the first and second pulses to travel along first and second paths, respectively, and a pulse control optical system including a first optical element, a second optical element, and a third optical element. The pulse control optical system is on the second path that does not overlap the first path. The third optical element includes a lens between the first optical element and the second optical element.

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