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Patent Agency Ranking
公开(公告)号：US11778719B2
公开(公告)日：2023-10-03
申请号：US16927050
申请日：2020-07-13
Applicant: Samsung Electronics Co., Ltd.
Inventor： Dohyung Kim , Seongchul Hong , Kyungsik Kang , Insung Kim , Motoshi Sakai , Seulgi Lee , Jungchul Lee
CPC classification number: H05G2/008 , G02B19/0047 , G02B26/0816 , G02B26/0875 , H01S3/0071 , H01S3/2316
Abstract: A laser beam delivery apparatus of an extreme ultra violet light source may include a high power seed module configured to generate a laser beam, a power amplifier configured to amplify the laser beam generated by the high power seed module, a beam transfer module configured to collect and move the laser beam amplified by the power amplifier, a final focusing assembly optical platform configured to adjust focus of the laser beam collected and moved by the beam transfer module, and a focusing unit configured to focus the laser beam with the focus adjusted by the final focusing assembly optical platform to a target droplet. The power amplifier may include a position adjuster configured to adjust a position of the laser beam. The position adjuster may include a refraction plate having a flat surface. The power amplifier may include a pointing adjuster, which may include a mirror.
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公开(公告)号：US11823927B2
公开(公告)日：2023-11-21
申请号：US17229197
申请日：2021-04-13
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kyunghun Han , Ingi Kim , Sangwoo Bae , Jungchul Lee , Minhwan Seo , Myeongock Ko , Youngjoo Lee , Taehyun Kim , Seulgi Lee
CPC classification number: H01L21/67288 , G01N21/41 , G01N21/65 , G01N21/9505 , G02B7/021 , G06T5/20 , G06T7/0004 , G01N2021/653 , G01N2201/06113 , G06T2207/30148
Abstract: A wafer inspection apparatus includes: an objective lens on an optical path of first and second input beams; and an image sensor configured to generate an image of the wafer based on scattered light according to a nonlinear optical phenomenon based on the first and second input beams, wherein the first input beam passing through the objective lens is obliquely incident on the wafer at a first incident angle with respect to a vertical line that is normal to an upper surface of the wafer, the second input beam passing through the objective lens is incident on the wafer at a second incident angle oblique to the vertical line that is normal to the upper surface of the wafer, and the first and second incident angles are different from each other.
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公开(公告)号：US11926954B2
公开(公告)日：2024-03-12
申请号：US17075254
申请日：2020-10-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Seulgi Lee , Youngsu Lee
CPC classification number: D06F58/203 , B01D46/0012 , B01D46/0038 , B01D46/10 , D06F58/04 , D06F58/22 , D06F58/26 , B01D2279/35
Abstract: A clothes dryer including a device and space for fixing a dryer sheet inside a main body. The clothes dryer includes: a main body including a laundry inlet: a drum rotatably installed inside the main body; a discharge flow path configured to discharge inside air of the drum to outside of the drum; and a sheet receiver accommodating a dryer sheet for providing fragrance to inside of the drum, the sheet receiver positioned on the discharge flow path and detachably installed in the main body.
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公开(公告)号：US11823961B2
公开(公告)日：2023-11-21
申请号：US17021087
申请日：2020-09-15
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Eunhee Jeang , Boris Afinogenov , Sangwoo Bae , Wondon Joo , Maksim Riabko , Anton Medvedev , Aleksandr Shorokhov , Anton Sofronov , Ingi Kim , Taehyun Kim , Minhwan Seo , Sangmin Lee , Seulgi Lee
CPC classification number: H01L22/12 , G01N21/648 , G01N21/9505 , H01L21/67288 , G01N2201/06113
Abstract: A substrate inspection apparatus includes a light source unit, a pulsed beam matching unit, a substrate support unit, an incidence angle adjusting unit, and a detecting unit. The light source unit emits a first laser beam having a first wavelength and a second laser beam having a second wavelength. The pulsed beam matching unit matches the first laser beam and the second laser beam to superimpose a pulse of the first laser beam on a pulse of the second laser beam in time and space. The substrate support unit supports a substrate to be inspected. The incidence angle adjusting unit adjusts angles of incidence of the matched first laser beam and second laser beams to irradiate the first laser beam and the second laser beam on the substrate, and mixes the first laser beam and the second laser beam to generate an evanescent wave on the substrate. The evanescent wave generates scattered light due to a defect of the substrate. The detecting unit detects the scattered light generated due to the defect of the substrate.
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公开(公告)号：US20220068681A1
公开(公告)日：2022-03-03
申请号：US17229197
申请日：2021-04-13
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kyunghun Han , Ingi Kim , Sangwoo Bae , Jungchul Lee , Minhwan Seo , Myeongock Ko , Youngjoo Lee , Taehyun Kim , Seulgi Lee
Abstract: A wafer inspection apparatus includes: an objective lens on an optical path of first and second input beams; and an image sensor configured to generate an image of the wafer based on scattered light according to a nonlinear optical phenomenon based on the first and second input beams, wherein the first input beam passing through the objective lens is obliquely incident on the wafer at a first incident angle with respect to a vertical line that is normal to an upper surface of the wafer, the second input beam passing through the objective lens is incident on the wafer at a second incident angle oblique to the vertical line that is normal to the upper surface of the wafer, and the first and second incident angles are different from each other.
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