公开(公告)号：US11523506B2

公开(公告)日：2022-12-06

申请号：US17345815

申请日：2021-06-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaekwang Lee ,  Dongmin Jang ,  Hwanwook Park ,  Jaeseok Jang ,  Dohyung Kim

IPC: H05K1/14 ,  H05K1/11

Abstract: A module board is provided. The module board includes a plurality of first left terminals and a plurality of first right terminals. Each of the plurality of first left terminals includes a left upper body, a left lower body, and a left lower bar which are connected to one another and sequentially provided, each of the plurality of first right terminals includes a right upper body, a right lower body, and a right lower bar which are connected to one another and sequentially provided, and a first width of each of the left upper body and the right upper body is greater than a second width of each of the left lower bar and the right lower bar.

公开(公告)号：US11758652B2

公开(公告)日：2023-09-12

申请号：US17360417

申请日：2021-06-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dongyoon Seo ,  Geunje Park ,  Dohyung Kim ,  Hwanwook Park ,  Dongmin Jang ,  Jaeseok Jang

IPC: H05K1/11 ,  H05K1/18

CPC classification number: H05K1/111 ,  H05K1/181 ,  H05K2201/09745

Abstract: A printed circuit board (PCB) includes: an insulation substrate; a first pad on the insulation substrate; and a second pad on the insulation substrate and spaced apart from the first pad, wherein the second pad has a size substantially the same as a size of the first pad, wherein the first pad includes a first recess configured to receive a first electrode of a passive element, wherein the second pad includes a second recess receiving a second electrode of the passive element, wherein the first recess has a depth substantially the same as a thickness of the first pad, wherein the second recess has a depth substantially the same as a thickness of the second pad, wherein each of the first recess and the second recess exposes an upper surface of the insulation substrate.