公开(公告)号：US20220068681A1

公开(公告)日：2022-03-03

申请号：US17229197

申请日：2021-04-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyunghun Han ,  Ingi Kim ,  Sangwoo Bae ,  Jungchul Lee ,  Minhwan Seo ,  Myeongock Ko ,  Youngjoo Lee ,  Taehyun Kim ,  Seulgi Lee

IPC: H01L21/67 ,  G02B7/02 ,  G06T5/20 ,  G06T7/00 ,  G01N21/65 ,  G01N21/41 ,  G01N21/95

Abstract: A wafer inspection apparatus includes: an objective lens on an optical path of first and second input beams; and an image sensor configured to generate an image of the wafer based on scattered light according to a nonlinear optical phenomenon based on the first and second input beams, wherein the first input beam passing through the objective lens is obliquely incident on the wafer at a first incident angle with respect to a vertical line that is normal to an upper surface of the wafer, the second input beam passing through the objective lens is incident on the wafer at a second incident angle oblique to the vertical line that is normal to the upper surface of the wafer, and the first and second incident angles are different from each other.

公开(公告)号：US11823927B2

公开(公告)日：2023-11-21

申请号：US17229197

申请日：2021-04-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyunghun Han ,  Ingi Kim ,  Sangwoo Bae ,  Jungchul Lee ,  Minhwan Seo ,  Myeongock Ko ,  Youngjoo Lee ,  Taehyun Kim ,  Seulgi Lee

IPC: G01J3/14 ,  H01L21/67 ,  G02B7/02 ,  G06T5/20 ,  G06T7/00 ,  G01N21/41 ,  G01N21/95 ,  G01N21/65

CPC classification number: H01L21/67288 ,  G01N21/41 ,  G01N21/65 ,  G01N21/9505 ,  G02B7/021 ,  G06T5/20 ,  G06T7/0004 ,  G01N2021/653 ,  G01N2201/06113 ,  G06T2207/30148

Abstract: A wafer inspection apparatus includes: an objective lens on an optical path of first and second input beams; and an image sensor configured to generate an image of the wafer based on scattered light according to a nonlinear optical phenomenon based on the first and second input beams, wherein the first input beam passing through the objective lens is obliquely incident on the wafer at a first incident angle with respect to a vertical line that is normal to an upper surface of the wafer, the second input beam passing through the objective lens is incident on the wafer at a second incident angle oblique to the vertical line that is normal to the upper surface of the wafer, and the first and second incident angles are different from each other.