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公开(公告)号：US11812547B2
公开(公告)日：2023-11-07
申请号：US17356940
申请日：2021-06-24
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Dongyoon Seo , Sangkeun Kwak , Dohyung Kim , Kyeongseon Park , Hwanwook Park , Wonseop Lee , Daae Heo
CPC classification number: H05K1/0263 , H05K1/0296 , H05K1/142 , H05K2201/10159
Abstract: A memory module including: a first printed circuit board; a first socket and a second socket; and a daisy chain pattern formed in a first region of the first printed circuit board and connected to the first socket and the second socket, wherein an electrical signal on the daisy chain pattern is transferred to a host device when the first socket and the second socket are connected to the host device.
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